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1. 发明公开

EP3327514A3 MECHANICAL COMPONENT, TIMEPIECE, MANUFACTURING METHOD OF MECHANICAL COMPONENT, AND MANUFACTURING METHOD OF TIMEPIECE 无效
公开(公告)号：EP3327514A3
公开(公告)日：2018-06-06
申请号：EP17203766.5
申请日：2017-11-27
申请人： Seiko Epson Corporation
发明人： SHIBUYA, Munehiro , FUNAKAWA, Takeo
IPC分类号： G04B13/02 , B81C3/00 , G04D3/00
CPC分类号： G04B13/026 , B81C3/001 , B81C3/005 , B81C2203/037 , G04B13/022 , G04B31/012 , G04D3/0028
摘要： An escape wheel or a mechanical component including an axle member, and a rotation portion having a rim with tooth portions and a holding portion for holding the axle member. The holding portion has a plurality of projection portions formed to project into a through-hole into which the axle member is inserted. An elastic portion extending from between the projection portions adjacent to each other can be provided between the holding portion and the rim portion.

2. 发明公开

EP3110590A1 BAUTEILANORDNUNG MIT MINDESTENS ZWEI BAUTEILEN UND VERFAHREN ZUM HERSTELLEN EINER BAUTEILANORDNUNG 审中-公开
标题翻译：至少有两个组件组件装置及其制造方法部件布置
公开(公告)号：EP3110590A1
公开(公告)日：2017-01-04
申请号：EP15701499.4
申请日：2015-01-16
申请人： Endress + Hauser GmbH + Co. KG.
发明人： THAM, Anh Tuan , LEMKE, Benjamin , BRÄUER, Jörg , BESSER, Jan , WIEMER, Maik , GESSNER, Thomas
IPC分类号： B23K20/16
CPC分类号： G01L9/0044 , B23K20/165 , B23K2201/40 , B81B3/0021 , B81B2201/0264 , B81B2203/0127 , B81C1/00269 , B81C2203/037
摘要： The invention relates to a component arrangement (1) comprising a first component (10) which has a first joining surface (11) and a second component (20) which has a second joining surface (21). The first joining surface (11) is connected to the second joining surface (21) using an integrated reactive material system (30). The integrated reactive material system comprises at least one coating of at least one of the joining surfaces (11), and the integrated material system comprises an activation region (33) on one surface. The activation region (33) is arranged outside of first or second joining surface regions which are joined together and adjoins the regions which are joined together.
摘要翻译： A组分装置，其包括具有第一紧固面和具有第二接合表面的第二部件的第一部件。第一接合表面连接到使用集成反应材料系统的所述第二接合表面，整合式反应材料系统包括接合表面中的至少一个的至少一个涂层，并且所述集成反应性材料系统的激活区的一个表面上包括，集成的激活区域被布置在第一或第二接合面的接合在一起的区域外面并且邻接接合在一起的区域。

3. 发明公开

EP3327514A2 MECHANICAL COMPONENT, TIMEPIECE, MANUFACTURING METHOD OF MECHANICAL COMPONENT, AND MANUFACTURING METHOD OF TIMEPIECE 无效
公开(公告)号：EP3327514A2
公开(公告)日：2018-05-30
申请号：EP17203766.5
申请日：2017-11-27
申请人： Seiko Epson Corporation
发明人： SHIBUYA, Munehiro , FUNAKAWA, Takeo
IPC分类号： G04B13/02 , B81C3/00 , G04D3/00
CPC分类号： G04B13/026 , B81C3/001 , B81C3/005 , B81C2203/037 , G04B13/022 , G04B31/012 , G04D3/0028
摘要： An escape wheel or a mechanical component including an axle member, and a rotation portion having a rim with tooth portions and a holding portion for holding the axle member. The holding portion has a plurality of projection portions formed to project into a through-hole into which the axle member is inserted. An elastic portion extending from between the projection portions adjacent to each other can be provided between the holding portion and the rim portion.

