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1. 发明公开

EP3502852A2 PIXEL STRUCTURE AND DISPLAY PANEL 有权
公开(公告)号：EP3502852A2
公开(公告)日：2019-06-26
申请号：EP18184798.9
申请日：2018-07-20
申请人： AU Optronics Corp.
发明人： Chang, Che-Chia , Chuang, Ming-Hung
IPC分类号： G06F3/041 , H01L25/075 , H01L27/15 , G09G3/32
CPC分类号： H01L27/3246 , G02F2201/123 , G09G3/32 , G09G3/3225 , G09G2300/0426 , G09G2360/142 , G09G2360/144 , H01L27/14 , H01L27/156
摘要： A pixel structure disposed on a substrate (10) having a pixel sensor region (SR) and a pixel display region (DR) disposed beside the pixel sensor region is provided. The pixel structure includes a pixel defining layer (110), a light-emitting diode (120), a pixel driving circuit and a sensor device. The pixel defining layer (110) is disposed on the substrate and has a device accommodation portion (112) located in the pixel display region. The light-emitting diode is disposed on the device accommodation portion. The area of the light-emitting diode is smaller than that of the device accommodation portion. The pixel driving circuit is disposed on the substrate, is electrically connected to the light-emitting diode, and includes a pixel electrode (132) by which the device accommodation portion is covered. The light-emitting diode is bonded onto the pixel electrode. The sensor device is disposed between the pixel defining layer and the substrate and located in the pixel sensor region.

2. 发明公开

EP3376542A1 SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SAME 有权
公开(公告)号：EP3376542A1
公开(公告)日：2018-09-19
申请号：EP16864390.6
申请日：2016-11-14
申请人： Toppan Printing Co., Ltd.
发明人： KUMAI Koichi , GORAI Ryohei
IPC分类号： H01L27/14 , G02B3/00 , H04N5/369
CPC分类号： H01L27/14627 , G02B3/00 , H01L27/14 , H01L27/14621 , H01L27/14685 , H04N5/369
摘要： Provided are a solid-state imaging device that is capable of forming a solid-state imaging device at lower cost, and a method of manufacturing the solid-state imaging device. The method of manufacturing a solid-state imaging device (1a) including a substrate (2), a plurality of microlenses (6) formed on one surface of the substrate (2), and at least one concave lens (7) formed at a boundary between adjacent microlenses (6) of the plurality of microlenses (6) and depressed toward the one surface of the substrate (2) includes a step of forming the microlenses (6) and the concave lenses (7) by photolithography by use of a gray-tone mask (50).

3. 发明公开

EP3365916A1 DEMODULATION PIXEL DEVICES, ARRAYS OF PIXEL DEVICES AND OPTOELECTRONIC DEVICES INCORPORATING THE SAME 有权
公开(公告)号：EP3365916A1
公开(公告)日：2018-08-29
申请号：EP16857900.1
申请日：2016-10-21
申请人： Heptagon Micro Optics Pte. Ltd.
发明人： KÖKLÜ, Gözen , BÜTTGEN, Bernhard
IPC分类号： H01L27/14 , H04N5/335 , G01S7/00 , G01C3/00
CPC分类号： G01C3/00 , G01S7/4914 , H01L27/14 , H04N5/37457
摘要： Pixel devices and arrays of pixel devices are operable to demodulate modulated light incident on a photo-detection region of the pixel devices. The pixel devices can include floating diffusion implant layers and transfer gates. The floating diffusion implant layers and transfer gates are disposed such that photo-generated charge carriers can be conducted to the floating diffusion implant layers over minimal charge-carrier transport paths.

