会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 10. 发明公开
    • SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE
    • 用于安装电子元件的基板以及电子装置
    • EP3196940A1
    • 2017-07-26
    • EP15842560.3
    • 2015-03-26
    • KYOCERA Corporation
    • SAKAI, MitsuharuYAMASAKI, ShouINUYAMA, ShigetoshiNIINO, Noritaka
    • H01L27/14H01L23/02H01L31/02H01L33/62H04N5/335H05K3/46
    • H01L33/483H01L23/053H01L23/49822H01L27/14H01L27/14618H01L27/14625H01L27/14636H01L31/02H01L31/02002H01L31/0203H01L31/02325H01L33/58H01L33/62H01L2224/48091H01L2224/49175H01L2224/73265H01L2924/16151H01L2924/16152H04N5/335H05K1/021H05K3/0061H05K3/4629H05K3/4688H05K2201/10121H05K2203/049H01L2924/00014
    • There are provided an electronic device mounting substrate and an electronic apparatus which are capable of enhancement in impact resistance. An electronic device mounting substrate (1) according to one aspect of the invention includes: a first wiring substrate (2) shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole (2a); a second wiring substrate (6) shaped in a rectangular frame or plate, the second wiring substrate (6) being disposed so as to overlie a lower surface of the first wiring substrate (2) and be electrically connected to the first wiring substrate (2), one of outer edges of the second wiring substrate (6) being located more outward than a corresponding one of outer edges of the first wiring substrate (2); a metallic plate (4) disposed so as to overlie a lower surface of the second wiring substrate (6) so that the second wiring substrate (6) is sandwiched between the metallic plate (4) and the first wiring substrate (2), outer edges of the metallic plate (4) being located more outward than the outer edges of the first wiring substrate (2) and more inward than the one of the outer edges of the second wiring substrate (6); and a lens holder (5) which is a lid body secured to an outer periphery of the metallic plate (4), with the one of the outer edges of the second wiring substrate (6) lying in between, so as to cover the first wiring substrate (2) and the second wiring substrate (6). A frame interior of the first wiring substrate (2), or a frame interior of each of the first wiring substrate (2) and the second wiring substrate (6), constitutes an electronic device mounting space (11).
    • 提供了一种能够提高耐冲击性的电子器件安装基板和电子设备。 根据本发明的一个方面的电子器件安装基板(1)包括:形成为矩形框架的第一配线基板(2),所述矩形框架的内部构成第一通孔(2a); 形成为矩形框架或板的第二布线基板(6),所述第二布线基板(6)被布置为覆盖所述第一布线基板(2)的下表面并且与所述第一布线基板(2)电连接 ),所述第二布线基板(6)的外边缘中的一个位于比所述第一布线基板(2)的外边缘中的相应一个外边缘更向外的位置; (6)的下表面上设置的金属板(4),使得第二布线衬底(6)夹在金属板(4)和第一布线衬底(2)之间,外部 所述金属板(4)的边缘位于比所述第一布线基板(2)的外边缘更靠外侧且比所述第二布线基板(6)的所述一个外边缘更靠内侧的位置。 以及作为盖体的透镜支架(5),该盖体固定在金属板(4)的外周上,第二布线基板(6)的一个外边缘位于其间,以覆盖第一 配线基板(2)和第二配线基板(6)。 第一布线基板(2)的框架内部或第一布线基板(2)和第二布线基板(6)中的每一个的框架内部构成电子器件安装空间(11)。