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1. 发明公开

EP0487918A2 Optical bus for computer systems 失效
标题翻译： Optischer BusfürRechnersysteme。
公开(公告)号：EP0487918A2
公开(公告)日：1992-06-03
申请号：EP91118491.9
申请日：1991-10-30
申请人： International Business Machines Corporation
发明人： Bregman, Mark Fielding , Noyan, Ismail Cevdet , Ritter, Mark B. , Stone, Harold Stuart
IPC分类号： H04B10/20 , G02B6/28 , G02B6/42
CPC分类号： G02B6/43 , G02B6/2817
摘要： An optical bus (10) for interconnecting electronic devices (12, 14, 16). The bus has a substrate (18) with through-holes (20, 22, 24) therein. An optically conductive material (28) is disposed on one side of the substrate. The material fills the through-holes and forms a layer of predetermined thickness on this side of the substrate. In the outer surface of this layer there are facets or angled regions (30, 32, 34). The surface and facets are optically reflective. Cards or modules (12, 14, 16) are optically connected by means of optical connectors (42) to the through-holes on the opposite side of the substrate. Light emitted (38, 40) by the connector travels to the associated facets surface from which it reflects towards other faceted surfaces from which it is partially transmitted and partially reflected to another connector. The arrangement permits optical communication between a plurality of electronic devices.
摘要翻译：一种用于互连电子设备（12,14,16）的光学总线（10）。总线具有其中具有通孔（20,22,24）的基板（18）。光导材料（28）设在基片的一侧。该材料填充通孔并在该基板的该侧上形成预定厚度的层。在该层的外表面上有小平面或倾斜区域（30,32,34）。表面和刻面是光学反射的。卡或模块（12,14,16）通过光学连接器（42）与基板相对侧上的通孔光学连接。通过连接器发射的光（38,40）行进到相关的小平面，从该表面反射到另一个分面，从该表面部分地透射并部分地反射到另一个连接器。该布置允许多个电子设备之间的光通信。

2. 发明公开

EP0340527A3 Improved semiconductor device packaging structures 失效
标题翻译：改进的半导体器件封装结构
公开(公告)号：EP0340527A3
公开(公告)日：1990-04-25
申请号：EP89106979.1
申请日：1989-04-19
申请人： International Business Machines Corporation
发明人： Bickford, Harry Randall , Bregman, Mark Fielding , Moskowitz, Paul Andrew , Kovac, Caroline Ann , Palmer, Michael Jon , Poore, Paige Adams , Reiley, Timothy Clark
IPC分类号： H01L25/08
CPC分类号： H01L25/0657 , H01L23/49575 , H01L24/48 , H01L25/0652 , H01L2224/16145 , H01L2224/48091 , H01L2224/48247 , H01L2225/06513 , H01L2924/00014 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/04941 , H01L2924/09701 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2224/45099 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit device package (76) in which integrated circuit devices (78, 80) are mounted with active faces (82, 84) placed facing each other to form a double-chip structure. Input/output terminals (90, 92) on the active faces of each chips are electrically interconnected by placing an interconnection means (98) between the chips to electrically interconnect input/output terminals on the active faces of the first and second chips. Beam leads (98), each having an inner (100) and outer (99) lead bond site, project outwardly from between the chip where each of the inner lead bond site is bonded to at least one interconnection means. A series of double-chip structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-chips structure, the inner lead bond site being electrically bonded to at least one interconnection means.

3. 发明公开

EP0399161A2 Multi-level circuit card structure 失效
标题翻译： Mehrschichtleiterplattenstruktur。
公开(公告)号：EP0399161A2
公开(公告)日：1990-11-28
申请号：EP90105309.0
申请日：1990-03-21
申请人： International Business Machines Corporation
发明人： Bregman, Mark Fielding , Buchwalter, Stephen Leslie , Hermann, Karl , Kovac, Caroline Ann , Poore, Paige Adams , Viehbeck, Alfred
IPC分类号： H05K1/05 , H05K1/00
CPC分类号： H05K3/462 , H01L23/5385 , H01L24/00 , H01L2924/14 , H05K1/0272 , H05K1/056 , H05K1/144 , H05K3/321 , H05K3/325 , H05K3/429 , H05K3/445 , H05K2201/0154 , H05K2201/0314 , H05K2201/068 , H05K2201/09536 , H05K2201/09554 , H05K2201/09581 , H05K2201/096 , H05K2203/0323 , H05K2203/041 , H05K2203/1184 , H05K2203/1438 , H01L2924/00
摘要： Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.
摘要翻译：用于在其上安装电子设备的结构。该结构由多个基板（4,6,8,10）制成，每个基板具有被绝缘材料（13）包围的导热和/或导电的芯体（12）。基板可以与提供接地和电源平面的导电芯贴附放置在一起，或者基板可以与电连接相邻基板的连接器（42）一起安装在一起，并将相邻基板间隔开，提供流体可以流过的空间由安装在其上的电子设备产生的热量。导电芯为结构提供电源和接地平面以及用于热耗散所产生的热量的装置。

