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1. 发明公开

EP3159669A1 INTEGRATING DIVERSE SENSORS IN A SINGLE SEMICONDUCTOR DEVICE 有权
标题翻译：在单个半导体器件中集成不同的传感器
公开(公告)号：EP3159669A1
公开(公告)日：2017-04-26
申请号：EP16189745.9
申请日：2016-09-20
申请人： NXP USA, Inc.
发明人： Liu, Lianjun , Monk, David
IPC分类号： G01L19/00 , B81C1/00
CPC分类号： B81B7/007 , B81B2201/025 , B81C1/00301 , B81C1/00817 , G01L9/0042 , G01L9/0073 , H01L43/02 , H01L43/12
摘要： In some embodiments a method of manufacturing a sensor system can comprise forming a first structure having a substrate layer (28) and a first sensor (30,32,34) that is positioned on a first side of the substrate layer, bonding a cap structure (24) over the first sensor on the first side of the substrate layer, and depositing a first dielectric layer (131) over the cap structure. After bonding the cap structure and depositing the first dielectric layer, a second sensor (124,126,128) is fabricated on the first dielectric layer. The second sensor includes material that would be adversely affected at a temperature that is used to bond the cap structure to the first side of the substrate layer.
摘要翻译：在一些实施例中，制造传感器系统的方法可包括形成具有衬底层（28）和位于衬底层的第一侧上的第一传感器（30,32,34）的第一结构，将帽结构（24）在所述衬底层的所述第一侧上的所述第一传感器上，并且在所述帽结构上方沉积第一电介质层（131）。在结合帽结构并沉积第一介电层之后，在第一介电层上制造第二传感器（124,126,128）。第二传感器包括在用于将帽结构粘合到基底层的第一侧的温度下会受到不利影响的材料。

2. 发明授权

EP1657553B1 Method of manufacturing an external force detection sensor 有权
标题翻译：一种用于生产传感器，用于检测所述外力大小的方法
公开(公告)号：EP1657553B1
公开(公告)日：2016-08-31
申请号：EP06001027.9
申请日：2000-04-14
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Oguchi, Takahiro, (A170) Intell., Prop., Dept.
IPC分类号： G01P15/08
CPC分类号： G01C19/5719 , B81B2201/025 , B81C1/00579 , B81C1/00587 , B81C2201/0132 , B81C2201/014 , G01P15/0802 , G01P15/125 , G01P2015/0814 , Y10S148/012 , Y10S148/135 , Y10S148/159

3. 发明授权

EP2727132B1 HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS 有权
标题翻译：密封MEMS器件与垂直集成电子元件的杰出PART
公开(公告)号：EP2727132B1
公开(公告)日：2016-02-03
申请号：EP12805169.5
申请日：2012-06-29
申请人： InvenSense, Inc.
发明人： SEEGER, Joseph , TCHERTKOV, Igor , AKYOL, Hasan , YARALIOGLU, Goksen, G. , NASIRI, Steven, S. , GURIN, Ilya
IPC分类号： H01L21/00 , G01F1/20
CPC分类号： B81B7/02 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81C1/00246 , B81C2203/0771 , G01L1/144 , G01L1/148 , G01L5/0028 , G01L9/0072 , G01L15/00 , G01L19/0092 , G01L19/0636 , G01L19/148 , G01L27/007

4. 发明授权

EP2455331B1 Systems and methods for a three-layer chip-scale MEMS device 有权
标题翻译：在芯片尺寸为三层MEMS器件的系统和方法
公开(公告)号：EP2455331B1
公开(公告)日：2014-06-18
申请号：EP11190203.7
申请日：2011-11-22
申请人： Honeywell International, Inc.
发明人： Horning, Robert D. , Supino, Ryan
IPC分类号： H01L21/768 , H01L25/065
CPC分类号： H01L29/84 , B81B7/0032 , B81B7/0038 , B81B7/0074 , B81B7/0077 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81C2201/019 , H01L2224/48091 , H01L2924/00014
摘要： Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

