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1. 发明授权

EP3566554B1 MODULE ÉLECTRIQUE COMPORTANT DEUX SUBSTRATS PARALLÈLES ET UN CONDENSATEUR DE DÉCOUPLAGE 有权
公开(公告)号：EP3566554B1
公开(公告)日：2024-04-17
申请号：EP18701515.1
申请日：2018-01-03
IPC分类号： H01G2/06 , H01G4/228 , H01G4/40 , H05K1/14 , H05K1/02
CPC分类号： H05K1/0263 , H05K1/0271 , H05K1/144 , H05K1/145 , H05K3/284 , H05K2201/1001520130101 , H05K2201/105320130101 , H01G4/40 , H01G4/228 , H01G2/06

2. 发明授权

EP2425689B1 CONNECTING UNIT 有权
公开(公告)号：EP2425689B1
公开(公告)日：2018-11-14
申请号：EP10722790.2
申请日：2010-04-27
申请人： Yazaki Corporation
发明人： SAWAI, Mamoru
IPC分类号： H05K1/11 , H05K3/40 , H01R12/71 , H01R12/72 , H05K1/02
CPC分类号： H01R12/714 , H01R12/721 , H05K1/0263 , H05K1/117 , H05K3/202 , H05K3/4092 , H05K2201/0352 , H05K2201/0397 , H05K2201/10189 , H05K2201/10446
摘要： A connecting unit includes a wiring board and a connector. The wiring board has a main face and a side face substantially perpendicular to the main face, and includes a soaking plate and a first terminal. The connector has a through hole for passing the first terminal therethrough. The first terminal is disposed in an intermediate layer of the wiring board and is projected outwardly from the side face. When the connector is connected to the wiring board, the first terminal passes through the through hole.

3. 发明公开

EP3281498A1 BAUGRUPPE 审中-公开
公开(公告)号：EP3281498A1
公开(公告)日：2018-02-14
申请号：EP16715288.3
申请日：2016-04-07
申请人： Marquardt GmbH
发明人： THUM, Christian , HAMMA, Adnreas , EBNER, Günter
IPC分类号： H05K3/30 , H01R12/70 , H01R12/51 , H05K1/02
CPC分类号： H05K1/0263 , H01R4/34 , H01R12/58 , H05K1/0203 , H05K1/0265 , H05K1/0271 , H05K1/184 , H05K3/301 , H05K2201/10053 , H05K2201/10083 , H05K2201/10189 , H05K2201/10295 , H05K2201/10962
摘要： The invention relates to an electrical assembly (1) having a printed circuit board (2) and having a component (3). The component (3) can in particular be an electromechanical component, such as an electrical switching contact, an electrical switch, a relay or the like. The component (3) is connected to the circuit board (2) electrically and/or mechanically. A forked element (4) is arranged between the component (3) and the circuit board (2) to electrically and/or mechanically connect the component (3) to the circuit board (2).

4. 发明公开

EP2539983A4 PCB INTERCONNECT SCHEME FOR PSU 审中-公开
标题翻译： PCB-VERBINDUNGSSCHEMAFÜRPSU
公开(公告)号：EP2539983A4
公开(公告)日：2017-06-28
申请号：EP11748243
申请日：2011-02-28
申请人： CORSAIR MEMORY INC
发明人： LIEBERMAN DONALD
IPC分类号： H02J1/10 , G06F1/26 , H05K1/02 , H05K3/36
CPC分类号： G06F1/26 , H05K1/0263 , H05K3/366 , H05K2201/09063 , H05K2201/10303 , H05K2201/1034 , H05K2201/10409

5. 发明授权

EP3078245B1 PROCEDE DE FABRICATION D'UN CIRCUIT IMPRIME DE PUISSANCE ET CIRCUIT IMPRIME DE PUISSANCE OBTENU PAR CE PROCEDE 有权转让
标题翻译：程序德制造德制电路IMPRIME DE PRISSIMET ET CIRCUIT IMPRIME DE PRISSANCE OBTENU PAR CE PROCEDE
公开(公告)号：EP3078245B1
公开(公告)日：2017-04-26
申请号：EP14802673.5
申请日：2014-11-26
申请人： Delphi France SAS
发明人： PETITGAS, Jérôme , SLEZAK, René
IPC分类号： H05K1/02
CPC分类号： H05K1/0263 , H05K3/328 , H05K2201/10272 , H05K2203/107

6. 发明授权

EP2234464B1 Portable elektrische Maschine mit einem Leiterplattenmodul 有权转让
标题翻译：便携式电机，包括一个印刷电路板模块
公开(公告)号：EP2234464B1
公开(公告)日：2016-12-14
申请号：EP10002510.5
申请日：2010-03-10
申请人： Festool GmbH
发明人： Maier, Frank , Fischer, Helmut , Barabeisch, Markus
IPC分类号： H05K1/02 , A47L9/28 , H01R13/66 , H05K3/22 , H05K3/30 , H01R12/00
CPC分类号： A47L9/2857 , A47L9/2805 , A47L9/2842 , H01R13/665 , H05K1/0263 , H05K3/222 , H05K3/308 , H05K2201/10189 , H05K2201/10272 , H05K2201/1059

