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1. 发明公开

EP4400762A1 LIGHT-EMITTING DEVICE 审中-实审
公开(公告)号：EP4400762A1
公开(公告)日：2024-07-17
申请号：EP22867280.4
申请日：2022-09-01
申请人： Kyocera Corporation
发明人： NIINO, Noritaka
IPC分类号： F21V8/00 , F21K9/61 , F21K9/64 , F21Y115/30 , F21V9/32
CPC分类号： F21Y2115/3020160801 , F21K9/61 , F21V9/32 , G02B6/00 , F21K9/64
摘要： A light-emitting member includes an optical fiber that receives first excitation light and first mixed light. The optical fiber includes a first wavelength converter that emits first fluorescence in response to the first excitation light, and emits second mixed light being a mixture of the first mixed light and the first fluorescence through a side surface. The light-emitting member includes a light-emitting portion that emits the second mixed light outside the light-emitting member. A plurality of component light beams of the first mixed light includes first component light with a first peak wavelength and second component light with a second peak wavelength longer than the first peak wavelength. An absolute value of a difference between a first fluorescence peak wavelength of the first fluorescence and the first peak wavelength is less than an absolute value of a difference between the first fluorescence peak wavelength and the second peak wavelength.

2. 发明公开

EP3395242A1 MEASURING SENSOR PACKAGE AND MEASURING SENSOR 有权
公开(公告)号：EP3395242A1
公开(公告)日：2018-10-31
申请号：EP16878189.6
申请日：2016-11-10
申请人： KYOCERA Corporation
发明人： OODE, Yasushi , ITO, Hiroki , SUGIMOTO, Yoshimasa , NIINO, Noritaka , MATSUNAGA, Shogo , HAYASHI, Takuya
IPC分类号： A61B5/026 , A61B5/02
CPC分类号： A61B5/0261 , A61B5/02 , A61B5/026 , A61B5/6826
摘要： A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package (1) includes a substrate (2), a lid (3), and a ground conductor layer (4). The substrate (2) contains a light emitter and a light receiver, and includes a substrate body (20), a plurality of ground via conductors (21), an frame-shaped ground conductor layer (22), signal wiring conductors (23), and an external connection terminal (24). The ground via conductors (21) are connectable to a ground potential, and are located outward from a first recess (20a) and a second recess (20b) included in the substrate body (20) in a plan view.

3. 发明公开

EP3440998A1 MEASUREMENT SENSOR PACKAGE AND MEASUREMENT SENSOR 有权
公开(公告)号：EP3440998A1
公开(公告)日：2019-02-13
申请号：EP17778883.3
申请日：2017-02-22
申请人： Kyocera Corporation
发明人： OODE, Yasushi , ITO, Hiroki , SUGIMOTO, Yoshimasa , NIINO, Noritaka , MATSUNAGA,Shogo , HAYASHI, Takuya
IPC分类号： A61B5/0285 , A61B5/026
摘要： A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package (11) includes a substrate (2), a lid (3), a ground conductor layer (4), a metallic thin layer (5), and a bond (6). The ground conductor layer (4) and the metallic thin layer (5) are arranged inside the bond (6) that extends continuously as viewed through from above. The bond (6) directly bonds a first main surface (21) of a substrate body (20) and a facing surface (3a) of the lid (3) together along the entire periphery. This improves the reliability in strength.

4. 发明公开

EP4239240A1 OPTICAL CONNECTION STRUCTURE AND ILLUMINATION SYSTEM 审中-实审
公开(公告)号：EP4239240A1
公开(公告)日：2023-09-06
申请号：EP21886387.6
申请日：2021-10-29
申请人： Kyocera Corporation
发明人： NIINO, Noritaka , TAKEUCHI, Eri , AKASHI, Tomoyoshi
IPC分类号： F21S2/00 , F21V7/28 , F21V7/30 , F21V8/00 , F21V9/32 , F21V29/502 , F21V29/76 , G02B6/26 , F21W131/20 , F21Y115/30
摘要： A wavelength converter emits light in response to laser light emitted from a light emitter. The wavelength converter includes a surface including a first area to directly receive the laser light from the light emitter, and a second area located on a member. The light emitted from the wavelength converter includes a first component emitted directly from the wavelength converter and input directly into the light receiver, and a second component emitted from the second area, reflected from the member, and input into the light receiver. The member includes a surface including a third area to receive the second component. The third area has a reflectance for the light greater than a reflectance of the wavelength converter for the light in the second area.