4. 发明公开

EP0365783A3 Multilevel integrated circuit packaging structures 失效
标题翻译：多电路集成电路封装结构
公开(公告)号：EP0365783A3
公开(公告)日：1990-11-22
申请号：EP89115631.7
申请日：1989-08-24
申请人： International Business Machines Corporation
发明人： Bickford, Harry Randall , Bregman, Mark Fielding , Cipolla, Thomas Mario , Gow, John, III , Ledermann, Peter Gerard , Miersch, Ekkehard Fritz , Olson, Leonard Theodore , Pagnini, David Peter , Reiley, Timothy Clark , Tsou, Uh-Po Eric , Vilkelis, Walter Valerian
IPC分类号： H01L23/498 , H01L23/64
CPC分类号： H01L24/50 , H01L23/49572 , H01L23/49861 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/3011 , H01L2924/00
摘要： Electronic device packaging structures useful for electrically interconnecting an electronic device to a substrate. The structure contains at least two metallization layers with dielectric layers (100) between adjacent to metallization layers. The dielectric layers can have variable thickness. Beam leads (94, 96, 106, 114) can project inwardly in cantilevered fashion over a central aperture through the dielectric layers. The inner ends (118, 122, 126, 130) of the beam leads lie substantially in one plane and can be bonded to contact pads (135, 137) on integrated circuit electronic devices (136). Beam leads can project outwardly from the metallization layers over outer edges of the dielectric layers for bonding to contact pads on a substrate. Signal leads on metallization layers can be symmetrically arranged between ground and voltage leads to provide optimal impedance properties. These structures are useful for tape automated bonding applications.

5. 发明授权

EP0429759B1 Three dimensional microelectronic packaging 失效
标题翻译：一种三维外壳的微电子。
公开(公告)号：EP0429759B1
公开(公告)日：1994-10-26
申请号：EP90114930.2
申请日：1990-08-03
申请人： International Business Machines Corporation
发明人： Bregman, Mark Fielding , Horton, Raymond Robert , Noyan, Ismail Cevdet , Palmer, Michael Jon
IPC分类号： H01L25/065 , H01L23/538
CPC分类号： H01L23/5385 , H01L25/0652 , H01L2924/0002 , H01L2924/00

6. 发明公开

EP0431261A1 Integrated circuit package with cap and device of the same material 失效
标题翻译：包具有盖和相同的材料的装置的集成电路。
公开(公告)号：EP0431261A1
公开(公告)日：1991-06-12
申请号：EP90115893.1
申请日：1990-08-20
申请人： International Business Machines Corporation
发明人： Bregman, Mark Fielding , Horton, Robert Raymond , Noyan, Ismail Cevdet , Palmer, Michael Jon
IPC分类号： H01L23/04 , H01L23/06 , H01L23/14 , H01L21/52
CPC分类号： H01L21/4803 , H01L23/04 , H01L23/06 , H01L23/147 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A thermally matched integrated circuit package comprising a semiconductor substrate; at least one semiconductor electronic device mounted on said substrate; means for providing electrical connections to said at least one semiconductor electronic device and to said substrate; and a semiconductor cap, disposed over said at least one device, wherein the cap is directly attached to said substrate and further wherein said substrate, said at least one device, and said cap are all formed from the same semiconductor material to assure no thermal mismatch therebetween. The cap comprises at least one cavity which is disposed over at least one semiconductor electronic device. The cap may be fabricated utilizing anisotropic etching techniques or via electro-discharge machining. Hermetically sealed and nonhermetically sealed caps are both contemplated, as well as a grooved cap having an increased surface area to enhance its inherent cooling capacity. The invention is well suited to enhancing the performance of large scale multichip carrier modules.
摘要翻译：热匹配的集成电路封装，包括：半导体衬底; 在安装在所述基板的至少一个半导体电子器件; 装置，用于提供到所述的电连接的至少一个半导体电子器件和所述的底物; 和半导体帽，设置在所述至少一个设备，worin盖被直接附连到所述基板，此外worin所述基板，所述至少一个设备，并且所述帽都是从相同的半导体材料形成，以确保没有热失配有间。帽包括至少一个腔，其全部被设置在至少一个半导体电子器件。该盖可以制造利用各向异性蚀刻技术或通过放电加工。密封和密封nonhermetically帽都是预期的，以及在增加的表面积具有以提高其内在的冷却能力的开槽帽。本发明非常适合于提高的大规模多芯片载体模块的性能。

