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1. 发明授权

EP0734182B1 Efficient optical system for a high resolution projection display employing reflection light valves 失效
公开(公告)号：EP0734182B1
公开(公告)日：2001-01-17
申请号：EP96102035.1
申请日：1996-02-13
申请人： International Business Machines Corporation
发明人： Chiu, George Liang-Tai , Cipolla, Thomas Mario , Doany, Fuad Elias , Dove, Derek Brian , Rosenbluth, Alan Edward , Singh, Rama Nand , Wilczynski, Janusz Stanislaw
IPC分类号： H04N9/31
CPC分类号： H04N9/3105

2. 发明公开

EP0572815A2 Circuit card interconnecting structure 失效
标题翻译： Leiterplatten-Zwischenstecker。
公开(公告)号：EP0572815A2
公开(公告)日：1993-12-08
申请号：EP93107301.9
申请日：1993-05-05
申请人： International Business Machines Corporation
发明人： Cipolla, Thomas Mario , Coteus, Paul William
IPC分类号： H05K7/14 , H01R23/68 , H01R13/193
CPC分类号： H01R12/52 , H01R12/88 , H05K1/14 , H05K1/148 , H05K7/1404 , Y10T29/49201
摘要： An interconnecting structure in which circuit and componentry bearing cards (2) are retained in contact with an intermediate card (1) that has component and circuitry areas (11), and socket insertion contacts (14).
摘要翻译：一种互连结构，其中电路和组件轴承卡（2）保持与具有部件和电路区域（11）的中间卡（1）和插座插入触点（14）接触。

3. 发明公开

EP0366880A2 Alignment device 失效
标题翻译： Ausrichtungsvorrichtung。
公开(公告)号：EP0366880A2
公开(公告)日：1990-05-09
申请号：EP89114147.5
申请日：1989-08-01
申请人： International Business Machines Corporation
发明人： Cipolla, Thomas Mario , Horton, Raymond Robert , Murphy, Philip , Palmer, Michael Jon
IPC分类号： H01L21/00 , H05K13/00
CPC分类号： F16C19/50 , B23K20/02 , H01L21/67144 , H01L24/78 , H01L2224/75745 , H01L2224/75823 , H01L2224/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , Y10S269/903 , H01L2224/48 , H01L2224/45099 , H01L2224/05599
摘要： Apparatus for automatically adjusting the orientation of a first surface (104) of a first body (108) to be against a second surface (106) of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.
摘要翻译：用于当所述第一表面被压靠在所述第二表面上时，自动调节第一主体（108）的第一表面（104）的取向以抵靠第二主体的第二表面（106）的装置。该装置包括用于将第一主体可移动地安装到支撑件的装置，其允许第一表面的旋转，使得当第一表面被压靠在第二表面上时，第一表面相对于支撑件旋转，导致第一表面抵抗第二个表面。

5. 发明公开

EP0734182A3 Efficient optical system for a high resolution projection display employing reflection light valves 失效
标题翻译：空值
公开(公告)号：EP0734182A3
公开(公告)日：1996-10-16
申请号：EP96102035.1
申请日：1996-02-13
申请人： International Business Machines Corporation
发明人： Chiu, George Liang-Tai , Cipolla, Thomas Mario , Doany, Fuad Elias , Dove, Derek Brian , Rosenbluth, Alan Edward , Singh, Rama Nand , Wilczynski, Janusz Stanislaw
IPC分类号： H04N9/31
CPC分类号： H04N9/3105
摘要： An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. In particular, the present invention includes a color splitting prism assembly having a plurality of output faces through which a separate color component is directed to be reflected by a respective light valve. Color absorbing filters are disposed at each of the output faces to absorb the color components not corresponding to the color directed through each output face.
摘要翻译：光学系统被描述为由反射双折射光阀，偏振分束器，彩色图像组合棱镜，照明系统，投影透镜，用于颜色和对比度控制的滤光器以及放置在为高分辨率彩色显示器提供优点的配置中的屏幕。特别地，本发明包括具有多个输出面的分色棱镜组件，通过该多个输出面，单独的颜色分量被相应的光阀反射。在每个输出面上设置吸收滤光片以吸收不对应于通过每个输出面引导的颜色的颜色分量。

6. 发明授权

EP0366880B1 Alignment device 失效
标题翻译：校准设备。
公开(公告)号：EP0366880B1
公开(公告)日：1995-01-04
申请号：EP89114147.5
申请日：1989-08-01
申请人： International Business Machines Corporation
发明人： Cipolla, Thomas Mario , Horton, Raymond Robert , Murphy, Philip , Palmer, Michael Jon
IPC分类号： H01L21/00 , H05K13/00
CPC分类号： F16C19/50 , B23K20/02 , H01L21/67144 , H01L24/78 , H01L2224/75745 , H01L2224/75823 , H01L2224/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , Y10S269/903 , H01L2224/48 , H01L2224/45099 , H01L2224/05599

