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1. 发明公开

EP3501828A1 PRINTED CIRCUIT BOARD INSPECTING APPARATUS, METHOD FOR DETECTING ANOMALY IN SOLDER PASTE AND COMPUTER READABLE RECORDING MEDIUM 有权
公开(公告)号：EP3501828A1
公开(公告)日：2019-06-26
申请号：EP17210425.9
申请日：2017-12-22
申请人： Koh Young Technology Inc.
发明人： NOH, Jeong Kyu , LEE, Jae Hwan , LEE, Duk Young
IPC分类号： B41F33/00 , B41F15/26 , G06T7/00 , H05K3/12
CPC分类号： G01R31/28 , B41F15/26 , B41F33/0027 , B41F33/0036 , B41F33/0045 , G01N21/8806 , G06T7/0004 , G06T2207/20081 , G06T2207/30141 , G06T2207/30152 , H05K1/0268 , H05K1/0269 , H05K3/34 , H05K3/3484 , H05K13/08
摘要： A printed circuit board inspection apparatus (100) obtains measurement shape information about each of a plurality of solder pastes printed on a first printed circuit board through a plurality of apertures and aperture shape information about each of the plurality of apertures, obtains probability values that a first solder paste printed through a first aperture of the plurality of apertures and each of a plurality of second solder pastes printed through second apertures other than the first aperture of the plurality of apertures have the measurement shape information when the first solder paste and the plurality of second solder pastes are printed on the first printed circuit board, by applying the measurement shape information and the aperture shape information to a machine-learning based model, and detects whether an anomaly in the first solder paste occurred based on the probability values.

2. 发明授权

EP3169146B1 METHOD FOR PRODUCING COMPONENT PLACEMENT COORDINATES AND DEVICE FOR PRODUCING COMPONENT PLACEMENT COORDINATES 有权转让
公开(公告)号：EP3169146B1
公开(公告)日：2018-10-31
申请号：EP14897258.1
申请日：2014-07-10
申请人： FUJI Corporation
发明人： NAKAJIMA Mikio , OIKE Hiroshi , ESAKI Hirotake , SUGIYAMA Kenji
IPC分类号： H05K13/04 , H05K13/08 , G06T7/00 , G06F17/50 , G06T7/73
CPC分类号： G06T7/74 , G06F17/5072 , G06T2207/30141 , H05K13/0882
摘要： The present invention is a creation method of component mounting coordinates which automatically creates coordinate data of each mounting position of a plurality of components on a circuit board using a component table which associates component identification information and component data names, in which the creation method acquires a pad arrangement image which represents the component identification information which is displayed on the circuit board, and arrangements of pads which are formed on the circuit board and to which connecting sections of the plurality of components are connected, and in which the creation method creates a component template image which represents arrangements of the connecting sections based on shape data of a relevant component which corresponds to the component identification information, and matches the component template image to the pad arrangement image in a vicinity of relevant component identification information to identify the pads which correspond to the relevant component, and to further calculate the coordinate data on a premise of a state in which the connecting sections of the relevant component are caused to overlap the pads which are identified. Accordingly, it is possible to accurately identify pads corresponding to components without relying on combinations of a plurality of components or a magnitude of a number of components to be mounted onto a circuit board, and it is possible reliably create coordinate data of suitable mounting positions.

3. 发明公开

EP3236200A4 INSPECTION METHOD AND INSPECTION APPARATUS FOR SUBSTRATE HAVING COMPONENTS LOADED THEREON 有权
公开(公告)号：EP3236200A4
公开(公告)日：2018-07-18
申请号：EP15870321
申请日：2015-12-16
申请人： KOH YOUNG TECH INC
发明人： JEONG JOONG-KI
IPC分类号： G01B11/25 , G01B11/06 , G01N21/956 , G06T7/10 , G06T7/521 , H05K13/08
CPC分类号： G01N21/95607 , G01B11/0608 , G01B11/2513 , G01B11/2527 , G01N21/8806 , G01N21/956 , G01N2021/8829 , G01N2021/8835 , G01N2021/8887 , G01N2021/95638 , G01N2201/061 , G06T7/0004 , G06T2207/10024 , G06T2207/10028 , G06T2207/30141 , H05K13/08
摘要： A method and an apparatus of inspecting a substrate with a component mounted thereon, which are capable of inspecting whether the component is properly mounted or not without additional setting or changing inspection condition, are provided. The method comprises measuring a three-dimensional shape by irradiating the pattern image toward the substrate through at least one illumination unit and by taking a reflected image through an imaging unit, extracting a shield region from the three-dimensional shape, and inspecting a component mounting defect in an area excluding the shield region in the three-dimensional shape.