7. 发明公开

EP3051642A4 CIRCUIT ASSEMBLY 审中-公开
标题翻译：电路
公开(公告)号：EP3051642A4
公开(公告)日：2016-10-19
申请号：EP14848589
申请日：2014-09-03
申请人： SUMITOMO WIRING SYSTEMS
发明人： NAKAMURA ARINOBU
IPC分类号： H02G3/16 , H05K7/06
CPC分类号： H05K1/0263 , B60R16/0238 , B60R16/0239 , H05K1/021 , H05K1/181 , H05K3/0061 , H05K3/341 , H05K3/3421 , H05K2201/09063 , H05K2201/10166 , H05K2201/10272 , Y02P70/611
摘要： Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature at the time of soldering of an electrical component. In a circuit assembly 10 in which a busbar circuit unit 16 is overlapped with and fixed to a printed circuit board 12, the busbar circuit unit 16 is configured as one piece by busbars 14 being buried between insulator layers 22 and 26, and has an exposed section 44 in which a part of the busbars 14 is exposed via a through-hole 40 of the insulator layer 22. The insulator layer 22 of the busbar circuit unit 16 is overlapped with the printed circuit board 12 and is fixed thereto via fixing means 36, and terminal sections 56 of an electrical component 20 are soldered to and mounted on the exposed section 44 of the busbar circuit unit 16 and a printed wiring 54 of the printed circuit board 12.

8. 发明公开

EP3051641A1 CIRCUIT ASSEMBLY 审中-公开
标题翻译：电路组装
公开(公告)号：EP3051641A1
公开(公告)日：2016-08-03
申请号：EP14848339.9
申请日：2014-09-03
申请人： Sumitomo Wiring Systems, Ltd.
发明人： NAKAMURA, Arinobu
IPC分类号： H02G3/16 , H05K7/06
CPC分类号： H05K1/0263 , H05K1/115 , H05K3/386 , H05K2201/10272
摘要： Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature at the time of soldering of an electrical component. In a circuit assembly 10 in which a busbar circuit unit 16 constituted by a plurality of busbars 14 is overlapped with a printed circuit board 12 having a printed wiring 48 and is fixed thereto via an adhesive sheet 20, the plurality of busbars 14 are adhered to the surface of the adhesive sheet 20 in a state in which the busbars 14 are arranged adjacently and spaced apart by gaps, and the gaps 22 between the busbars 14 are filled with the adhesive agent 24. With the adhesive agent 24, press-cut surfaces 30 of the busbars 24 and at least one of the adhesive sheet 20 and the printed circuit board 12 that is exposed from the gaps 22 between the busbars 14 is adhered.
摘要翻译：提供一种具有新结构的电路组件，其中与电路元件焊接时的加热温度无关，能够可靠地固定与印刷电路板重叠的母线电路单元。在由多个汇流条14构成的汇流条电路单元16与具有印刷布线48的印刷电路板12重叠并通过粘合片20固定到其上的电路组件10中，多个汇流条14粘附到粘合片20的表面处于母线14相邻地布置并间隔开的状态，并且母线14之间的间隙22被粘合剂24填充。利用粘合剂24，压切表面汇流条24中的30个以及从汇流条14之间的间隙22暴露的粘合片20和印刷电路板12中的至少一个被粘附。

