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1. 发明授权

EP1884994B1 Semiconductor device and method of manufacturing the same 有权
公开(公告)号：EP1884994B1
公开(公告)日：2018-10-10
申请号：EP07015307.7
申请日：2007-08-03
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Murayama, Kei , Taguchi, Yuichi , Koizumi, Naoyuki , Sunohara, Masahiro , Shiraishi, Akinori , Higashi, Mitsutoshi
IPC分类号： H01L23/498 , H01L23/13 , H01L23/14 , H01L23/055 , B81C1/00
CPC分类号： H01L23/055 , B81B2207/012 , B81C1/0023 , H01L23/13 , H01L23/147 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16195 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device includes a laminated substrate (104; 204) formed by laminating a plurality of semiconductor substrates (101, 103; 201, 203), a concave part (103B; 208) formed in the laminated substrate, and a semiconductor element (109; 211, 213) mounted in the concave part. A method of manufacturing a semiconductor device includes a first step of forming a laminated substrate by laminating a plurality of semiconductor substrates, a second step of forming a concave part by etching the laminated substrate, and a third step of mounting a semiconductor element in the concave part.

2. 发明授权

EP1821345B1 Light-emitting device and method for manufacturing the same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：EP1821345B1
公开(公告)日：2016-07-13
申请号：EP07003322.0
申请日：2007-02-16
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Higashi, Mitsutoshi , Sunohara, Masahiro , Taguchi, Yuichi , Shiraishi, Akinori , Murayama, Kei , Koizumi, Naoyuki , Sakaguchi, Hideaki
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L33/62 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , Y10T29/49002 , Y10T83/04 , H01L2224/05599

3. 发明授权

EP2023699B1 Heat radiation package with semiconductor device 有权
标题翻译：热辐射封装半导体器件
公开(公告)号：EP2023699B1
公开(公告)日：2015-07-08
申请号：EP08161925.6
申请日：2008-08-06
申请人： Shinko Electric Industries Co., Ltd.
发明人： Shiraishi, Akinori , Murayama, Kei , Taguchi, Yuichi , Sunohara, Masahiro , Higashi, Mitsutoshi
IPC分类号： H05K3/10 , H01L33/48 , H05K1/02 , H01L23/498 , H05K3/00 , H05K1/03 , H01L33/64 , H01L33/62 , H01L23/373
CPC分类号： H05K3/107 , H01L23/3735 , H01L23/49861 , H01L33/483 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/16 , H05K1/0203 , H05K1/0263 , H05K1/0306 , H05K3/0061 , H05K3/108 , H05K2201/10106

4. 发明授权

EP1806792B1 Light emitting device and manufacturing method thereof 有权
标题翻译：一种发光器件及其制造方法
公开(公告)号：EP1806792B1
公开(公告)日：2013-07-24
申请号：EP06256575.9
申请日：2006-12-22
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Taguchi, Yuichi , Sakaguchi, Hideaki , Koizumi, Naoyuki , Higashi, Mitsutoshi , Shiraishi, Akinori , Sunohara, Masahiro , Murayama, Kei
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014

5. 发明公开

EP1848044A3 Semiconductor device and seconductor device fabrication method 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：EP1848044A3
公开(公告)日：2012-12-19
申请号：EP07008012.2
申请日：2007-04-19
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Higashi, Mitsutoshi , Murayama, Kei , Shiraishi, Akinori , Taguchi, Yuichi
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L24/73 , H01L24/97 , H01L33/62 , H01L33/64 , H01L33/647 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/15787 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/92247
摘要： There is provided a semiconductor device in which a light emitting element (107) is mounted on a substrate (101, 101a), having a bonding wire (104) which is connected to the light emitting element, and a through electrode (103) which is connected to the bonding wire and is formed in such a manner as to pass through the substrate at a position lying directly below a connecting portion with the bonding wire.

6. 发明公开

EP2045840A3 Wiring board with guard ring 有权
标题翻译： PCB与保护环
公开(公告)号：EP2045840A3
公开(公告)日：2012-01-11
申请号：EP08165654.8
申请日：2008-10-01
申请人： Shinko Electric Industries Co., Ltd. , Asahi Kasei Microdevices Corporation
发明人： Murayama, Kei , Nakajima, Shinji
IPC分类号： H01L23/58 , H01L23/62 , H01L23/60 , H01L25/16 , H01L23/48
CPC分类号： H01L23/585 , H01L23/481 , H01L23/60 , H01L23/62 , H01L25/16 , H01L2224/16225 , H01L2225/06527
摘要： There is provided a wiring board 10. The wiring board 10 includes: a semiconductor substrate 17 having a through hole 32 and covered with an insulating film 18; a through electrode 21 formed in the through hole 32; a first wiring 26 connected to one end of the through electrode 21; and a second wiring 28 connected to the other end of the through electrode 21. The semiconductor substrate 17 includes: a semiconductor element and a first guard ring 24 formed to surround the through hole 32. The semiconductor clement includes a first conductivity-type impurity diffusion layer 35 having a different conductivity-type from that of the semiconductor substrate and is electrically connected to the first wiring 26 and the second wiring 28.