5. 发明公开

EP2455327A2 A mems vertical comb structure with linear drive / pickoff 有权转让
标题翻译： Vertikale MEMS-Kammstruktur mit linearem Antrieb / linearer Aufnahme
公开(公告)号：EP2455327A2
公开(公告)日：2012-05-23
申请号：EP11190200.3
申请日：2011-11-22
申请人： Honeywell International, Inc.
发明人： Horning, Robert D. , Supino, Ryan
IPC分类号： B81B3/00
CPC分类号： B81B3/0086 , B81B2201/025 , B81B2203/0136 , Y10T29/49117
摘要： A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs. The proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one anchor having a second plurality of combs. The anchor is coupled to the substrate such that the anchor and second plurality of combs are fixed in position relative to the substrate. The first plurality of combs are interleaved with the second plurality of combs. Each of the combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that capacitance between the combs varies approximately linearly with displacement of the movable combs in an out-of-plane direction.
摘要翻译： MEMS传感器包括基板和至少一个具有第一多个梳子的检测质量块。检测质量块经由一个或多个悬架梁耦合到基板，使得检验质量块和第一多个梳子可移动。 MEMS传感器还包括具有第二多个梳子的至少一个锚固件。锚固件联接到基板，使得锚固件和第二多个梳子相对于基板固定在适当位置。第一组多个梳子与第二组梳子交错。每个梳子包括通过一个或多个非导电层彼此电隔离的多个导电层。每个导电层单独地耦合到相应的电位，使得梳子之间的电容随着可移动梳齿在面外方向上的位移而近似线性地变化。

6. 发明公开

EP2048109A3 Electronic device, electronic module, and methods for manufacturing the same 审中-公开
标题翻译：一种电子装置，电子系统和用于它们的制备方法
公开(公告)号：EP2048109A3
公开(公告)日：2011-05-25
申请号：EP08017806.4
申请日：2008-10-10
申请人： Epson Toyocom Corporation
发明人： Ono, Atsushi , Kobayashi, Yoshihiro , Kitamura, Shojiro , Matsunaga, Masayuki , Hara, Akitoshi
IPC分类号： B81B7/00
CPC分类号： B81B7/007 , B81B7/0074 , B81B2201/025 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2924/15156 , H01L2924/15313 , H01L2924/16195 , Y10T29/49155 , H01L2924/00014
摘要： An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface and electrically coupled to the electric element.

7. 发明公开

EP2187168A1 INERTIA FORCE SENSOR 审中-公开
标题翻译：惯性力传感器
公开(公告)号：EP2187168A1
公开(公告)日：2010-05-19
申请号：EP08790513.9
申请日：2008-08-29
申请人： Panasonic Corporation
发明人： OHKOSHI, Hideo , MITANI, Tomohiro
IPC分类号： G01C19/56 , G01P9/04 , G01P15/08
CPC分类号： G01P1/003 , B81B7/0058 , B81B2201/025 , B81C1/0023 , G01C19/5607 , G01P1/023 , H01L2224/48091 , H01L2924/00014
摘要： An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).
摘要翻译：惯性传感器包括振荡型角速度传感元件（32），用于处理从角速度传感元件（32）提供的信号的IC（34），用于处理信号的电容器（36）以及用于适应角速度传感的封装（38）元件（32），IC（34），电容器（36）。元件（32）和IC（34）通过隔振器容纳在封装（38）中，该隔振器由其上放置有IC（34）的TAB带（46），板（40）形成，其中角速度感测元件 32）层叠在IC（34）上，外框架（44）放置在外部并与板（40）分开，并通过布线图形（42）与平板（40）连接。

