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    • 5. 发明公开
    • HEAT FLOW DISTRIBUTION MEASUREMENT DEVICE
    • VORRICHTUNG ZUR MESSUNG DERWÄRMEFLUSSVERTEILUNG
    • EP3153832A1
    • 2017-04-12
    • EP15804038.6
    • 2015-06-01
    • DENSO CORPORATION
    • SHIRAISHI, YoshihikoSAKAIDA, AtusiGOUKO, NorioTANIGUCHI, ToshihisaOKAMOTO, Keiji
    • G01K17/00G01N25/18H01L35/32H01L35/34
    • G01N25/18G01K17/00H01L35/32H01L35/325H01L35/34
    • A heat flow distribution measurement device includes a sensor module (2) having one multilayer substrate and a plurality of heat flow sensor portions (10) arranged inside of the multilayer substrate. The multilayer substrate has one surface (2a) and another surface (2b) opposite to the one surface and includes a plurality of stacked insulating layers (100, 110, 120) each formed of a thermoplastic resin. The heat flow sensor portions (10) are each formed of thermoelectric conversion elements and are thermoelectrically independent. An arithmetic portion (3) arithmetically determines a heat flow distribution based on an electromotive force generated in each of the heat flow sensor portions (10). The thermoelectric conversion elements are formed in the multilayer substrate and therefore manufactured by the same manufacturing process for manufacturing the multilayer substrate. This can minimize the performance difference between the individual thermoelectric conversion elements and allow the heat flow distribution to be measured with high precision.
    • 热流分布测量装置包括具有一个多层基板的传感器模块(2)和布置在多层基板内部的多个热流传感器部分(10)。 多层基板具有与一个表面相对的一个表面(2a)和另一个表面(2b),并且包括由热塑性树脂形成的多个堆叠的绝缘层(100,110,120)。 热流传感器部分(10)各自由热电转换元件形成,并且是热电独立的。 算术部分(3)基于在每个热流传感器部分(10)中产生的电动势,算术地确定热流分布。 热电转换元件形成在多层基板中,因此通过与多层基板的制造相同的制造工艺制造。 这可以最小化各个热电转换元件之间的性能差异,并允许以高精度测量热流分布。