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1. 发明公开

EP3395242A1 MEASURING SENSOR PACKAGE AND MEASURING SENSOR 有权
公开(公告)号：EP3395242A1
公开(公告)日：2018-10-31
申请号：EP16878189.6
申请日：2016-11-10
申请人： KYOCERA Corporation
发明人： OODE, Yasushi , ITO, Hiroki , SUGIMOTO, Yoshimasa , NIINO, Noritaka , MATSUNAGA, Shogo , HAYASHI, Takuya
IPC分类号： A61B5/026 , A61B5/02
CPC分类号： A61B5/0261 , A61B5/02 , A61B5/026 , A61B5/6826
摘要： A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package (1) includes a substrate (2), a lid (3), and a ground conductor layer (4). The substrate (2) contains a light emitter and a light receiver, and includes a substrate body (20), a plurality of ground via conductors (21), an frame-shaped ground conductor layer (22), signal wiring conductors (23), and an external connection terminal (24). The ground via conductors (21) are connectable to a ground potential, and are located outward from a first recess (20a) and a second recess (20b) included in the substrate body (20) in a plan view.

2. 发明公开

EP4411804A1 SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：EP4411804A1
公开(公告)日：2024-08-07
申请号：EP22876285.2
申请日：2022-09-28
申请人： Kyocera Corporation
发明人： SUGIMOTO, Yoshimasa
IPC分类号： H01L23/12 , H05K1/14
CPC分类号： H05K1/14 , H01L23/12
摘要： A semiconductor element mounting substrate includes a first substrate, a second substrate, a third substrate, a side surface conductor positioned on an inner surface of a groove and connected to a signal line, a first recess and a second recess positioned to extend from a third top surface of the third substrate to a first bottom surface of the first substrate and positioned side by side with the groove interposed therebetween, and a first side surface ground conductor and a second side surface ground conductor respectively positioned on inner surfaces of the first recess and the second recess. A width reduction portion is provided in which a spacing between the first recess and the second recess is smaller at the top of the width reduction portion than at the bottom of the width reduction portion.

3. 发明公开

EP3961504A1 RFID TAG 审中-实审
公开(公告)号：EP3961504A1
公开(公告)日：2022-03-02
申请号：EP20795092.4
申请日：2020-04-17
申请人： Kyocera Corporation
发明人： SUGIMOTO, Yoshimasa , NIINO, Noritaka
IPC分类号： G06K19/077 , G06K19/07 , H01Q9/16
摘要： The present invention addresses the problem of maximizing a communicable distance for an RFID tag having a structure in which an antenna conductor is accommodated in a housing. An RFID tag (1) comprises: a circuit board (20) having a main part (20A), and an extension part (20B) that extends along an edge of the main part (20A) and includes an antenna conductor (28); an RFID IC (25) mounted on the circuit board (20); a functional module (33) disposed overlapping the circuit board (20); a housing (10) accommodating the circuit board (20) and the functional module (33); and a lid (40) for closing an opening of the housing (10). The lid (40) side of the circuit board (20) is covered by the functional module (33) at a positon where the main part (20A) of the circuit board (20) is separated from an inner bottom surface (S2) of the housing (10), whereby the extension part (20B) of the circuit board (20) is held in midair.

4. 发明公开

EP3951659A1 RFID TAG 审中-实审
公开(公告)号：EP3951659A1
公开(公告)日：2022-02-09
申请号：EP20776893.8
申请日：2020-03-17
申请人： KYOCERA CORPORATION
发明人： SUGIMOTO, Yoshimasa
IPC分类号： G06K19/077 , G06K19/07 , H01Q9/16
摘要： Provided is an RFID tag comprising a plurality of function modules, wherein a communicable distance is enlarged. The RFID tag comprises: a circuit board which has an antenna conductor and a ground surface, and on which a control circuit and an RFID IC is mounted; and a plurality of function modules which are connected to the circuit board. The circuit board has a main part which includes a control circuit mounting surface and the ground surface, and an extension part which includes the antenna conductor and is integrated with the main part. The extension part and the antenna conductor are longer than one edge part of the main part, and are positioned following along said edge part.

