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1. 发明公开

EP1212791A1 METHOD AND STRUCTURE FOR MANUFACTURING IMPROVED YIELD SEMICONDUCTOR PACKAGED DEVICES 审中-公开
标题翻译：方法与结构半导体HOUSINGS具有高产量的处理
公开(公告)号：EP1212791A1
公开(公告)日：2002-06-12
申请号：EP00950840.9
申请日：2000-07-28
申请人： Micron Technology, Inc.
发明人： JIANG, Tongbi
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/12 , H01L23/053
CPC分类号： H01L24/16 , H01L23/49827 , H01L24/11 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05599 , H01L2224/13099 , H01L2224/16237 , H01L2224/29013 , H01L2224/29036 , H01L2224/2919 , H01L2224/30131 , H01L2224/32014 , H01L2224/48 , H01L2224/73203 , H01L2224/81136 , H01L2224/81192 , H01L2224/81903 , H01L2224/83194 , H01L2224/8385 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01045 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2224/45099
摘要： A semiconductor package structure for a ball grid array type package using a plurality of pieces of adhesive elastomer film to attach a semiconductor die to a substrate having conductive traces in order to alleviate thermal mismatch stress between the semiconductor die and the printed circuit board to which the packaged device is soldered, while maintaining the reliability of the packaged device itself.

2. 发明公开

EP2186135A1 PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH- BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME 审中-公开
标题翻译：封装的集成电路器件与身体通路及其制备方法
公开(公告)号：EP2186135A1
公开(公告)日：2010-05-19
申请号：EP08835386.7
申请日：2008-08-01
申请人： Micron Technology, INC.
发明人： JIANG, Tongbi , CHIA, Yong Poo
IPC分类号： H01L25/10 , H01L23/538
CPC分类号： H01L25/071 , H01L21/561 , H01L21/568 , H01L21/76877 , H01L21/82 , H01L23/3107 , H01L23/3114 , H01L23/3142 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/27 , H01L24/32 , H01L24/83 , H01L24/96 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2221/68359 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/32145 , H01L2224/83193 , H01L2224/838 , H01L2225/06548 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.
摘要翻译：的装置是游离缺失盘包括至少一个集成电路，其中，至少一个，其在密封剂材料的主体定位的所有部分，以及经由通过密封剂材料的主体延伸的至少一个导电。

3. 发明公开

EP3528285A1 PACKAGE WITH INTEGRATED CIRCUIT DEVICES EMBEDDED IN ENCAPSULATING COMPOUND AND WITH CONDUCTIVE VIAS THROUGH THE ENCAPSULATING COMPOUND, AND METHODS OF MAKING SAME 审中-公开
公开(公告)号：EP3528285A1
公开(公告)日：2019-08-21
申请号：EP19163220.7
申请日：2008-08-01
申请人： Micron Technology, Inc.
发明人： JIANG, Tongbi , CHIA, Yong Poo
IPC分类号： H01L25/10 , H01L23/538 , H01L21/56 , H01L23/31
摘要： A device (400) is disclosed which includes at least one integrated circuit die (12), at least a portion of which is positioned in a body of encapsulant material (20), and at least one conductive via (32,34) extending through the body of encapsulant material.