4. 发明公开

EP3358821A1 IMAGING DEVICE AND IMAGE PROCESSING DEVICE 有权
公开(公告)号：EP3358821A1
公开(公告)日：2018-08-08
申请号：EP16851463.6
申请日：2016-09-26
申请人： Nikon Corporation
发明人： SHIONOYA, Takashi , KANBARA, Toshiyuki , SEKIGUCHI, Naoki
IPC分类号： H04N5/232 , G03B7/00 , H01L27/14 , H04N5/235 , H04N5/238 , H04N5/341 , H04N5/347 , H04N5/351 , H04N5/353 , H04N5/357 , H04N5/367 , H04N5/369
CPC分类号： H04N5/23229 , G03B7/00 , H01L27/14 , H01L27/14634 , H04N5/232 , H04N5/235 , H04N5/2353 , H04N5/238 , H04N5/341 , H04N5/347 , H04N5/351 , H04N5/353 , H04N5/357 , H04N5/367 , H04N5/369 , H04N9/045
摘要： An image-capturing device includes: an image sensor that includes an image-capturing area where an image of a subject is captured; a setting unit that sets image-capturing conditions to be applied to the image-capturing area; a selection unit that selects pixels to be used for interpolation from pixels present in the image-capturing area; and a generation unit that generates an image of the subject captured in the image-capturing area with signals generated through interpolation executed by using signals output from the pixels selected by the selection unit, wherein: the selection unit makes a change in selection of at least some of the pixels to be selected depending upon the image-capturing conditions set by the setting unit.

5. 发明公开

EP2620792A4 APPARATUS FOR WAVELENGTH-DIVISION MULTIPLEXING AND DEMULTIPLEXING 有权
公开(公告)号：EP2620792A4
公开(公告)日：2018-02-28
申请号：EP11826970
申请日：2011-07-11
申请人： OPTICIS CO LTD
发明人： SHIN HYUNEE
IPC分类号： G02B6/28 , G02B6/32
CPC分类号： G02B6/4267 , G02B3/0037 , G02B6/29367 , G02B6/4206 , G02B6/4214 , G02B6/4215 , G02B6/4292 , G02B6/43 , H01L27/14 , H01L31/02327
摘要： The present invention relates to an apparatus for wavelength-division multiplexing and demultiplexing, to an optical communication module, and to an optical device. The apparatus for wavelength-division multiplexing and demultiplexing comprises: a first lens block having a lens array at one side thereof; a second lens block having a lens surface corresponding to the lens array and combined with the other side of the first lens block; a receptacle having an optical fiber ferrule fixed at the center thereof and stacked on the second lens block; and a base combined with one side of the first lens block, wherein the first block is stacked on the base.

6. 发明公开

EP3278407A1 DISPOSITIF ET PROCEDE DE CARACTERISATION D'UNE IMPULSION LASER FEMTOSECONDE 审中-公开
标题翻译：描述FEMTOSECOND激光脉冲的装置和方法
公开(公告)号：EP3278407A1
公开(公告)日：2018-02-07
申请号：EP16713865.0
申请日：2016-03-30
申请人： Université de Bourgogne , Centre National de la Recherche Scientifique CNRS
发明人： BEJOT, Pierre , BILLARD, Franck
IPC分类号： H01S3/00 , G01J11/00 , H01L27/14
CPC分类号： H01S3/00 , G01J11/00 , H01L27/14
摘要： The invention relates to a device for characterising a laser pulse (Pu), comprising at least: - a Fresnel biprism (BPF) that separates an incident laser beam; a detector (CAM) comprising at least one linear semiconductor detector disposed in an overlap zone in which the separated beams interfere and generate a trace by absorption of two photons of at least two beams separated by the Fresnel biprism, said generated trace comprising information characterising the laser pulse (Pu); and a computer (K) that processes a signal from the detector (CAM), produced by the generation of the trace, in order to deduce therefrom a laser pulse duration.

