会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明公开
    • Vibration transducer and its manufacturing method
    • Schwingungstransducer和Herstellungsverfahrendafür
    • EP2428783A1
    • 2012-03-14
    • EP11180829.1
    • 2011-09-09
    • Yokogawa Electric Corporation
    • Yoshida, Takashi
    • G01L1/10G01L9/00
    • G01L9/0019B81B3/001B81B2201/025B81B2201/0264B81B2201/0285B81B2203/0118G01L1/106G01L9/0013H03H9/2457H03H2009/02496
    • A vibration transducer includes a silicon single crystal vibration beam provided over a silicon single crystal substrate, the vibration beam having a sectional shape that is longer in a direction perpendicular to a surface of the silicon single crystal substrate than in a direction parallel with it, a shell made of silicon, surrounding the vibration beam with a gap, and forming a vacuum room together with the silicon single crystal substrate, a plate-like first electrode plate disposed parallel with the surface of the silicon single crystal substrate, the first electrode plate having one end connected to the vibration beam, plate-like second and third electrode plates disposed parallel with the surface of the silicon single crystal substrate so as to be opposed to each other with the vibration beam interposed in between, and asperities formed on confronting side surfaces of the vibration beam and the second and third electrode plates.
    • 振动传感器包括设置在硅单晶衬底上的硅单晶振动束,所述振动束具有在与所述硅单晶衬底的表面垂直的方向上比在与其平行的方向上更长的截面形状, 由硅制成的外壳围绕着具有间隙的振动梁,与硅单晶基板一起形成真空室,与硅单晶基板的表面平行设置的板状的第一电极板,第一电极板具有 一端与振动束连接,板状的第二和第三电极板与硅单晶基板的表面平行设置,以便将振动光束插入其间彼此相对,并且形成在相对侧面上的凹凸 的振动束和第二和第三电极板。
    • 8. 发明公开
    • METHOD OF MAKING DIMPLE STRUCTURE FOR PREVENTION OF MEMS DEVICE STICTION
    • Herstellungsverfahren von Ausnehmungsstukturen zur Vermeidung der Haftreibung in einem MEMS-Bauteil。
    • EP1857406A2
    • 2007-11-21
    • EP07108010.5
    • 2007-05-11
    • Honeywell International Inc.
    • Yang, Ken L.Yu, Lianzhong
    • B81C1/00
    • B81B3/001
    • A MEMS device having a proof mass (10) resiliently mounted above a substrate (12) has projections (18) formed on adjacent surfaces of the mass (10) and substrate (12). The device is formed by creating a plurality of holes (34) in the upper layer (30). A substance suitable for removing the intermediate layer (32) without substantially removing the upper layer (30) and substrate (12) is introduced through the holes (34). A substance removing the upper layer (30), the substrate (12), or both, is then introduced through the holes (34) to remove a small amount of the substrate (12) and upper layer (30). Portions of the intermediate layer (32) between the projections (18) are then removed. The dimple structure fabricated from this process will prevent MEMS device stiction both in its final release and device operation.
    • 具有弹性地安装在基板(12)上方的证明物质(10)的MEMS装置具有形成在质量块(10)和基底(12)的相邻表面上的突起(18)。 该装置通过在上层(30)中形成多个孔(34)而形成。 通过孔(34)引入适合于去除中间层(32)而不基本上除去上层(30)和基材(12)的物质。 然后通过孔(34)将去除上层(30),基板(12)或两者的物质引入以除去少量的基板(12)和上层(30)。 然后去除突起(18)之间的中间层(32)的部分。 通过该工艺制造的凹坑结构将在最终的释放和器件操作过程中阻止MEMS器件的粘滞。