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    • 4. 发明公开
    • CHIP ANTENNA
    • CHIPANTENNE
    • EP3121896A1
    • 2017-01-25
    • EP15765059.9
    • 2015-03-06
    • NTN Corporation
    • SONOZAKI, TomokazuNODA, HiroyukiMORI, Natsuhiko
    • H01Q1/38H01Q1/24H01Q1/40
    • H01Q1/2283H01Q1/2291H01Q1/38H01Q9/42
    • Provided is a chip antenna (1), including: an antenna pattern (3) formed through bending a conductive plate into a three-dimensional shape, the antenna pattern including an antenna part (31) and a terminal part (32) electrically connected to a circuit substrate (10) ; and a base body (2) formed through injection molding a resin with the antenna pattern (3) serving as an insert component, in which the base body (2) includes: a rectangular plate-like top wall (21) holding the antenna part (31) on a surface thereof; and a rectangular plate-like vertical wall (22) provided upright along a long-side direction of the top wall (21) with one end (upper end) thereof in a short-side direction being connected to the top wall (21) and with another end (lower end) thereof in the short-side direction holding the terminal part (32).
    • 提供一种芯片天线(1),包括:天线图案(3),其通过将导电板弯曲成三维形状而形成,所述天线图案包括天线部分(31)和端子部分(32),电气连接到 电路基板(10); 以及基体(2),其通过将所述天线图案(3)注射成型而形成,所述天线图案(3)用作插入部件,所述基体(2)包括:矩形板状顶壁(21),其保持所述天线部 (31)的表面; 以及沿着顶壁(21)的长边方向竖立设置的矩形板状垂直壁(22),其一端(上端)在短边方向上连接到顶壁(21)和 其另一端(下端)在保持端子部(32)的短边方向上。
    • 5. 发明公开
    • MAGNETIC CORE AND PROCESS FOR PRODUCING SAME
    • MAGNETKERN UND VERFAHREN ZUR HERSTELLUNG DAVON
    • EP2905791A1
    • 2015-08-12
    • EP13843337.0
    • 2013-09-27
    • NTN Corporation
    • UEMOTO, IkuoMIYAZAKI, ShinjiHARANO, TakujiMORI, NatsuhikoNODA, Hiroyuki
    • H01F1/26H01F27/255H01F41/02
    • H01F27/255B22F1/0062B22F2998/10C22C2202/02H01F1/22H01F1/26H01F3/08H01F41/0246B22F3/02B22F9/04B22F2003/248
    • The present invention provides a magnetic core which can be produced with improved productivity without increasing a material cost and has required magnetic and mechanical properties and a process for producing the same. The magnetic core is produced by compression molding and thereafter thermally hardening iron-based soft magnetic powder having resin films formed on surfaces of particles thereof. The resin film is an uncured resin film formed by dry mixing the iron-based soft magnetic powder and epoxy resin containing a latent curing agent with each other at a temperature not less than a softening temperature of the epoxy resin and less than a thermal curing starting temperature thereof. The iron-based soft magnetic powder having the resin films formed on the surfaces of the particles thereof is compression molded by using a die to produce a compression molded body. The compression molded body having the resin films formed on the surfaces of the particles thereof is thermally hardened at a temperature not less than the thermal curing starting temperature of the epoxy resi
    • 本发明提供一种磁芯,其可以在不增加材料成本的情况下以提高的生产率生产并且需要磁性和机械性能及其制造方法。 磁芯通过压缩成型制造,然后热硬化铁基软磁性粉末,其具有在其颗粒表面上形成的树脂膜。 树脂膜是通过在不低于环氧树脂的软化温度的温度下将包含潜固化剂的铁基软磁性粉末和环氧树脂彼此干燥混合而形成的未固化树脂膜,并且小于热固化起始 温度。 在其颗粒表面上形成有树脂膜的铁基软磁性粉末通过使用模具进行压缩成型以制造压缩成型体。 将具有形成在其颗粒表面上的树脂膜的压模体在不低于环氧树脂的热固化起始温度的温度下热固化
    • 6. 发明公开
    • MAGNETIC CORE AND METHOD FOR MANUFACTURING SAME
    • 磁芯及其制造方法
    • EP3196897A1
    • 2017-07-26
    • EP15842742.7
    • 2015-09-17
    • NTN Corporation
    • HARANO, TakujiNODA, Hiroyuki
    • H01F1/26H01F27/255H01F41/02
    • The present invention provides a magnetic core having insulating properties, and a method for manufacturing the magnetic core. Provided is a magnetic core manufactured by compression molding and subsequent thermal curing of an iron-based soft magnetic powder having a resin coating formed on particle surfaces thereof. The iron-based soft magnetic powder is one in which the particle surfaces have been coated with an inorganic insulator; the resin coating is an uncured resin coating formed by dry blending the powder with a thermosetting resin at a temperature equal to or greater than the softening point of the thermosetting resin and lower than the thermal curing initiation temperature of the resin; the compression molding is carried out by using a mold to produce a compression molded body; and the thermal curing is carried out at a temperature equal to or greater than the thermal curing initiation temperature of the thermosetting resin.