5. 发明公开

EP4020319A1 RFID TAG 无效
公开(公告)号：EP4020319A1
公开(公告)日：2022-06-29
申请号：EP20858893.9
申请日：2020-08-13
申请人： Kyocera Corporation
发明人： FUKUMOTO, Katsuhiko , NIINO, Noritaka
IPC分类号： G06K19/077 , G06K19/07 , G09G5/00 , G09G5/22 , G09G5/24
摘要： An RFID tag includes an IC for RFID to which information for presentation can be written by wireless communication, a display, and a control circuit configured to output presentation data to the display. The control circuit includes a font repository storing font data 242 and a data processor configured to create the presentation data by using one or more character codes and the font data, the one or more character codes being included in the information for presentation.

6. 发明公开

EP4130562A1 OPTICAL CONVERTING DEVICE, AND ILLUMINATING SYSTEM 审中-实审
公开(公告)号：EP4130562A1
公开(公告)日：2023-02-08
申请号：EP21779630.9
申请日：2021-03-31
申请人： Kyocera Corporation
发明人： NIINO, Noritaka , YAMADA, Ryuji
IPC分类号： F21V8/00 , F21V29/502 , F21V29/70 , F21Y115/10 , F21Y115/30 , H01L33/50 , G02B5/20 , G02B5/26 , F21V7/08 , F21V7/26 , F21V7/28 , H01S5/022
摘要： A photoconversion device includes a first wavelength converter and a long-pass filter. The first wavelength converter receives excitation light from an output portion and emits fluorescence having a longer wavelength than the excitation light. The long-pass filter transmits the fluorescence emitted by the first wavelength converter and reflects the excitation light transmitted through or reflected from the first wavelength converter to enter the first wavelength converter.

7. 发明公开

EP3961504A1 RFID TAG 审中-实审
公开(公告)号：EP3961504A1
公开(公告)日：2022-03-02
申请号：EP20795092.4
申请日：2020-04-17
申请人： Kyocera Corporation
发明人： SUGIMOTO, Yoshimasa , NIINO, Noritaka
IPC分类号： G06K19/077 , G06K19/07 , H01Q9/16
摘要： The present invention addresses the problem of maximizing a communicable distance for an RFID tag having a structure in which an antenna conductor is accommodated in a housing. An RFID tag (1) comprises: a circuit board (20) having a main part (20A), and an extension part (20B) that extends along an edge of the main part (20A) and includes an antenna conductor (28); an RFID IC (25) mounted on the circuit board (20); a functional module (33) disposed overlapping the circuit board (20); a housing (10) accommodating the circuit board (20) and the functional module (33); and a lid (40) for closing an opening of the housing (10). The lid (40) side of the circuit board (20) is covered by the functional module (33) at a positon where the main part (20A) of the circuit board (20) is separated from an inner bottom surface (S2) of the housing (10), whereby the extension part (20B) of the circuit board (20) is held in midair.

8. 发明公开

EP3410127A1 MEASUREMENT SENSOR PACKAGE AND MEASUREMENT SENSOR 审中-公开
公开(公告)号：EP3410127A1
公开(公告)日：2018-12-05
申请号：EP16888105.0
申请日：2016-11-10
申请人： Kyocera Corporation
发明人： OODE, Yasushi , ITO, Hiroki , SUGIMOTO, Yoshimasa , NIINO, Noritaka , MATSUNAGA, Shogo , HAYASHI, Takuya
IPC分类号： G01P5/26 , A61B5/02 , A61B5/0285 , G01P5/00
CPC分类号： A61B5/0285 , A61B5/0059 , A61B5/02 , A61B5/02141 , A61B5/0261 , A61B5/7203 , A61B2562/0233 , G01P5/00 , G01P5/26
摘要： A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package (1) includes a substrate (2). The substrate (2) includes a first recess (20a) including a first bottom surface (20d) on which a light emitter is mountable, and a first step surface (20f) having a first connection pad (23a) thereon, a second recess (20b) including a second bottom surface (20e) on which a light receiver is mountable, and a second step surface (20g) having a second connection pad (23b) thereon. In a direction connecting a center (c1) of the first bottom surface (20d) and a center (c2) of the second bottom surface (20e) in a plan view, the first step surface (20f) is located outward from the first bottom surface (20d) and the second step surface (20g) is located outward from the second bottom surface (20e).