4. 发明公开

EP2216289A4 METHOD FOR THE PRODUCTION OF MICRO/NANOFLUIDIC DEVICES FOR FLOW CONTROL AND RESULTING DEVICE 审中-公开
标题翻译：用于生产微/纳米流体流动控制装置和产生的装置
公开(公告)号：EP2216289A4
公开(公告)日：2012-12-19
申请号：EP07823028
申请日：2007-11-02
申请人： IKERLAN CT DE INVESTIGACIONES TECNOLOGICAS S COOP
发明人： FERNANDEZ LEDESMA LUIS JOSE , TIJERO SERNA MARIA
IPC分类号： B81C3/00 , F16K99/00
CPC分类号： B81C3/001 , B01L3/50273 , B01L3/502738 , B01L3/502746 , B81B2201/054 , B81C2201/0108 , B81C2203/037 , F16K99/0001 , F16K99/0015 , F16K2099/0074 , F16K2099/0094

5. 发明公开

EP3070738A4 THROUGH ELECTRODE AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE USING THROUGH ELECTRODE 有权
标题翻译： THROUGH用于制造多层基板的连续性电极电极AND METHOD
公开(公告)号：EP3070738A4
公开(公告)日：2017-06-21
申请号：EP14861471
申请日：2014-11-10
申请人： TANAKA PRECIOUS METAL IND
发明人： OGASHIWA TOSHINORI , MURAI HIROSHI , KANEHIRA YUKIO
IPC分类号： H01L23/12 , B81B7/00 , B81C1/00 , H01L23/14
CPC分类号： B81C1/00301 , B23K20/023 , B81B7/007 , B81B2207/095 , B81C2203/037 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a through electrode to be mounted on a substrate having a through hole. The through electrode includes: a penetrating part that passes through the through hole; a convex bump part that is formed on at least one end of the penetrating part and is wider than the through electrode; and a metal film that has at least one layer and is formed on a surface of the convex bump part that comes in contact with the substrate. The through electrode part and the convex bump part are formed of a sintered body prepared by sintering one or more kind of metal powder selected from gold, silver, palladium, and platinum having a purity of 99.9 wt% or more and an average particle size of 0.005 µm to 1.0 µm, and the metal film contains gold, silver, palladium, or platinum having a purity of 99.9 wt% or more. The through electrode according to present invention is useful for a circuit board having a multilayer structure, makes it possible to reduce the trace length of an element, such as MEMS, and is also adaptable to hermetic sealing.
摘要翻译：本发明涉及一种通过电极被安装在具有通孔的基板。贯通电极，包括：穿透部分并穿过该通孔; 一个凸包部分没有形成在穿透部分中的至少一个端部，并抵抗比贯通电极; 和金属膜确实具有至少一个层，并且形成所述凸包部分的表面上没有开始与基板接触。贯通电极部和凸包部分形成通过烧结一种或多种类型的金属粉末的从金，银，钯，和具有99.9重量％以上，并且平均粒径的纯度铂制备的烧结体的 0.005微米至1.0微米，并且所述金属影片包含金，银，钯，或铂具有99.9重量％以上的纯度。贯通电极gemäß到本发明对于具有多层结构的电路板是有用的，使得有可能降低的元素，颜色的轨迹长度：诸如MEMS，因此是适用于气密密封。