4. 发明公开

EP3264880A4 COMPONENT-MOUNTING DEVICE 有权转让
公开(公告)号：EP3264880A4
公开(公告)日：2018-03-21
申请号：EP15883209
申请日：2015-02-26
申请人： FUJI MACHINE MFG
发明人： MURAI MASAKI , YAMASAKI TOSHIHIKO , SHIMIZU TOSHINORI
IPC分类号： H05K13/04 , G06T1/00 , H01L21/52 , H05K13/00 , H05K13/02 , H05K13/08
CPC分类号： H05K13/08 , G06T1/00 , G06T7/0004 , G06T7/73 , G06T2207/30141 , G06T2207/30204 , H01L21/52 , H04N5/23296 , H04N5/247 , H05K1/0269 , H05K13/0015 , H05K13/04 , H05K13/0408 , H05K13/0452 , H05K2201/09918
摘要： A component mounting machine mounts components having a component mark for positioning on an upper face on a circuit board. The component mounting machine has a first suction nozzle that sucks a component, a transfer head that mounts the component on a circuit board, optical path conversion means that is disposed above a suction surface and converts the optical path of light from the upper face of the component to the side, a first camera that is able to receive light that is changed in an optical path, a camera moving device that relatively moves the first camera, and a control device that controls operation of the transfer head and the camera moving device. The camera moving device moves the first camera in at least a first direction that is orthogonal to an optical axis of the first camera, and an imaging region of the first camera moves in a second direction with respect to the center of the component when the first camera moves in the first direction. The control device is provided with a memory section that stores in advance positional information of the component mark, sucks the component on the first suction nozzle, and the camera moving device is moved based on the positional information within the memory section.

5. 发明公开

EP3267146A1 RECOGNITION DEVICE AND RECOGNITION METHOD 有权转让
标题翻译：识别装置和识别方法
公开(公告)号：EP3267146A1
公开(公告)日：2018-01-10
申请号：EP15884484.5
申请日：2015-03-06
申请人： Fuji Machine Mfg. Co., Ltd.
发明人： NOZAWA, Tatsuji
IPC分类号： G01B11/00
CPC分类号： G06T7/70 , G01B11/00 , G06T7/0004 , G06T2207/30141 , H05K13/0813
摘要： Leaded component 100 held by suction nozzle 66 is imaged under three types of imaging conditions, imaging in a state illuminated by laser illumination 116, imaging in a state illuminated by incident illumination 114, and imaging in a state illuminated by side illumination 112 and incident illumination 114. In a case in which it is not possible to appropriately recognize a position of a lead 104 by recognition processing using image data of the first set of imaging conditions, recognition processing is performed again using image data of a second set of imaging conditions different to the first set of imaging conditions. And, in a case in which it is not possible to appropriately recognize a position of a lead by recognition processing using image data of the second set of imaging conditions, recognition processing is performed again using image data of a third set of imaging conditions different to the second set of imaging conditions. In this manner, it is possible to appropriately recognize a tip of lead by performing recognition processing based on three types of image data with different imaging conditions.
摘要翻译：由吸嘴66保持的引线部件100在三种类型的成像条件下成像，即，在由激光照射116照射的状态下成像，在由入射照明114照射的状态下成像，以及在由侧照射112照射的状态下成像，在通过使用第一组成像条件的图像数据的识别处理不能适当地识别引线104的位置的情况下，再次使用不同的第二组成像条件的图像数据来执行识别处理到第一组成像条件。并且，在通过使用第二组成像条件的图像数据的识别处理不能适当地识别出导联的位置的情况下，再次使用与第三组成像条件不同的成像条件的图像数据执行识别处理第二组成像条件。以这种方式，可以通过基于具有不同成像条件的三种类型的图像数据执行识别处理来适当地识别引导的尖端。