7. 发明公开

EP3277065A1 IMAGING COMPONENT, AND IMAGING MODULE PROVIDED WITH SAME 有权
标题翻译：成像组件，以及提供的成像模块
公开(公告)号：EP3277065A1
公开(公告)日：2018-01-31
申请号：EP16771993.9
申请日：2016-02-25
申请人： Kyocera Corporation
发明人： WATANABE, Shinji
IPC分类号： H05K3/46 , H01L23/12 , H01L27/14 , H05K1/02
CPC分类号： H01L27/14636 , H01L23/12 , H01L23/4824 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L23/5383 , H01L23/5386 , H01L27/14 , H01L2224/16225 , H05K1/02 , H05K1/0393 , H05K3/46
摘要： An imaging component (10) includes a laminated substrate (1) formed of a resin material; a plurality of electrode pads (2) disposed on an upper face of the laminated substrate (1), an imaging element (4) being to be mounted on the plurality of electrode pads (2); and a plurality of conductor patterns (3) which are belt-shaped and disposed between layers of the laminated substrate (1), the plurality of conductor patterns (3) being connected to the plurality of electrode pads (2), respectively. A part of at least one of the plurality of conductor patterns (3) has a widened portion (31), the widened portion being located immediately below any of electrode pads which are not connected to the at least one of the plurality of conductor patterns.
摘要翻译：成像元件（10）包括由树脂材料形成的层压基板（1）设置在所述层叠基板（1）的上表面上的多个电极焊盘（2），成像元件（4）将被安装在所述多个电极焊盘（2）上; 以及多个导体图案（3），它们是带状的并且设置在层压基板（1）的层之间，多个导体图案（3）分别连接到多个电极焊盘（2）。多个导体图案（3）中的至少一个导体图案的一部分具有加宽部分（31），加宽部分位于未连接到多个导体图案中的至少一个导体图案上的任何电极焊盘的正下方。

8. 发明公开

EP3196940A1 SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE 有权
标题翻译：用于安装电子元件的基板以及电子装置
公开(公告)号：EP3196940A1
公开(公告)日：2017-07-26
申请号：EP15842560.3
申请日：2015-03-26
申请人： KYOCERA Corporation
发明人： SAKAI, Mitsuharu , YAMASAKI, Shou , INUYAMA, Shigetoshi , NIINO, Noritaka
IPC分类号： H01L27/14 , H01L23/02 , H01L31/02 , H01L33/62 , H04N5/335 , H05K3/46
CPC分类号： H01L33/483 , H01L23/053 , H01L23/49822 , H01L27/14 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L31/02 , H01L31/02002 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2924/16151 , H01L2924/16152 , H04N5/335 , H05K1/021 , H05K3/0061 , H05K3/4629 , H05K3/4688 , H05K2201/10121 , H05K2203/049 , H01L2924/00014
摘要： There are provided an electronic device mounting substrate and an electronic apparatus which are capable of enhancement in impact resistance. An electronic device mounting substrate (1) according to one aspect of the invention includes: a first wiring substrate (2) shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole (2a); a second wiring substrate (6) shaped in a rectangular frame or plate, the second wiring substrate (6) being disposed so as to overlie a lower surface of the first wiring substrate (2) and be electrically connected to the first wiring substrate (2), one of outer edges of the second wiring substrate (6) being located more outward than a corresponding one of outer edges of the first wiring substrate (2); a metallic plate (4) disposed so as to overlie a lower surface of the second wiring substrate (6) so that the second wiring substrate (6) is sandwiched between the metallic plate (4) and the first wiring substrate (2), outer edges of the metallic plate (4) being located more outward than the outer edges of the first wiring substrate (2) and more inward than the one of the outer edges of the second wiring substrate (6); and a lens holder (5) which is a lid body secured to an outer periphery of the metallic plate (4), with the one of the outer edges of the second wiring substrate (6) lying in between, so as to cover the first wiring substrate (2) and the second wiring substrate (6). A frame interior of the first wiring substrate (2), or a frame interior of each of the first wiring substrate (2) and the second wiring substrate (6), constitutes an electronic device mounting space (11).
摘要翻译：提供了一种能够提高耐冲击性的电子器件安装基板和电子设备。根据本发明的一个方面的电子器件安装基板（1）包括：形成为矩形框架的第一配线基板（2），所述矩形框架的内部构成第一通孔（2a）; 形成为矩形框架或板的第二布线基板（6），所述第二布线基板（6）被布置为覆盖所述第一布线基板（2）的下表面并且与所述第一布线基板（2）电连接），所述第二布线基板（6）的外边缘中的一个位于比所述第一布线基板（2）的外边缘中的相应一个外边缘更向外的位置; （6）的下表面上设置的金属板（4），使得第二布线衬底（6）夹在金属板（4）和第一布线衬底（2）之间，外部所述金属板（4）的边缘位于比所述第一布线基板（2）的外边缘更靠外侧且比所述第二布线基板（6）的所述一个外边缘更靠内侧的位置。以及作为盖体的透镜支架（5），该盖体固定在金属板（4）的外周上，第二布线基板（6）的一个外边缘位于其间，以覆盖第一配线基板（2）和第二配线基板（6）。第一布线基板（2）的框架内部或第一布线基板（2）和第二布线基板（6）中的每一个的框架内部构成电子器件安装空间（11）。

