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1. 发明公开

EP3081883A1 PIPING STRUCTURE, COOLING DEVICE USING SAME, AND REFRIGERANT VAPOR TRANSPORT METHOD 审中-公开
标题翻译： ROHRSTRUKTUR，KÜHLVORRICHTUNGDAMIT UNDKÄLTEMITTELDAMPFTRANSPORTVERFAHREN
公开(公告)号：EP3081883A1
公开(公告)日：2016-10-19
申请号：EP14861773.1
申请日：2014-11-10
申请人： NEC Corporation , NEC Platforms, Ltd.
发明人： CHIBA, Masaki , YOSHIKAWA, Minoru , SHOUJIGUCHI, Akira , INABA, Kenichi , MATSUNAGA, Arihiro , SATO, Masanori , HOSAKA, Tadao , NAKAMURA, Yasuhito
IPC分类号： F25B41/00 , F16L23/02 , H05K7/20
CPC分类号： F25B41/003 , F16L41/086 , F25B23/006 , F25B2500/01
摘要： It is difficult to avoid a decrease in cooling capacity without causing an increase in power consumption if a cooling device including a piping structure grows in size, therefore, a piping structure according to an exemplary aspect of the present invention includes a tubular part including a first flow passage through which a refrigerant flowing and a shell region surrounding the first flow passage; an introduction part composing a part of the shell region and including a second flow passage connected to the first flow passage; and a connection located at an end, between ends of the introduction part, on the side opposite to an end on a side where the second flow passage being connected to the first flow passage.
摘要翻译：如果包括管道结构的冷却装置的尺寸增大，则难以避免冷却能力下降而不引起功率消耗的增加，因此，根据本发明的示例性方面的管道结构包括管状部件，其包括第一流过制冷剂的流动通道和围绕第一流动通道的壳体区域; 引导部分，构成壳体区域的一部分，并且包括连接到第一流动通道的第二流动通道; 以及位于所述导入部的端部之间的端部的与所述第二流路连接到所述第一流路的一侧的端部相反的一侧的连接。

2. 发明授权

EP3089571B1 COOLING SYSTEM AND ELECTRONIC APPARATUS 有权转让
公开(公告)号：EP3089571B1
公开(公告)日：2019-01-30
申请号：EP14873921.2
申请日：2014-12-02
申请人： NEC Platforms, Ltd.
发明人： NAKAMURA, Yasuhito , FUJII, Shunsuke
IPC分类号： H05K7/20 , G06F1/20 , F28D15/02

3. 发明公开

EP3364139A1 COOLING DEVICE AND COOLANT RELAY DEVICE 有权
公开(公告)号：EP3364139A1
公开(公告)日：2018-08-22
申请号：EP16855125.7
申请日：2016-10-14
申请人： NEC Platforms, Ltd.
发明人： NAKAMURA, Yasuhito , FUJII, Shunsuke
IPC分类号： F28D15/02 , H05K7/20
CPC分类号： F28D15/06 , F28D15/02 , F28D15/0266 , H05K7/20
摘要： [Problem] To provide a cooling device able to efficiently cool heat from a heat generating body.
[Solution] A refrigerant relay device 1300 is provided with a casing 1310, a first refrigerant inflow opening 1360, a first refrigerant outflow opening 1350, and refrigerant inflow piping 1370. The casing 1310 retains liquid-phase refrigerant and gas-phase refrigerant. The liquid-phase refrigerant is made to flow into the casing 1310 through the first refrigerant inflow opening 1360. The gas-phase refrigerant is made to flow out to the outside of the casing 1310 through the first refrigerant outflow opening 1350. In the refrigerant inflow piping 1370, one end is connected to the first refrigerant inflow opening 1360 and an opening 1371 is formed at the other end. The liquid-phase refrigerant flowing into the first refrigerant inflow opening 1360 is made to flow into the casing 1310 through the refrigerant inflow piping 1370 from the opening 1371. The opening 1371 is positioned so as to face the bottom part 1311 of the casing 1310.

4. 发明公开

EP3089571A1 COOLING SYSTEM AND ELECTRONIC APPARATUS 有权转让
标题翻译： ELEKTRONISCHE VORRICHTUNG的KÜHLSYSTEM
公开(公告)号：EP3089571A1
公开(公告)日：2016-11-02
申请号：EP14873921.2
申请日：2014-12-02
申请人： NEC Platforms, Ltd.
发明人： NAKAMURA, Yasuhito , FUJII, Shunsuke
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： F28D15/0266 , F28D15/0208 , F28D15/0241 , F28D15/06 , F28D2015/0216 , F28F2265/12 , G06F1/20 , H05K7/20318 , H05K7/20818
摘要： To prevent lowering of cooling efficiency of a cooling system that uses a refrigerant. A cooling system S3 is provided with: an evaporator 3, which includes a tubing inlet 17, and which absorbs heat radiated from a server rack 1 using a refrigerant; a heat exchanger 13, which includes a tubing inlet 19 at a higher position than the tubing inlet 17, and which cools the refrigerant; a bendable flexible pipe 10, which is connected to the tubing inlet 17 and the tubing inlet 19, and which serves as a flow path for the refrigerant; and a platform 12, which has a surface which is sloped higher at one end portion than another end portion, and wherein the flexible pipe 10 is placed on said surface so as to be positioned higher at the side to which the tubing inlet 19 is connected than the side to which the tubing inlet 17 is connected.
摘要翻译：为了防止降低使用制冷剂的冷却系统的冷却效率。冷却系统S3设有：蒸发器3，其包括管道入口17，并且使用制冷剂吸收从服务器架1辐射的热量; 热交换器13，其包括在比管道入口17更高的位置处的管道入口19，并且冷却制冷剂; 可弯曲的柔性管10，其连接到管道入口17和管道入口19，并且其用作制冷剂的流动路径; 以及平台12，其具有在一个端部比另一个端部更高的表面，并且其中柔性管10被放置在所述表面上，以便在管道入口19连接的一侧被定位得更高比管道入口17连接的一侧。

