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    • 2. 发明公开
    • FIELD EFFECT TRANSISTOR
    • FELDEFFEKTTRANSISTOR
    • EP1962338A4
    • 2009-07-15
    • EP06834508
    • 2006-12-12
    • NEC CORP
    • MATSUNAGA KOUJIOTA KAZUKIOKAMOTO YASUHIRONAKAYAMA TATSUOWAKEJIMA AKIOANDO YUJIMIYAMOTO HIRONOBUINOUE TAKASHIMURASE YASUHIRO
    • H01L21/338H01L21/335H01L29/06H01L29/778H01L29/812
    • H01L29/7787H01L29/2003H01L29/66462
    • A semiconductor device (100) is provided with an undoped GaN electron transport layer (105); an AlGaN electron supply layer (106) arranged in contact with the undoped GaN electron transport layer (105); an undoped GaN layer (107) arranged on the AlGaN electron supply layer (106); a source electrode (101) and a drain electrode (103) arranged on the undoped GaN layer (107), being separated from one another; a recessed section (111), which is arranged in a region between the source electrode (101) and the drain electrode (103) and penetrating the undoped GaN layer (107); a gate electrode (102) which is embedded in the recessed section (111) and being brought into contact with the AlGaN electron supply layer (106) at the bottom plane; and a SiN film (108) arranged on the undoped GaN layer (107) in the region between the gate electrode (102) and the drain electrode (103).
    • 半导体器件(100)设置有未掺杂的GaN电子传输层(105); 与未掺杂的GaN电子传输层(105)接触布置的AlGaN电子供应层(106); 布置在所述AlGaN电子供给层(106)上的未掺杂的GaN层(107); 布置在未掺杂的GaN层(107)上的源电极(101)和漏电极(103),彼此分离; 设置在所述源电极与所述漏电极之间的区域并贯穿所述未掺杂的GaN层的凹部; 嵌入凹部(111)内并在底面与AlGaN电子供给层(106)接触的栅电极(102) 以及在栅电极(102)和漏电极(103)之间的区域中布置在未掺杂的GaN层(107)上的SiN膜(108)。