7. 发明公开

EP2058623A2 Method and apparatus for measuring a bump on a substrate 审中-公开
标题翻译： Verfahren und Vorrichtung zum Messen einer Beule auf einem Substrat
公开(公告)号：EP2058623A2
公开(公告)日：2009-05-13
申请号：EP09002532.1
申请日：2001-06-12
申请人： Shinko Electric Industries Co., Ltd.
发明人： Murayama, Kei , Mitsutoshi, Higashi
IPC分类号： G01B15/02
CPC分类号： G01B15/02 , H01L24/11 , H01L24/13 , H01L2224/117 , H01L2224/13022 , H01L2224/131 , H01L2224/13111 , H01L2924/01082 , H01L2924/00014 , H01L2924/01047 , H01L2924/014
摘要： A method for measuring heights of first and second bumps formed on first and second surfaces, respectively, of a work of substrate in which materials of the first and second bumps are different from each other, a planar arrangement of the first bumps being the same as that of the second bumps. The method comprises irradiating at least two kinds of X-rays having different wavelengths toward the materials constituting the first and second bumps, respectively, and detecting first and second linear absorption coefficients of the X-rays; memorizing the first and second linear absorption coefficients of the X-rays as known data; and irradiating the to kinds of X-rays toward the first and second works respectively, and detecting the first and second X-ray transmitted intensities at a position on which the first and second bumps are formed; and determining the heights of the first and second bumps from the first and second X-ray transmitted intensities on the basis of the known data.
摘要翻译：一种用于测量在第一和第二凸块的材料彼此不同的基板的工件的第一和第二表面上分别形成的第一和第二凸块的高度的方法，第一凸块的平面布置与第二个颠簸的。该方法包括分别向构成第一和第二凸块的材料照射具有不同波长的至少两种X射线，并检测X射线的第一和第二线性吸收系数; 记录X射线的第一和第二线性吸收系数作为已知数据; 并且分别向所述第一和第二工件照射各种X射线，并且在形成有所述第一和第二凸块的位置处检测所述第一和第二X射线透射强度; 以及基于已知数据从第一和第二X射线透射强度确定第一和第二凸起的高度。

8. 发明公开

EP2048711A2 Semiconductor package and manufacturing method thereof 审中-公开
标题翻译： Halbleiterpaket和Herstellungsverfahrendafür
公开(公告)号：EP2048711A2
公开(公告)日：2009-04-15
申请号：EP08166387.4
申请日：2008-10-10
申请人： Shinko Electric Industries Co., Ltd.
发明人： Taguchi, Yuichi , Shiraishi, Akinori , Sunohara, Masahiro , Murayama, Kei , Sakaguchi, Hideaki , Higashi, Mitsutoshi
IPC分类号： H01L23/12
CPC分类号： H01L23/12 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/10253 , H01L2924/1461 , H01L2924/19107 , H01L2924/00
摘要： A semiconductor package 40 including a base body 10a having a recessed portion 16 for installing an electronic component on one surface, the recessed portion 16 including an inner bottom surface 16a, inclined surface and a shoulder part 16c and a wiring pattern 21 having one end positioned in the inner bottom surface 16a of the recessed portion 16 and the other end extending to an outside region of the recessed portion 16 beyond the shoulder part 16c of the recessed portion 16. The shoulder part 16c of the recessed portion 16 is a smoothly curved surface.
摘要翻译：一种半导体封装件40，包括具有用于在一个表面上安装电子部件的凹部16的基体10a，包括内底面16a，倾斜面和肩部16c的凹部16以及具有一端的布线图案21 在凹部16的内底面16a中，另一端延伸到凹部16的肩部16c以外的凹部16的外侧区域。凹部16的肩部16c是平滑的曲面。

9. 发明公开

EP1926153A3 Lighting apparatus 有权
标题翻译：照明器具
公开(公告)号：EP1926153A3
公开(公告)日：2009-03-11
申请号：EP07022963.8
申请日：2007-11-27
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Higashi, Mitsutoshi , Murayama, Kei , Taguchi, Yuichi , Sunohara, Masahiro , Shiraishi, Akinori
IPC分类号： H01L33/00 , F21K7/00 , F21V11/16 , F21Y101/02
CPC分类号： F21V11/16 , F21K9/00 , F21Y2115/10 , H01L33/58 , H01L33/60 , H01L2224/16225 , H01L2924/16195
摘要： It is a lighting apparatus 10 that has a light emitting element 16, a light emitting element housing 15 having a concave portion 28 that accommodates the light emitting element 16, and an optically transparent member 18 that airproofs a space B formed by the concave portion 28 and transmits light emitted from the light emitting element 16. The concave portion 28 is shaped to become wider toward the optically transparent member 18 from the bottom surface 28A of the concave portion 28. The lighting apparatus 10 is provided with a light shielding member 12 for shielding a part of light emitted from the light emitting element 16 is provided on the optically transparent member 18.
摘要翻译：发光装置10具有发光元件16，具有收纳发光元件16的凹部28的发光元件收纳部15以及对由凹部28形成的空间B进行密封的光学透明部件18 并透射从发光元件16发射的光。凹部28成形为从凹部28的底表面28A朝向光学透明构件18变宽。照明设备10设置有遮光构件12，用于遮蔽从发光元件16发射的一部分光被设置在光学透明构件18上。

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