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1. 发明公开

EP2503606A2 Light Emitting Diode, Manufacturing Method Thereof, Light Emitting Diode Module, and Manufacturing Method Thereof 有权转让
标题翻译：发光二极管，它们的制备方法，涉及发光及其制备二极管模块和方法
公开(公告)号：EP2503606A2
公开(公告)日：2012-09-26
申请号：EP12161008.3
申请日：2012-03-23
申请人： Samsung LED Co., Ltd.
发明人： Kim, Hak Hwan , Kim, Min Jung , Moon, Kyung Mi , Song, Jong Sup , You, Jae Sung , Choi, Ill Heoung , Yoo, Cheol Jun
IPC分类号： H01L33/50
摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips (11), manufacturing a phosphor pre-form (10) including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
摘要翻译：被提供了一种发光二极管（LED）和LED模块的制造方法的制造方法。 LED的制造方法可以包括制造的LED芯片有多个（11），一种制造磷预成型（10）包括安装区域，用于安装LED芯片的多个复数，磷预成型内部施加上的粘合剂中，安装各LED芯片中的每个安装区域的所述多个所述多个，以及切割磷预成型到哪个LED芯片的多元被安装成单元，包括单独的LED芯片。

2. 发明公开

EP2426744A2 Light emitting diode package and manufacturing method thereof 审中-公开
标题翻译： Leuchtdiodenbaugruppe und deren Herstellungsverfahren
公开(公告)号：EP2426744A2
公开(公告)日：2012-03-07
申请号：EP11179555.5
申请日：2011-08-31
申请人： Samsung LED Co., Ltd.
发明人： Lee, Young Jin , Kim, Hyung Kun , Moon, Kyung Mi , Woo, Gwang Bok
IPC分类号： H01L33/48 , H01L33/64
CPC分类号： H01L33/642 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2933/0075 , H01L2924/00014
摘要： A light emitting diode (LED) package is disclosed. The LED package includes a lead frame comprising a thermal pad and at least two electrode pads disposed at a distance from the thermal pad; at least one LED mounted on the thermal pad and electrically connected with the at least two electrode pads through a wire; a package mold comprising a first cavity to receive the thermal pad and the at least two electrode pads and to partially expose the thermal pad and the at least two electrode pads through a first surface of the package mold, the first surface on which the at least one LED is mounted, and exposing the thermal pad and the at least two electrode pads through a surface coplanar with a second surface opposite to the first surface; and a molding unit disposed in the first cavity.
摘要翻译：公开了一种发光二极管（LED）封装。所述LED封装包括引线框架，所述引线框架包括散热焊盘和至少两个电极焊盘，所述至少两个电极焊盘设置在与所述散热焊盘相距一定距离处; 至少一个LED，其安装在所述散热焊盘上并通过导线与所述至少两个电极焊盘电连接; 封装模具，其包括用于接收所述热垫和所述至少两个电极焊盘并且通过所述封装模具的第一表面部分地暴露所述热焊盘和所述至少两个电极焊盘的第一腔体，所述第一表面至少在所述第一表面上，安装一个LED，并且通过与第一表面相对的第二表面共面的表面暴露所述热焊盘和所述至少两个电极焊盘; 以及设置在所述第一腔中的模制单元。

3. 发明公开

EP2515333A2 Light Emitting Device Module and Method of Manufacturing the Same 审中-公开
标题翻译： Lichtemittierendes Vorrichtungsmodul und Verfahren zu seiner Herstellung
公开(公告)号：EP2515333A2
公开(公告)日：2012-10-24
申请号：EP12162585.9
申请日：2012-03-30
申请人： Samsung LED Co., Ltd.
发明人： Kim, Hak Hwan , Moon, Kyung Mi , Paek, Ho Sun , Song, Young Hee
IPC分类号： H01L25/075 , H01L33/50 , H01L33/54
CPC分类号： H01L33/502 , H01L25/0753 , H01L27/15 , H01L33/50 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.
摘要翻译：提供了可应用于各种应用的发光器件（LED）模块及其制造方法。通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量可以提高价格竞争力。在制造LED模块的方法中，可以通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作来最小化和简化操作。可以通过使用金属材料作为基底和凸块来增强散热特性。

4. 发明公开

EP2424333A2 AC driven light emitting device 审中-公开
标题翻译： Wechselstrombetriebene lichtemittierende Vorrichtung
公开(公告)号：EP2424333A2
公开(公告)日：2012-02-29
申请号：EP11178363.5
申请日：2011-08-23
申请人： Samsung LED Co., Ltd.
发明人： Lee, Young Jin , Kim, Hyung Kun , Moon, Kyung Mi
IPC分类号： H05B33/08
CPC分类号： H05B33/0821 , H05B33/0806
摘要： There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.
摘要翻译：提供了一种包括串联连接的多个LED阵列的交流（AC）驱动发光器件，每个LED阵列具有多个LED电连接以形成两端电路并通过双向电压发光的结构当交流电压施加到两端电路时; 以及连接到所述多个LED阵列中的至少一个并且控制相对于所述多个LED阵列的总驱动电压的开关装置。交流驱动发光器件允许从低驱动电压Vf进行工作，同时具有高电压Vf的高驱动电压，从而在功率因数，THD和能量效率方面实现卓越。

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