7. 发明授权

EP0399161B1 Multi-level circuit card structure 失效
标题翻译：多层印刷电路板结构。
公开(公告)号：EP0399161B1
公开(公告)日：1995-01-11
申请号：EP90105309.0
申请日：1990-03-21
申请人： International Business Machines Corporation
发明人： Bregman, Mark Fielding , Buchwalter, Stephen Leslie , Hermann, Karl , Kovac, Caroline Ann , Poore, Paige Adams , Viehbeck, Alfred
IPC分类号： H05K1/05 , H05K1/00
CPC分类号： H05K3/462 , H01L23/5385 , H01L24/00 , H01L2924/14 , H05K1/0272 , H05K1/056 , H05K1/144 , H05K3/321 , H05K3/325 , H05K3/429 , H05K3/445 , H05K2201/0154 , H05K2201/0314 , H05K2201/068 , H05K2201/09536 , H05K2201/09554 , H05K2201/09581 , H05K2201/096 , H05K2203/0323 , H05K2203/041 , H05K2203/1184 , H05K2203/1438 , H01L2924/00

8. 发明公开

EP0487918A3 Optical bus for computer systems 失效
标题翻译：计算机系统的光学总线
公开(公告)号：EP0487918A3
公开(公告)日：1992-12-09
申请号：EP91118491.9
申请日：1991-10-30
申请人： International Business Machines Corporation
发明人： Bregman, Mark Fielding , Noyan, Ismail Cevdet , Ritter, Mark B. , Stone, Harold Stuart
IPC分类号： H04B10/20 , G02B6/28 , G02B6/42
CPC分类号： G02B6/43 , G02B6/2817
摘要： An optical bus (10) for interconnecting electronic devices (12, 14, 16). The bus has a substrate (18) with through-holes (20, 22, 24) therein. An optically conductive material (28) is disposed on one side of the substrate. The material fills the through-holes and forms a layer of predetermined thickness on this side of the substrate. In the outer surface of this layer there are facets or angled regions (30, 32, 34). The surface and facets are optically reflective. Cards or modules (12, 14, 16) are optically connected by means of optical connectors (42) to the through-holes on the opposite side of the substrate. Light emitted (38, 40) by the connector travels to the associated facets surface from which it reflects towards other faceted surfaces from which it is partially transmitted and partially reflected to another connector. The arrangement permits optical communication between a plurality of electronic devices.

9. 发明公开

EP0340527A2 Improved semiconductor device packaging structures 失效
标题翻译： PackalsstrukturenfürHalbleiteranordnungen。
公开(公告)号：EP0340527A2
公开(公告)日：1989-11-08
申请号：EP89106979.1
申请日：1989-04-19
申请人： International Business Machines Corporation
发明人： Bickford, Harry Randall , Bregman, Mark Fielding , Moskowitz, Paul Andrew , Kovac, Caroline Ann , Palmer, Michael Jon , Poore, Paige Adams , Reiley, Timothy Clark
IPC分类号： H01L25/08
CPC分类号： H01L25/0657 , H01L23/49575 , H01L24/48 , H01L25/0652 , H01L2224/16145 , H01L2224/48091 , H01L2224/48247 , H01L2225/06513 , H01L2924/00014 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/04941 , H01L2924/09701 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2224/45099 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit device package (76) in which integrated circuit devices (78, 80) are mounted with active faces (82, 84) placed facing each other to form a double-chip structure. Input/output terminals (90, 92) on the active faces of each chips are electrically interconnected by placing an interconnection means (98) between the chips to electrically interconnect input/output terminals on the active faces of the first and second chips. Beam leads (98), each having an inner (100) and outer (99) lead bond site, project outwardly from between the chip where each of the inner lead bond site is bonded to at least one interconnection means. A series of double-chip structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-chips structure, the inner lead bond site being electrically bonded to at least one interconnection means.
摘要翻译：集成电路器件封装（76），其中集成电路器件（78,80）安装有面向彼此放置的有源面（82,84）以形成双芯片结构。每个芯片的有源面上的输入/输出端子（90,92）通过在芯片之间放置互连装置（98）而进行电互连，以电连接第一和第二芯片的有效面上的输入/输出端子。每个具有内部（100）和外部（99）引线键合位置的束引线（98）从芯片之间向外突出，其中每个内部引线键合部位被结合到至少一个互连装置。可以在其上具有多组束引线图案的带上形成一系列双芯片结构。每个具有内部和外部引线键合位置的每个束引线从双芯片结构之间向外突出，内部引线键合位置电连接到至少一个互连装置。

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