    • 本发明提供了具有绝缘性能的磁芯,以及制造该磁芯的方法。 本发明提供一种磁芯,该磁芯通过在其颗粒表面上形成树脂涂层的铁基软磁粉末的压缩成型和随后的热固化而制造。 铁基软磁粉末是其中颗粒表面已经涂覆有无机绝缘体的软磁粉末; 所述树脂涂层是通过在等于或大于所述热固性树脂的软化点并低于所述树脂的热固化起始温度的温度下将所述粉末与热固性树脂干混而形成的未固化树脂涂层; 通过使用模具进行压缩成型以制造压缩成型体; 并且在等于或大于热固性树脂的热固化起始温度的温度下进行热固化。
    • 7. 发明公开
    • CHIP ANTENNA
    • EP3157097A1
    • 2017-04-19
    • EP15806550.8
    • 2015-05-18
    • NTN Corporation
    • SONOZAKI, TomokazuNODA, HiroyukiMORI, Natsuhiko
    • H01Q1/38H01Q1/40
    • H01Q1/2283H01Q1/36H01Q1/38H01Q1/40
    • Provided is a chip antenna (1), including: an antenna pattern (3) formed through bending a conductive plate into a three-dimensional shape; and a base body (2), which is formed through injection molding a resin with the antenna pattern (3) being inserted, and has a hexahedral shape holding the antenna pattern (3) on a surface thereof, the antenna pattern (3) including: an antenna part (31), which is held on an upper surface of the base body (2), and has a substantially rectangular shape; and a plurality of terminal parts (32), which are held on a lower surface of the base body (2), and are arranged along long sides of the antenna part (31), each of the plurality of terminal parts (32) being soldered to a circuit board (10), in which the antenna pattern (13) further includes a band-shaped protruding part (34), which extends in a long-side direction of the antenna part (31), and is embedded in the base body (2), and the band-shaped protruding part (34) is provided at least along a range of each of two long sides of the antenna part (31) excluding a range in which the plurality of terminal parts (32) are arranged.
    • 提供了一种芯片天线(1),包括:通过将导电板弯曲成三维形状而形成的天线图案(3) 和基体(2),所述基体(2)通过在插入所述天线图案(3)的情况下通过注射成型树脂形成,并且具有将所述天线图案(3)保持在其表面上的六面体形状,所述天线图案(3)包括 :保持在基体(2)的上表面的天线部(31),其具有大致矩形形状; 以及保持在所述基体(2)的下表面上且沿着所述天线部(31)的长边排列的多个端子部(32),所述多个端子部(32) 焊接到电路板(10),其中天线图案(13)还包括沿天线部分(31)的长边方向延伸的带状突出部分(34),并且嵌入 所述带状突起部34至少沿着所述天线部31的两个长边中的除了所述多个端子部32的范围之外的范围而设置, 安排。