8. 发明公开

EP1953816A1 SENSOR DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译： SENSORANORDNUNG UND VERFAHREN ZU IHRER HERSTELLUNG
公开(公告)号：EP1953816A1
公开(公告)日：2008-08-06
申请号：EP06833259.2
申请日：2006-11-24
申请人： MATSUSHITA ELECTRIC WORKS, LTD.
发明人： OKUDO, Takafumi , SUZUKI, Yuji , TAKEGAWA, Yoshiyuki , BABA, Toru , GOTOU, Kouji , MIYAJIMA, Hisakazu , KATAOKA, Kazushi , SAIJO, Takashi
IPC分类号： H01L23/02 , G01P9/04
CPC分类号： G01P15/0802 , B81B7/0051 , B81B7/0064 , B81B2201/025 , B81C2203/038 , G01C19/5719 , G01P1/023 , G01P15/125 , H01L2924/0002 , H01L2924/00
摘要： A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.
摘要翻译：提供了一种传感器装置，传感器特性变化小，电噪声提高。该传感器装置具有传感器单元，该传感器单元设置有具有开口的框架，保持在开口中的可移动部分可相对于框架移动;以及检测部分，用于根据可移动的位移位移输出电信号部分，以及由半导体材料制成的封装衬底，并结合到传感器单元的表面。封装基板在面向传感器单元的表面上具有电绝缘膜。通过在室温下在电绝缘膜的活化表面和传感器单元的活化表面之间形成直接接合，将封装基板结合到传感器单元。

9. 发明授权

EP1721173B1 FORCE SENSOR 有权
标题翻译：功率传感器
公开(公告)号：EP1721173B1
公开(公告)日：2008-05-07
申请号：EP04804166.9
申请日：2004-12-22
申请人： ETH Zürich
发明人： HIEROLD, Christopher , JUNGEN, Alain , STAMPFER, Christoph
IPC分类号： G01P15/08 , G01P15/12 , G01L1/22
CPC分类号： B81B3/0021 , B81B2201/025 , B82Y15/00 , B82Y30/00 , G01L1/005 , G01P15/123 , Y10S977/724 , Y10S977/953 , Y10S977/956
摘要： The resolution and the signal-to-noise ration of known force sensors as e.g. capacitive force sensors decrease when scaling them down. To solve this problem there is a solution presented by the usage of a nanostructure as e.g. a carbo nanotube, which is mechanically deformed by a force to be measured. The proposed force sensors comprises a support with two arms carrying the carbon nanotube. The main advantage of this force sensor is a very high sensitivity as the conductance of carbon nanotubes changes several orders of magnitude when a mechanical deformation arises.

10. 发明公开

EP1760039A2 Electrical contact for a mems device and method of making 无效
标题翻译： Elektrischer Kontaktfürein MEMS-Bauelement und dessen Herstellungsverfahren
公开(公告)号：EP1760039A2
公开(公告)日：2007-03-07
申请号：EP06076605.2
申请日：2006-08-21
申请人： Delphi Technologies, Inc.
发明人： Christenson, John C.
IPC分类号： B81C5/00
CPC分类号： B81B7/0006 , B81B2201/025 , G01P15/0802 , G01P15/125
摘要： A method for making a subsurface electrical contact (34) on a micro-electrical-mechanical-systems (MEMS) device (10). The contact (34) is formed by depositing a layer of polycrystalline silicon (34) onto a surface (16) within a cavity (20) buried under a device silicon layer (24). The polycrystalline silicon layer (34) is deposited in the cavity (20) through holes (30 and 32) etched through the device silicon (24) and reseals the cavity (20) during the polycrystalline silicon deposition step. The polycrystalline silicon layer (24) can then be masked and etched, or etched back to expose the device layer (24) of the micromachined device (10). Through the layer of polycrystalline silicon (34), a center hub (18) of the device (10) may be electrically contacted.
摘要翻译：一种用于在微电子机械系统（MEMS）装置（10）上制造地下电接触（34）的方法。通过将多晶硅层（34）沉积在掩埋在器件硅层（24）下面的空腔（20）内的表面（16）上来形成触点（34）。多晶硅层（34）通过穿过器件硅（24）蚀刻的孔（30和32）沉积在空腔（20）中，并且在多晶硅沉积步骤期间重新密封空腔（20）。然后可以对多晶硅层（24）进行掩模和蚀刻，或者回蚀刻以暴露微机械加工装置（10）的装置层（24）。通过多晶硅层34，可以使器件（10）的中心毂（18）电接触。

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