9. 发明公开

EP3046148A1 VERTICALLY INTEGRATED SYSTEMS 审中-公开
标题翻译： VERTIKAL INTEGRIERTE SYSTEME
公开(公告)号：EP3046148A1
公开(公告)日：2016-07-20
申请号：EP15170129.9
申请日：2011-12-09
申请人： Analog Devices, Inc.
发明人： O'Donnell, Alan , Iriarte, Santiago , Murphy, Mark , Lyden, Colin G. , Casey, Gary , English, Eoin
IPC分类号： H01L25/16
CPC分类号： G01N27/226 , B81B7/00 , B81B7/007 , B81B2201/0214 , G01N27/26 , G01N27/4148 , H01F17/00 , H01F17/04 , H01L21/82 , H01L23/3677 , H01L23/38 , H01L23/473 , H01L23/481 , H01L23/58 , H01L24/05 , H01L24/13 , H01L24/48 , H01L24/94 , H01L25/16 , H01L25/167 , H01L27/0694 , H01L27/14 , H01L27/15 , H01L28/00 , H01L28/10 , H01L28/20 , H01L28/60 , H01L28/82 , H01L28/86 , H01L28/90 , H01L31/0392 , H01L31/0525 , H01L31/0547 , H01L31/056 , H01L31/06 , H01L35/00 , H01L35/28 , H01L35/30 , H01L2224/04042 , H01L2224/05554 , H01L2224/0556 , H01L2224/0557 , H01L2224/32145 , H01L2224/48091 , H01L2224/48265 , H01L2225/06531 , H01L2924/00014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/16195 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H02S10/10 , H02S40/38 , Y02E10/50 , Y02E10/52 , H01L2924/00 , H01L2224/45099 , H01L2224/05552 , H01L2224/85399 , H01L2224/05599
摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
摘要翻译：本发明的实施例提供了一种集成电路系统，其包括在半导体管芯的前侧制造的第一有源层和在半导体管芯的背面上的第二预制层，并且具有体现在其中的电气部件，其中电气部件包括至少一个分立的无源部件。集成电路系统还包括耦合第一有源层和第二预制层的至少一个电路径。

10. 发明公开

EP2750190A4 IMAGE SENSOR, METHOD OF MANUFACTURING SAME, AND INSPECTION DEVICE 失效
标题翻译：影像传感器，工艺用于生产和检测装置
公开(公告)号：EP2750190A4
公开(公告)日：2015-04-08
申请号：EP12825220
申请日：2012-08-01
申请人： SONY CORP
发明人： TAGUCHI AYUMU
IPC分类号： H01L27/14 , G01N21/64 , G01N33/53 , H01L27/146 , H04N5/359 , H04N5/369
CPC分类号： H01L27/14623 , G01N21/6454 , H01L27/14 , H01L27/14627 , H01L27/1463 , H01L27/14685 , H04N5/359
摘要： [Object] To provide an image sensor having high light collection efficiency and less crosstalk among pixels, a production method therefor, and an inspection apparatus. [Solving means] In an image sensor including a light source conversion unit that includes a plurality of light-receiving devices and converts incident light into an electric signal, a plurality of lenses that are provided in an immediately-above area of the light-receiving devices and collect light toward a light-receiving unit of the light-receiving devices positioned right below the lenses, and an insulation layer that is formed of an optically-transparent material and formed above the lenses, detection areas are provided on a surface of the insulation layer while being apart from one another for each of the light-receiving devices, a center of each of the detection areas being positioned on an extended line connecting a center of the light-receiving unit of each of the light-receiving devices and a center of the lens provided right above each of the light-receiving devices. In addition, a sample as a detection target is fixed to at least the detection areas.

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