6. 发明公开

EP3093880A1 SILICON-ON-SAPPHIRE DEVICE WITH MINIMAL THERMAL STRAIN PRELOAD AND ENHANCED STABILITY AT HIGH TEMPERATURE 无效
标题翻译：含基本热膨胀负荷和改进的稳定性高温SOS DEVICE
公开(公告)号：EP3093880A1
公开(公告)日：2016-11-16
申请号：EP16163058.7
申请日：2016-03-30
申请人： Honeywell International Inc.
发明人： BROWN, Gregory C.
IPC分类号： H01L21/762 , B81B3/00
CPC分类号： B81B3/0078 , B81B3/004 , B81B2201/0264 , B81B2203/0127 , B81B2207/094 , B81C1/00904 , B81C2203/037 , G01L9/0055 , H01L21/76254 , H01L21/86
摘要： A silicon-on-sapphire chip with minimal thermal strain preload is provided. The chip includes a sapphire substrate having a first-sapphire surface and an opposing second-sapphire surface; and a silicon layer overlaying the first-sapphire surface. The silicon layer is formed by: creating a plurality of buried cavities in a plane within tens of microns from a first-silicon surface of a silicon wafer; laser fusing the first-silicon surface to the first-sapphire surface at room temperature to attach the silicon wafer to a sapphire wafer; and cleaving the silicon wafer along the plane including the plurality of buried cavities. A silicon-wafer layer is formed from the silicon material between the first-silicon surface and the plane of the plurality of buried cavities. The silicon-wafer layer and the sapphire wafer form a silicon-on-sapphire wafer. The silicon-on-sapphire chip is formed by dicing the silicon-on-sapphire wafer.
摘要翻译：本发明提供一种硅 - 蓝宝石上芯片具有最小的热应变的预载荷。该芯片包括具有第一蓝宝石表面和相对的第二蓝宝石表面的蓝宝石衬底; 和硅层覆盖所述第一蓝宝石表面。硅树脂层通过以下步骤形成：在几十从硅晶片的第一有机硅表面微米内的平面创建掩埋腔体的多元性; 激光熔接第一硅表面到第一表面的蓝宝石在室温下附着在硅晶片的蓝宝石晶片; 和切割沿平面包括掩埋空腔的多个硅晶片。甲硅晶片层从第一硅表面和埋入腔的多个平面之间的硅材料形成。硅晶片层和蓝宝石晶片形成硅 - 蓝宝石晶片。硅 - 蓝宝石上芯片通过切割硅 - 蓝宝石晶片形成。

7. 发明公开

EP3070738A1 THROUGH ELECTRODE AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE USING THROUGH ELECTRODE 有权
标题翻译： THROUGH用于制造多层基板的连续性电极电极AND METHOD
公开(公告)号：EP3070738A1
公开(公告)日：2016-09-21
申请号：EP14861471.2
申请日：2014-11-10
申请人： Tanaka Kikinzoku Kogyo K.K.
发明人： OGASHIWA, Toshinori , Murai, Hiroshi , KANEHIRA, Yukio
IPC分类号： H01L23/12 , B81B7/00 , B81C1/00 , H01L23/14
CPC分类号： B81C1/00301 , B23K20/023 , B81B7/007 , B81B2207/095 , B81C2203/037 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a through electrode to be mounted on a substrate having a through hole. The through electrode includes: a penetrating part that passes through the through hole; a convex bump part that is formed on at least one end of the penetrating part and is wider than the through electrode; and a metal film that has at least one layer and is formed on a surface of the convex bump part that comes in contact with the substrate. The through electrode part and the convex bump part are formed of a sintered body prepared by sintering one or more kind of metal powder selected from gold, silver, palladium, and platinum having a purity of 99.9 wt% or more and an average particle size of 0.005 µm to 1.0 µm, and the metal film contains gold, silver, palladium, or platinum having a purity of 99.9 wt% or more. The through electrode according to present invention is useful for a circuit board having a multilayer structure, makes it possible to reduce the trace length of an element, such as MEMS, and is also adaptable to hermetic sealing.

8. 发明公开

EP3213100A4 LID AND METHOD FOR SEALING A NON-MAGNETIC PACKAGE 有权
公开(公告)号：EP3213100A4
公开(公告)日：2018-06-06
申请号：EP15854648
申请日：2015-10-27
申请人： GEN ELECTRIC
发明人： KAPUSTA CHRISTOPHER , AIMI MARCO
IPC分类号： G01R33/28 , B81C1/00 , G01R33/20
CPC分类号： C23C28/023 , B23K1/0016 , B23K35/0222 , B23K35/262 , B23K35/3013 , B23K2201/40 , B81C1/00269 , B81C2201/013 , B81C2203/0109 , B81C2203/019 , B81C2203/037 , C23C14/025 , C23C14/165 , C23C14/3414 , C23C14/58 , C23C28/021 , C23F1/00 , C23F4/00 , C25D3/50 , C25D7/123
摘要： A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.