6. 发明公开

EP3232211A4 METHOD FOR INSPECTING TERMINAL OF COMPONENT FORMED ON SUBSTRATE AND SUBSTRATE INSPECTION APPARATUS 审中-公开
公开(公告)号：EP3232211A4
公开(公告)日：2018-01-03
申请号：EP15867319
申请日：2015-12-08
申请人： KOH YOUNG TECH INC
发明人： JEON KYE-HOON , KWON DAL-AN
IPC分类号： G01R31/04 , G01N21/88 , G01N21/956 , G01R31/28 , G01R31/306 , G06T7/00 , G06T7/12 , G06T7/174 , H05K13/08
CPC分类号： G01R31/04 , G01N21/8806 , G01N2021/95638 , G01R31/28 , G01R31/306 , G06T7/0004 , G06T7/12 , G06T7/174 , G06T2207/10024 , G06T2207/10152 , G06T2207/30141
摘要： A substrate inspection apparatus according to an embodiment of the present invention comprises a projection unit, an illumination unit, an image acquisition unit and a processing unit. The projection unit irradiates an inspection target with light for obtaining three-dimensional shape information of the inspection target. The illumination unit irradiates the inspection target with at least two lights having different colors. The image acquisition unit acquires a first image by receiving light irradiated by the projection unit and reflected from the inspection target, and a second image by receiving the lights irradiated by the illumination unit and reflected from the inspection target. The processing unit acquires brightness information and color information from the first image and the second image, respectively, which are acquired by the image acquisition unit, and acquires at least a portion of a boundary by using the bright information and the color information. Therefore, the accuracy and reliability of the inspection can be improved.

7. 发明公开

EP3255971A1 IMAGE PROCESSING DEVICE, MOUNTING PROCESSING SYSTEM, IMAGE PROCESSING METHOD, AND PROGRAM 有权转让
标题翻译：图像处理装置，安装处理系统，图像处理方法和程序
公开(公告)号：EP3255971A1
公开(公告)日：2017-12-13
申请号：EP15881079.6
申请日：2015-02-04
申请人： Fuji Machine Mfg. Co., Ltd.
发明人： KATO, Takeshi , OIKE, Hiroshi , ESAKI, Hirotake
IPC分类号： H05K13/08
CPC分类号： G06T7/0008 , G06F3/04817 , G06F3/04842 , G06T2200/24 , G06T2207/30141 , H04N5/44504 , H05K13/04 , H05K13/08 , H05K13/0813
摘要： First, mounting device 11 mounts components P on board S, and performs processing of arranging discard components R discarded based on a captured image on discard loading section 30. A CPU of management computer 50 acquires an identification image in which it is possible to identify a discard component R to be discarded and a captured image of the discard component R, links the acquired identification image of the discard component and the captured image of the discard component, and creates a discard component arrangement image screen that includes an arrangement display area in which the identification images are arranged based on an order in which the discard components were arranged on discard loading section 30. Continuing, the CPU of management computer 50 outputs the created discard component arrangement image screen.
摘要翻译：首先，安装装置11将部件P安装在板S上，并且执行将基于拍摄图像丢弃的废弃部件R布置在丢弃装载部30上的处理。管理计算机50的CPU获取识别图像，其中可以识别丢弃要丢弃的组件R和丢弃组件R的捕获图像，链接所获取的丢弃组件的识别图像和丢弃组件的捕获图像，并且创建丢弃组件布置图像画面，该丢弃组件布置图像画面包括布置显示区域识别图像基于丢弃部件排列在丢弃装载部分30上的顺序排列。继续，管理计算机50的CPU输出所创建的丢弃部件排列图像画面。