4. 发明公开

EP2406816A1 METHOD FOR FABRICATING SEMICONDUCTOR COMPONENTS USING MASKLESS BACK SIDE ALIGNMENT TO CONDUCTIVE VIAS 有权
标题翻译：用于生产半导体元件由未BACK取向对线
公开(公告)号：EP2406816A1
公开(公告)日：2012-01-18
申请号：EP10751155.2
申请日：2010-02-10
申请人： Micron Technology, Inc.
发明人： LI, Jin , JIANG, Tongbi
IPC分类号： H01L21/60 , H01L21/02 , H01L21/68 , H01L29/40
CPC分类号： H01L21/76898 , H01L21/6836 , H01L24/16 , H01L24/96 , H01L25/0657 , H01L25/50 , H01L2221/68359 , H01L2221/68372 , H01L2221/68381 , H01L2224/02372 , H01L2224/0401 , H01L2224/05008 , H01L2224/05025 , H01L2224/05111 , H01L2224/05118 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05178 , H01L2224/0518 , H01L2224/05181 , H01L2224/05184 , H01L2224/0557 , H01L2224/05611 , H01L2224/05644 , H01L2224/05664 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/27416 , H01L2224/83102 , H01L2224/92125 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/3511 , H01L2224/05552 , H01L2924/00 , H01L2924/013
摘要： A method for fabricating semiconductor components (90) includes the steps of: providing a semiconductor substrate (52) having a circuit side (54), a back side (56) and conductive vias (58); removing portions of the substrate (52) from the back side (56) to expose terminal portions (76) of the conductive vias (58); depositing a polymer layer (78) on the back side (56) encapsulating the terminal portions (76); and then planarizing the polymer layer (78) and ends of the terminal portions (76) to form self aligned conductors embedded in the polymer layer (78). Additional back side elements, such as terminal contacts (86) and back side redistribution conductors (88), can also be formed in electrical contact with the conductive vias (58). A semiconductor component (90) includes the semiconductor substrate (52), the conductive vias (58), and the back side conductors embedded in the polymer layer (78). A stacked semiconductor component (96) includes a plurality of components (90-1, 90-2, 90-3) having aligned conductive vias (58) in electrical communication with one another.

5. 发明公开

EP1747591A1 COVERS FOR MICROELECTRONIC IMAGERS AND METHODS FOR WAFER-LEVEL PACKAGING OF MICROELECTRONIC IMAGERS 有权转让
标题翻译：涵盖用于封装电子MICRO DEVICES图圆片级MICRO DEVICES电子影像和方法
公开(公告)号：EP1747591A1
公开(公告)日：2007-01-31
申请号：EP05741899.8
申请日：2005-04-27
申请人： MICRON TECHNOLOGY, INC.
发明人： JIANG, Tongbi , BROOKS, J., Michael
IPC分类号： H01L31/0203
CPC分类号： H01L31/0203 , B33Y80/00 , H01L27/146 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/02325 , H01L2224/48227 , H04N5/2253 , H04N5/2254 , H01L2224/48091 , H01L2924/00014
摘要： Methods for forming and attaching covers to microelectronic imaging units, packaging microelectronic imagers at the wafer level, and microelectronic imagers having covers that protect the image sensor are disclosed herein. In one embodiment, a method includes providing a first substrate having a plurality of covers, the covers including windows comprising regions of the first substrate and stand-offs projecting from the windows. The method continues by providing a second substrate having a plurality of microelectronic dies with image sensors, integrated circuits electrically coupled to the image sensors, and terminals electrically coupled to the integrated circuits. The method includes assembling the covers with corresponding dies so that the windows are aligned with corresponding image sensors and stand-offs contact corresponding dies inboard of the terminals and outboard of the image sensors. The first substrate is then cut to singulate the individual covers, after which the second substrate is cut to singulate individual imaging units.
摘要翻译：用于形成和附着到覆盖微电子成像单元，在晶片级封装微电子成像器，以及具有覆盖微电子成像方法确实保护图像传感器在盘游离缺失。在一个，实施例的方法包括：提供具有盖的多个A第一基板，盖包括包含所述第一基板和支座从窗户投射的区域的窗口。该方法继续通过提供具有图像传感器的微电子此的多个A第二基板，集成电路电耦合到所述图像传感器，并且端子电耦合到所述集成电路。该方法包括：与对应此象的窗口与相应的图像传感器对准，并且支座接触对应图像传感器的终端和外侧的内侧这个组装盖。然后，第一衬底被切割成单个化各个盖，afterwhich第二基板切割成单个化各个成像单元。

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