5. 发明公开

EP3410127A1 MEASUREMENT SENSOR PACKAGE AND MEASUREMENT SENSOR 审中-公开
公开(公告)号：EP3410127A1
公开(公告)日：2018-12-05
申请号：EP16888105.0
申请日：2016-11-10
申请人： Kyocera Corporation
发明人： OODE, Yasushi , ITO, Hiroki , SUGIMOTO, Yoshimasa , NIINO, Noritaka , MATSUNAGA, Shogo , HAYASHI, Takuya
IPC分类号： G01P5/26 , A61B5/02 , A61B5/0285 , G01P5/00
CPC分类号： A61B5/0285 , A61B5/0059 , A61B5/02 , A61B5/02141 , A61B5/0261 , A61B5/7203 , A61B2562/0233 , G01P5/00 , G01P5/26
摘要： A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package (1) includes a substrate (2). The substrate (2) includes a first recess (20a) including a first bottom surface (20d) on which a light emitter is mountable, and a first step surface (20f) having a first connection pad (23a) thereon, a second recess (20b) including a second bottom surface (20e) on which a light receiver is mountable, and a second step surface (20g) having a second connection pad (23b) thereon. In a direction connecting a center (c1) of the first bottom surface (20d) and a center (c2) of the second bottom surface (20e) in a plan view, the first step surface (20f) is located outward from the first bottom surface (20d) and the second step surface (20g) is located outward from the second bottom surface (20e).

6. 发明公开

EP4026493A1 MEASURING SENSOR PACKAGE AND MEASUREMENT SENSOR 无效
公开(公告)号：EP4026493A1
公开(公告)日：2022-07-13
申请号：EP21205560.2
申请日：2016-11-10
申请人： Kyocera Corporation
发明人： OODE, Yasushi , ITO, Hiroki , SUGIMOTO, Yoshimasa , NIINO, Noritaka , MATSUNAGA, Shogo , HAYASHI, Takuya
IPC分类号： A61B5/026 , A61B5/02 , A61B5/00 , H01L27/02 , H05K9/00
摘要： A measurement sensor package may comprise a substrate body including a first surface, a second surface opposite to the first surface, a first opening and a second opening which open in the first surface, a first recess recessed from the first opening, and a second recess recessed from the second opening, the first recess including a first bottom surface on which a light emitter is mountable, and a first step surface located closer to the first opening than the first bottom surface, the second recess including a second bottom surface on which a light receiver is mountable, and a second step surface located closer to the second opening than the second bottom surface, the first step surface being located farther from the second recess than the first bottom surface, the second step surface being located farther from the first recess than the second bottom surface.

7. 发明公开

EP2211419A1 HIGH FREQUENCY MODULE AND WIRING BOARD 审中-公开
标题翻译： HOCHFREQUENZMODUL UND LEITERPLATTE
公开(公告)号：EP2211419A1
公开(公告)日：2010-07-28
申请号：EP08833130.1
申请日：2008-09-29
申请人： Kyocera Corporation
发明人： SUGIMOTO, Yoshimasa , SHIRASAKI, Takayuki
IPC分类号： H01P5/107 , H01P1/04
CPC分类号： H01P5/107
摘要： A high-frequency module has a wiring board including a dielectric substrate, a line conductor that is formed on a first surface of the dielectric substrate, and a first grounding conductor layer that is formed on a second surface opposed to the first surface of the dielectric substrate, and that has a first opening and a second opening disposed around the first opening; and a waveguide that is connected to the second surface, has an opening opposed to the first opening, and is electromagnetically coupled to the line conductor. The wiring board has a vertical choke portion that at least partially extends from the second opening in a direction perpendicular to the second surface. Furhermore, a horizontal choke portion is formed between the wiring board and the waveguide, along the second surface between the opening of the waveguide and the second opening.
摘要翻译：高频模块具有布线基板，其包括电介质基板，形成在电介质基板的第一表面上的线路导体和形成在与电介质的第一表面相对的第二表面上的第一接地导体层基板，并且具有设置在第一开口周围的第一开口和第二开口; 并且连接到第二表面的波导具有与第一开口相对的开口，并且与线路导体电磁耦合。布线板具有垂直的扼流部分，其在垂直于第二表面的方向上从第二开口至少部分地延伸。此外，沿着波导的开口和第二开口之间的第二表面，在布线板和波导之间形成水平的扼流部。

8. 发明公开

EP3440998A1 MEASUREMENT SENSOR PACKAGE AND MEASUREMENT SENSOR 有权
公开(公告)号：EP3440998A1
公开(公告)日：2019-02-13
申请号：EP17778883.3
申请日：2017-02-22
申请人： Kyocera Corporation
发明人： OODE, Yasushi , ITO, Hiroki , SUGIMOTO, Yoshimasa , NIINO, Noritaka , MATSUNAGA,Shogo , HAYASHI, Takuya
IPC分类号： A61B5/0285 , A61B5/026
摘要： A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package (11) includes a substrate (2), a lid (3), a ground conductor layer (4), a metallic thin layer (5), and a bond (6). The ground conductor layer (4) and the metallic thin layer (5) are arranged inside the bond (6) that extends continuously as viewed through from above. The bond (6) directly bonds a first main surface (21) of a substrate body (20) and a facing surface (3a) of the lid (3) together along the entire periphery. This improves the reliability in strength.

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