9. 发明公开

EP3263517A1 MEMS DEVICE FORMED BY AT LEAST TWO BONDED STRUCTURAL LAYERS AND MANUFACTURING PROCESS THEREOF 审中-公开
标题翻译：至少两层粘结结构层形成的MEMS器件及其制造工艺
公开(公告)号：EP3263517A1
公开(公告)日：2018-01-03
申请号：EP16206887.8
申请日：2016-12-23
申请人： STMicroelectronics S.r.l.
发明人： ALLEGATO, Giorgio , OGGIONI, Laura , GARAVAGLIA, Matteo , SOMASCHINI, Roberto
IPC分类号： B81C1/00
CPC分类号： B81C1/00269 , B81B3/0097 , B81B2201/0242 , B81B2201/0264 , B81B2201/042 , B81B2203/0315 , B81C3/001 , B81C2201/019 , B81C2203/0118 , B81C2203/019 , B81C2203/037
摘要： A microelectromechanical device having a first substrate (330) of semiconductor material and a second substrate (340) of semiconductor material having a bonding recess (331) delimited by projecting portions (334), monolithic therewith. The bonding recess forms a closed cavity (324) with the first substrate. A bonding structure (336) is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure (345) is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
摘要翻译：一种具有半导体材料的第一衬底（330）和半导体材料的第二衬底（340）的微机电装置，该半导体材料具有由与其整体形成的突出部分（334）限定的键合凹槽（331）。结合凹部与第一衬底形成封闭空腔（324）。接合结构（336）布置在封闭的空腔内并且接合到第一和第二基板。微电子机械结构（345）形成在第一和第二衬底之间选择的衬底中。该器件通过在第一晶片中形成键合凹槽来制造; 将结合物质沉积在结合凹部中，结合物质具有比结合凹部更大的深度; 并粘合两个晶片。

10. 发明公开

EP3040723A4 BIOCHIP SUPPORT MEMBER, METHOD FOR MANUFACTURING BIOCHIP SUPPORT MEMBER, BIOCHIP PACKAGE, SCREENING DEVICE, AND SCREENING METHOD 审中-公开
标题翻译： BIOCHIPTRÄGERELEMENT，VERFAHREN ZUR HERSTELLUNG DESBIOCHIPTRÄGERELEMENTS，BIOCHIPVERPACKUNG，SCREENING-VORRICHTUNG UND SCREENING-VERFAHREN
公开(公告)号：EP3040723A4
公开(公告)日：2017-07-12
申请号：EP14840291
申请日：2014-07-31
申请人： NIPPON KOGAKU KK
发明人： ISAMI TADAO , HAYASHI YUTAKA , UEDA TAKEHIKO
IPC分类号： G01N33/53 , B01L3/00 , B23K20/10 , G01N37/00
CPC分类号： B01L9/52 , B01J2219/00509 , B01J2219/00529 , B01J2219/00621 , B01J2219/00662 , B01L3/5085 , B01L3/50853 , B01L2200/025 , B01L2200/12 , B01L2300/0609 , B01L2300/0636 , B01L2300/0654 , B01L2300/0809 , B01L2300/0819 , B01L2300/0848 , B23K20/10 , B29C65/08 , B29C66/112 , B29C66/114 , B29C66/24221 , B29C66/30223 , B29C66/474 , B29C66/5346 , B29C66/71 , B29C66/73366 , B29C66/73921 , B29C66/8322 , B29C66/8432 , B29L2031/756 , B81B2201/0214 , B81C3/001 , B81C2203/037 , G01N33/54366 , B29K2033/12 , B29K2069/00 , B29K2023/38 , B29K2025/06
摘要： A biochip support member is provided that comprises a base material, and a columnar member different member from the base material having a support area that can support a biochip formed of a biomolecule provided at one end, and is attached to the base material through an attaching part at the other end.
摘要翻译：本发明提供一种生物芯片支撑部件，该生物芯片支撑部件具备基材和与基材不同的部件，该基材具有支撑区域，该支撑区域能够支撑由一端设置的生物分子形成的生物芯片，并且通过附着而附着于基材部分在另一端。

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