5. 发明公开

EP4043137A1 JOINT MEMBER, METHOD FOR PRODUCING JOINT MEMBER, AND METHOD FOR CONNECTING FLEXIBLE TUBE TO JOINT MEMBER 审中-实审
公开(公告)号：EP4043137A1
公开(公告)日：2022-08-17
申请号：EP20888661.4
申请日：2020-11-02
申请人： NEC Platforms, Ltd.
发明人： NAKAMURA, Yasuhito
IPC分类号： B23K1/14 , F16L13/08
摘要： A joint member includes a joint main body configured to include a flow path portion formed and an opening portion communicating with the flow path portion, and a tube member configured to include an end portion inserted into the opening portion of the joint main body and joined to the joint main body by brazing. The joint main body includes a step portion on which the end portion of the tube member inserted into the opening portion abuts. The tube member includes an annular recessed portion recessed from an outer peripheral surface of the tube member and formed on a flexible tube side with respect to an end surface on a joint main body side.

6. 发明公开

EP3364140A1 COOLING DEVICE AND COOLING SYSTEM 有权
公开(公告)号：EP3364140A1
公开(公告)日：2018-08-22
申请号：EP16855126.5
申请日：2016-10-14
申请人： NEC Platforms, Ltd.
发明人： NAKAMURA, Yasuhito , FUJII, Shunsuke
IPC分类号： F28D15/02 , H05K7/20
CPC分类号： F28D15/0266 , F28D15/02 , F28D15/0241 , F28D15/0275 , F28D2021/0028 , H05K7/20
摘要： [Problem]
To minimize any increase in space for installation.
[Solution]
A cooling device 120 according to the present invention is provided with: an evaporator 127 positioned on a rear-surface door provided in a casing 121 in such a manner as to allow opening and closing; a refrigerant relay 112 provided above the casing 121 to connect with the evaporator; and a bendable flexible tube 123, one end of which being connected to the evaporator 127 and the other end of which being connected to a side of the refrigerant relay 112 that is different from the side in which the evaporator 127 is positioned. At least a part of the flexible tube 123 is positioned below the refrigerant relay 112 so as to cross the refrigerant relay 112.

7. 发明公开

EP4340560A1 COOLING COMPONENT 审中-实审
公开(公告)号：EP4340560A1
公开(公告)日：2024-03-20
申请号：EP22819956.8
申请日：2022-04-20
申请人： NEC Platforms, Ltd.
发明人： NAKAMURA, Yasuhito
IPC分类号： H05K7/20 , H01L23/473
摘要： In order to make it possible to provide a cooling component which can substantially uniformly cool a cooling target object, this cooling component comprises: a heat receiving plate that receives heat from the cooling target object; a plurality of heat dissipating plates disposed at predetermined intervals on the heat receiving plate; a refrigerant supplying means for supplying a refrigerant to the plurality of heat dissipating plates; a refrigerant discharging means to which the refrigerant is supplied from the plurality of heat dissipating plates; and a refrigerant passing member in which a plurality of through-holes through which the refrigerant passes are formed, wherein the refrigerant supplied by the refrigerant supplying means passes through some of the through-holes, while the refrigerant that passes through the remainder of the plurality of through-holes is discharged by the refrigerant discharging means, and some of the plurality of through-holes and the remainder of the plurality of through-holes are adjacent to each other.

8. 发明公开

EP4060726A1 COOLING SYSTEM AND ELECTRONIC APPARATUS 审中-实审
公开(公告)号：EP4060726A1
公开(公告)日：2022-09-21
申请号：EP20887317.4
申请日：2020-10-30
申请人： NEC Platforms, Ltd.
发明人： NAKAMURA, Yasuhito
IPC分类号： H01L23/473 , G06F1/20 , H05K7/20
摘要： A cooling system includes a first module, a second module provided at a different position in a depth direction of a housing with respect to the first module, a third module provided at a different position in a width direction of the housing with respect to the first module and the second module, an upstream side tube configured to supply a cooling medium to a cooling member of the first module, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to a cooling member of the second module, and a branch tube configured to branch from the downstream side tube and supply the cooling medium to a cooling member of the third module.

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