8. 发明公开

EP3160219A1 VERFAHREN UND VORRICHTUNG ZUR PLATZIERUNG ELEKTRONISCHER BAUTEILE 有权
标题翻译：放置电子元件的方法和装置
公开(公告)号：EP3160219A1
公开(公告)日：2017-04-26
申请号：EP16180010.7
申请日：2016-07-18
申请人： Ersa GmbH
发明人： HOFMANN, Udo , SINN, Wolfram , RICHTER, Sergei
IPC分类号： H05K13/08 , H05K13/04 , H05K13/00
CPC分类号： G06T7/001 , G06T7/74 , G06T2207/30141 , H05K13/0053 , H05K13/0486 , H05K13/0818 , H05K13/0853 , H05K13/089
摘要： Verfahren zur Platzierung elektronischer Bauteile auf einer Platine umfassend die folgenden Schritte: Platzieren eines zu platzierenden Bauteils eines ersten Bauteiltyps in einer Startposition; Erstellen eines Bauteilbilds des zu platzierenden Bauteils in der Startposition; Erstellen eines Platinenbereichsbilds einer Platine eines ersten Platinenbereichstyps; Berechnen eines Verfahrwegs zum Verfahren des zu platzierenden Bauteils in eine Endposition auf der Platine basierend auf einer Bildüberlagerung des Bauteilbilds und eines zuvor abgespeicherten Referenzbauteilbilds eines Referenzbauteils des ersten Bauteiltyps und basierend auf einem zuvor abgespeicherten Referenzverfahrweg des Referenzbauteils von einer Referenzstartposition in eine Referenzendposition auf einer Referenzplatine des ersten Platinenbereichstyps und basierend auf einer Bildüberlagerung des Platinenbereichsbilds und eines zuvor abgespeicherten Referenzplatinenbereichsbilds der Referenzplatine; Verfahren des zu platzierenden Bauteils in die Endposition entlang des Verfahrwegs.
摘要翻译：一种将电子元件放置在电路板上的方法，包括以下步骤：将待放置的第一元件类型的元件放置在开始位置; 创建要放置在起始位置的组件的组件图像; 创建第一块板区域类型的单板的单板区域图像; 计算用于移动部件的移动路径在一个Referenzendposition被放置在基础上，分量图像的图像重叠并且所述第一部件类型的参考分量的预先存储的参考分量图像上的板的最终位置以及基于所述基准部件的一个先前存储Referenzverfahrweg从参考起始位置上的参考电路板第一板区域类型并且基于板区域图像和参考板的先前存储的参考板区域图像的图像重叠; 将组件放置到沿着行程路径的最终位置。

9. 发明公开

EP3118572A4 IMAGE PROCESSING DEVICE AND SUBSTRATE PRODUCTION SYSTEM 有权转让
标题翻译： BILDVERARBEITUNGSVORRICHTUNG UND SUBSTRATHERSTELLUNGSSYSTEM
公开(公告)号：EP3118572A4
公开(公告)日：2017-03-22
申请号：EP14885828
申请日：2014-03-13
申请人： FUJI MACHINE MFG
发明人： KOTANI KAZUYA , KITO SHUICHIRO
IPC分类号： G01B11/00 , G06T3/40
CPC分类号： G06T3/4053 , G06T7/0004 , G06T2207/10004 , G06T2207/20008 , G06T2207/30141 , H04N1/19594 , H05K13/08

10. 发明公开

EP2982969A4 METHOD FOR INSPECTING FOR FOREIGN SUBSTANCE ON SUBSTRATE 有权
标题翻译： FOR检查异物方法在基底上
公开(公告)号：EP2982969A4
公开(公告)日：2017-03-01
申请号：EP14778804
申请日：2014-04-01
申请人： KOHYOUNG TECH INC
发明人： LEE HYUN-SEOK , YANG JAE-SIK , KIM JA-GEUN , KIM HEE-TAE , YOU HEE-WOOK
IPC分类号： G01N21/88 , G01B11/25 , G01N21/94 , G01N21/956 , G06T7/00
CPC分类号： G01N21/94 , G01N21/8806 , G01N2021/8845 , G01N2021/95638 , G01N2201/061 , G01N2201/13 , G06T7/001 , G06T11/60 , G06T2207/10004 , G06T2207/10024 , G06T2207/30141
摘要： In order to inspect a substrate, an image information of a substrate before applying solder is displayed. Then, at least one inspection region on the substrate is image-captured to obtain an image of the inspection region that is image-captured. Then, image information that is to be displayed is renewed and the renewed image information is displayed. And, in order to inspect a foreign substance, obtained image of the inspection region is compared with a reference image of the substrate. Therefore, an operator can easily catch a region corresponding to a specific region of the image that is displayed, and easily detect a foreign substance on the substrate.

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