9. 发明公开

EP3042404A1 SYSTEM AND METHOD FOR VENTING PRESSURIZED GAS FROM A BATTERY MODULE 有权转让
标题翻译：系统在VERFAHREN ZUM ENTLASTEN VON DRUCKGAS AUS EINEM BATTERIEMODUL
公开(公告)号：EP3042404A1
公开(公告)日：2016-07-13
申请号：EP14756220.1
申请日：2014-08-18
申请人： Johnson Controls Technology Company
发明人： DEKEUSTER, Richard M. , MACK, Robert J. , SOLESKI, Edward J. , TYLER, Matthew R. , CASH, Stephen D. , BALK, Mikhail S.
IPC分类号： H01M2/10 , H01M2/12 , H01M10/42 , H01M2/20 , H01M2/30 , H01M10/613 , H01M10/625 , H01M10/647 , H01M10/6551
CPC分类号： H01M2/22 , B60L1/003 , B60L1/02 , B60L1/14 , B60L3/0046 , B60L3/12 , B60L11/123 , B60L11/14 , B60L11/1803 , B60L11/1851 , B60L11/1861 , B60L11/1864 , B60L11/1874 , B60L11/1877 , B60L11/1879 , B60L15/20 , B60L2210/10 , B60L2210/40 , B60L2240/34 , B60L2240/545 , B60L2240/547 , B60L2240/549 , B60L2250/10 , B60L2260/26 , B60L2270/20 , B60R16/03 , B60R16/033 , G01R31/025 , G01R31/362 , G01R31/3627 , H01H47/325 , H01M2/1077 , H01M2/1205 , H01M2/1211 , H01M2/1252 , H01M2/20 , H01M2/206 , H01M2/24 , H01M2/305 , H01M2/32 , H01M2/34 , H01M2/342 , H01M4/661 , H01M4/665 , H01M10/04 , H01M10/0413 , H01M10/058 , H01M10/425 , H01M10/4257 , H01M10/482 , H01M10/486 , H01M10/6551 , H01M2010/4271 , H01M2010/4278 , H01M2200/103 , H01M2220/20 , H01M2250/20 , H01R12/716 , H02H7/18 , H02J7/0021 , H02J7/0063 , H05K1/0262 , H05K1/0263 , H05K1/18 , H05K3/32 , H05K2201/10492 , H05K2201/1053 , H05K2201/10545 , Y02T10/6217 , Y02T10/645 , Y02T10/7005 , Y02T10/7016 , Y02T10/7044 , Y02T10/705 , Y02T10/7061 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y10T29/49108 , Y10T29/4911 , Y10T29/49114
摘要： A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.
摘要翻译：提供一种母线，其包括包括第一材料的第一端和包括第二材料的第二端和制造方法。第一端被设计成耦合到电池模块的第一电池单元的端子，并且包括设置在第一端上的第一环，设计成接收和围绕电池模块的第一电池单元的端子。第二端被设计成耦合到电池模块的第二电池单元的端子，并且包括设置在第二端上的第二套环，其设计成接收和围绕电池模块的第二电池的端子。电池模块的第一和第二电池彼此相邻。此外，母线包括电连接和机械耦合第一端和第二端的接头。

10. 发明公开

EP3042212A1 BATTERY MODULE PRINTED CIRCUIT BOARD ASSEMBLY SYSTEM AND METHOD 有权转让
标题翻译：系统VERFAHREN ZUR LEITERPLATTENMONTAGE EINES BATTERIEMODULS
公开(公告)号：EP3042212A1
公开(公告)日：2016-07-13
申请号：EP14761767.4
申请日：2014-08-25
申请人： Johnson Controls Technology Company
发明人： DULLE, Ronald J. , GUNDERSON, Mark D. , THIEME, Bryan L.
IPC分类号： G01R31/36 , H01M2/10 , H01M10/42 , H01M10/48 , H02J7/00 , H01M2/12 , H01M2/20 , H01M2/30 , H01M10/613 , H01M10/625 , H01M10/647 , H01M10/6551
CPC分类号： H01M2/22 , B60L1/003 , B60L1/02 , B60L1/14 , B60L3/0046 , B60L3/12 , B60L11/123 , B60L11/14 , B60L11/1803 , B60L11/1851 , B60L11/1861 , B60L11/1864 , B60L11/1874 , B60L11/1877 , B60L11/1879 , B60L15/20 , B60L2210/10 , B60L2210/40 , B60L2240/34 , B60L2240/545 , B60L2240/547 , B60L2240/549 , B60L2250/10 , B60L2260/26 , B60L2270/20 , B60R16/03 , B60R16/033 , G01R31/025 , G01R31/362 , G01R31/3627 , H01H47/325 , H01M2/1077 , H01M2/1205 , H01M2/1211 , H01M2/1252 , H01M2/20 , H01M2/206 , H01M2/24 , H01M2/305 , H01M2/32 , H01M2/34 , H01M2/342 , H01M4/661 , H01M4/665 , H01M10/04 , H01M10/0413 , H01M10/058 , H01M10/425 , H01M10/4257 , H01M10/482 , H01M10/486 , H01M10/6551 , H01M2010/4271 , H01M2010/4278 , H01M2200/103 , H01M2220/20 , H01M2250/20 , H01R12/716 , H02H7/18 , H02J7/0021 , H02J7/0063 , H05K1/0262 , H05K1/0263 , H05K1/18 , H05K3/32 , H05K2201/10492 , H05K2201/1053 , H05K2201/10545 , Y02T10/6217 , Y02T10/645 , Y02T10/7005 , Y02T10/7016 , Y02T10/7044 , Y02T10/705 , Y02T10/7061 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y10T29/49108 , Y10T29/4911 , Y10T29/49114
摘要： A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.
摘要翻译：提供一种母线，其包括包括第一材料的第一端和包括第二材料的第二端和制造方法。第一端被设计成耦合到电池模块的第一电池单元的端子，并且包括设置在第一端上的第一环，设计成接收和围绕电池模块的第一电池单元的端子。第二端被设计成耦合到电池模块的第二电池单元的端子，并且包括设置在第二端上的第二套环，其设计成接收和围绕电池模块的第二电池的端子。电池模块的第一和第二电池彼此相邻。此外，母线包括电连接和机械耦合第一端和第二端的接头。

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