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    • 4. 发明公开
    • PROCEDE DE FABRICATION D'UN BAIN ELECTROLYTIQUE POUR LA REALISATION D'UNE SOUS-COUCHE METALLIQUE A BASE DE PLATINE SUR UN SUBSTRAT METALLIQUE
    • 用于生产铂系金属实施情况的电镀浴AT层上的金属衬底
    • EP2839059A1
    • 2015-02-25
    • EP13722499.4
    • 2013-04-18
    • Snecma
    • HUGOT, JulietteLAGRANGE, FrédéricMOLET, Hervé
    • C25D3/50C25D3/52C25D5/34
    • C25D3/52C25D3/50C25D5/34
    • The invention relates to a process for manufacturing an electrolytic bath for the production of a platinum-based metallic sublayer on a metallic substrate, which comprises the following steps: a) a first system comprising ligands and amine functional groups is provided, said first system consisting of an aqueous solution with amine ligand comprising at least one compound X-(NH
      2 )
      n , with X belonging to the group consisting of (CH
      3 , CH
      3 -CH
      2 , CH
      3 -(CH
      2 )
      m ), or NH
      3 or a salt x
      P- (NH
      4 )
      +
      p with x an acid radical belonging to the group consisting of (PO
      4
      3- , HPO
      4
      2- , H
      2 PO
      4
      - HPO
      4
      2- and H
      2 PO
      4
      - , SO
      4
      2- , HSO
      4
      - , CH
      3 COO
      - ), n, m and p being non‑zero integers, b) a second system that forms a buffer system is provided, c) a third system that provides a metal salt and consists of an aqueous solution with platinum is provided, d) a fourth system that makes it possible to impart the conductive property to the medium is provided, e) the four systems are mixed, by means of which said electrolytic bath is obtained. The first system, the third system and the fourth system are grouped together as a single first solution denoted by B; during step c), the third system forms a second solution denoted by A, consisting of an aqueous solution with platinum IV and comprising sodium hydroxide (NaOH). During step e), the following sub‑steps are carried out: e1) the first solution B is covered and its temperature is brought to 50°C minimum for at least 1 h 30 min, e2) the second solution A is added to the first solution B in order to form an electrolytic bath which comprises an amine platinum complex. Application to the manufacture of a metallic sublayer for a thermal barrier on a part made of a superalloy.
    • 本发明涉及一种制造电解液的浴上的金属基底电镀基于铂的金属底层,所述方法包括以下步骤的方法:a)提供具有配体和胺官能团的第一系统,所述第一系统被构成 通过在氨基配体,其包含至少一种化合物X-(NH 2)n,其中X属于由(CH 3,CH 3 CH 2,CH 3(CH 2)M),或NH 3或XP(组成的组的溶液wässrige NH 4)+ p盐其中x是(上酸根属于由PO43-,HPO42-,H2PO4-,HPO 4 2-和H2PO4-,SO42-,HSO4-,H 2 SO 4,HSO 4 - ,H 2 SO 4和,CH3COO-构成的基团, CH3COOH,和CH 3 COO - ),或H 2 SO 4,CH 3 COOH或,且其中n,m和p是非零的整数; b)提供第二系统形成缓冲系统; c)提供第三系统提供金属的盐,并通过在铂的wässrige溶液构成; d)提供适于赋予传导属性到所述介质的第四系统; 和e)的四个系统混合在一起,以便获得所述电解质浴。 该方法适用于电镀金属底层上制成超级合金的一部分的热障。