9. 发明授权

EP2960935B1 PACKAGE FOR HOUSING AN ELECTRONIC COMPONENT AND ELECTRONIC DEVICE 有权
标题翻译：外壳电子元件和电子装置的封装
公开(公告)号：EP2960935B1
公开(公告)日：2018-04-04
申请号：EP14753751.8
申请日：2014-02-25
申请人： KYOCERA Corporation
发明人： NIINO, Noritaka
IPC分类号： H01L23/26 , H01L23/057
CPC分类号： H05K1/185 , H01L23/057 , H01L23/26 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2924/1461 , H05K1/0296 , H05K1/0306 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM To provide: a package for housing an electronic component, wherein a metal portion formed of a getter metal material exhibits high bonding strength to an insulating substrate; and an electronic device. SOLUTION A package for housing an electronic component, which is provided with: a substrate part that comprises an insulating substrate (1), which is formed of a ceramic sintered body and comprises a recess portion (2), and a wiring conductor (5) which is provided on the insulating substrate (1); and a metal portion (3) which is formed of a sintered body of a getter metal material and is directly bonded to the recess portion (2). An electronic device which is provided with this package for housing an electronic component and an electronic component (6) which is housed within the recess portion (2).

10. 发明公开

EP3196940A1 SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE 有权
标题翻译：用于安装电子元件的基板以及电子装置
公开(公告)号：EP3196940A1
公开(公告)日：2017-07-26
申请号：EP15842560.3
申请日：2015-03-26
申请人： KYOCERA Corporation
发明人： SAKAI, Mitsuharu , YAMASAKI, Shou , INUYAMA, Shigetoshi , NIINO, Noritaka
IPC分类号： H01L27/14 , H01L23/02 , H01L31/02 , H01L33/62 , H04N5/335 , H05K3/46
CPC分类号： H01L33/483 , H01L23/053 , H01L23/49822 , H01L27/14 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L31/02 , H01L31/02002 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2924/16151 , H01L2924/16152 , H04N5/335 , H05K1/021 , H05K3/0061 , H05K3/4629 , H05K3/4688 , H05K2201/10121 , H05K2203/049 , H01L2924/00014
摘要： There are provided an electronic device mounting substrate and an electronic apparatus which are capable of enhancement in impact resistance. An electronic device mounting substrate (1) according to one aspect of the invention includes: a first wiring substrate (2) shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole (2a); a second wiring substrate (6) shaped in a rectangular frame or plate, the second wiring substrate (6) being disposed so as to overlie a lower surface of the first wiring substrate (2) and be electrically connected to the first wiring substrate (2), one of outer edges of the second wiring substrate (6) being located more outward than a corresponding one of outer edges of the first wiring substrate (2); a metallic plate (4) disposed so as to overlie a lower surface of the second wiring substrate (6) so that the second wiring substrate (6) is sandwiched between the metallic plate (4) and the first wiring substrate (2), outer edges of the metallic plate (4) being located more outward than the outer edges of the first wiring substrate (2) and more inward than the one of the outer edges of the second wiring substrate (6); and a lens holder (5) which is a lid body secured to an outer periphery of the metallic plate (4), with the one of the outer edges of the second wiring substrate (6) lying in between, so as to cover the first wiring substrate (2) and the second wiring substrate (6). A frame interior of the first wiring substrate (2), or a frame interior of each of the first wiring substrate (2) and the second wiring substrate (6), constitutes an electronic device mounting space (11).
摘要翻译：提供了一种能够提高耐冲击性的电子器件安装基板和电子设备。根据本发明的一个方面的电子器件安装基板（1）包括：形成为矩形框架的第一配线基板（2），所述矩形框架的内部构成第一通孔（2a）; 形成为矩形框架或板的第二布线基板（6），所述第二布线基板（6）被布置为覆盖所述第一布线基板（2）的下表面并且与所述第一布线基板（2）电连接），所述第二布线基板（6）的外边缘中的一个位于比所述第一布线基板（2）的外边缘中的相应一个外边缘更向外的位置; （6）的下表面上设置的金属板（4），使得第二布线衬底（6）夹在金属板（4）和第一布线衬底（2）之间，外部所述金属板（4）的边缘位于比所述第一布线基板（2）的外边缘更靠外侧且比所述第二布线基板（6）的所述一个外边缘更靠内侧的位置。以及作为盖体的透镜支架（5），该盖体固定在金属板（4）的外周上，第二布线基板（6）的一个外边缘位于其间，以覆盖第一配线基板（2）和第二配线基板（6）。第一布线基板（2）的框架内部或第一布线基板（2）和第二布线基板（6）中的每一个的框架内部构成电子器件安装空间（11）。

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