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1. 发明公开

EP2515333A2 Light Emitting Device Module and Method of Manufacturing the Same 审中-公开
标题翻译： Lichtemittierendes Vorrichtungsmodul und Verfahren zu seiner Herstellung
公开(公告)号：EP2515333A2
公开(公告)日：2012-10-24
申请号：EP12162585.9
申请日：2012-03-30
申请人： Samsung LED Co., Ltd.
发明人： Kim, Hak Hwan , Moon, Kyung Mi , Paek, Ho Sun , Song, Young Hee
IPC分类号： H01L25/075 , H01L33/50 , H01L33/54
CPC分类号： H01L33/502 , H01L25/0753 , H01L27/15 , H01L33/50 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.
摘要翻译：提供了可应用于各种应用的发光器件（LED）模块及其制造方法。通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量可以提高价格竞争力。在制造LED模块的方法中，可以通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作来最小化和简化操作。可以通过使用金属材料作为基底和凸块来增强散热特性。

2. 发明公开

EP2487730A2 Flip chip LED package and manufacturing method thereof 审中-公开
标题翻译： Flipchip-LED-Baugruppe und Herstellungsverfahrendafür
公开(公告)号：EP2487730A2
公开(公告)日：2012-08-15
申请号：EP12153743.5
申请日：2012-02-03
申请人： Samsung LED Co., Ltd.
发明人： Kim, Kwon Joong , Paek, Ho Sun , Kim, Hak Hwan
IPC分类号： H01L33/48 , H01L33/36 , H01L33/62
CPC分类号： H01L33/486 , H01L33/36 , H01L33/62 , H01L2224/16245 , H01L2933/0016
摘要： A flip chip LED package (100) and a manufacturing method thereof are provided. The flip chip LED package (100) includes a package substrate (110) including a cavity (111) that exposes a circuit pattern (114,115), and a chip mounting portion (113) disposed on a bottom surface (112) of the cavity (111); a solder layer (120a,120b) disposed on the circuit pattern (114,115); a bonding tape layer (130) disposed on the chip mounting portion (113); and an LED chip (140) including a bonding object region (A) and a plurality of electrode pads (141,142) disposed on one surface, being mounted on the package substrate (110) such that the plurality of electrode pads (141,142) are bonded to the solder layer (120a,120b) and the bonding object region (A) is bonded to the bonding tape layer (130).
摘要翻译：提供了一种倒装芯片LED封装（100）及其制造方法。倒装芯片LED封装（100）包括包括暴露电路图案（114,115）的空腔（111）的封装基板（110）和设置在空腔的底表面（112）上的芯片安装部分（113） 111）; 设置在电路图案（114,115）上的焊料层（120a，120b）; 设置在所述芯片安装部分（113）上的接合带层（130）; 以及包括粘合对象区域（A）和设置在一个表面上的多个电极焊盘（141,142）的LED芯片（140），安装在所述封装基板（110）上，使得所述多个电极焊盘（141,142）被接合到焊料层（120a，120b）并且粘合物区域（A）被粘合到粘合带层（130）上。

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