7. 发明公开

EP0555659A3 Multi-chip Module 失效
标题翻译：多芯片模块
公开(公告)号：EP0555659A3
公开(公告)日：1993-12-22
申请号：EP93100658.9
申请日：1993-01-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Cipolla, Thomas Mario , Coteus, Paul William , Johnson, Glen Walden , Mok, Lawrence Shungwei
IPC分类号： H01L25/10 , H01L23/467 , H01L23/498 , H05K7/14 , H05K7/20
CPC分类号： H05K7/1429 , H01L23/467 , H01L25/105 , H01L2225/1005 , H01L2924/0002 , H01L2924/00
摘要： A high density package for a plurality of integrated circuit chips (14) is described, the package including a number of planar subunits. A subunit includes first (50) and second (64) planar metal plates and a spacer metal plate (56) sandwiched therebetween. Each spacer metal plate is provided with a plurality of circuit-receiving apertures (58). A planar circuit carrier is provided for each aperture in the spacer metal plate. One face of each circuit carrier includes a plurality of bonded chips. Each circuit carrier is positioned in a circuit-receiving aperture so that rear aspects of the bonded chips bear upon the second planar metal plate. Each circuit carrier has a connector region (74, 78) which extends out from between the first planar metal plate and the metal spacer plate at one extremity of each circuit-receiving aperture. A circuit card (76) is positioned at that extremity and has a plurality of interconnection areas, one for each extended connector region. The circuit card has its major surface oriented parallel to the metal plates so that the entire package presents an overall planar configuration.

8. 发明授权

EP0371205B1 Transfer Device 失效
标题翻译：输送机。
公开(公告)号：EP0371205B1
公开(公告)日：1993-12-15
申请号：EP89115344.7
申请日：1989-08-19
申请人： International Business Machines Corporation
发明人： Cipolla, Thomas Mario
IPC分类号： H01L21/00 , B65G47/91
CPC分类号： H01L21/67706

9. 发明公开

EP0555659A2 Multi-chip Module 失效
标题翻译： Mehrchipmodul。
公开(公告)号：EP0555659A2
公开(公告)日：1993-08-18
申请号：EP93100658.9
申请日：1993-01-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Cipolla, Thomas Mario , Coteus, Paul William , Johnson, Glen Walden , Mok, Lawrence Shungwei
IPC分类号： H01L25/10 , H01L23/467 , H01L23/498 , H05K7/14 , H05K7/20
CPC分类号： H05K7/1429 , H01L23/467 , H01L25/105 , H01L2225/1005 , H01L2924/0002 , H01L2924/00
摘要： A high density package for a plurality of integrated circuit chips (14) is described, the package including a number of planar subunits. A subunit includes first (50) and second (64) planar metal plates and a spacer metal plate (56) sandwiched therebetween. Each spacer metal plate is provided with a plurality of circuit-receiving apertures (58). A planar circuit carrier is provided for each aperture in the spacer metal plate. One face of each circuit carrier includes a plurality of bonded chips. Each circuit carrier is positioned in a circuit-receiving aperture so that rear aspects of the bonded chips bear upon the second planar metal plate. Each circuit carrier has a connector region (74, 78) which extends out from between the first planar metal plate and the metal spacer plate at one extremity of each circuit-receiving aperture. A circuit card (76) is positioned at that extremity and has a plurality of interconnection areas, one for each extended connector region. The circuit card has its major surface oriented parallel to the metal plates so that the entire package presents an overall planar configuration.
摘要翻译：描述了用于多个集成电路芯片（14）的高密度封装，该封装包括多个平面子单元。 A子单元包括第一（50）和第二（64）平面金属板和夹在其间的间隔金属板（56）。每个间隔金属板设置有多个电路接收孔（58）。为间隔金属板中的每个孔提供平面电路载体。每个电路载体的一个面包括多个接合芯片。每个电路载体定位在电路接收孔中，使得粘合芯片的后部方面承载在第二平面金属板上。每个电路载体具有在每个电路接收孔的一个末端处从第一平面金属板和金属间隔板之间延伸出的连接器区域（74,78）。电路卡（76）位于该末端并且具有多个互连区域，每个扩展连接器区域一个。电路卡的主要表面平行于金属板取向，使得整个封装具有整体的平面结构。

10. 发明公开

EP0366880A3 Alignment device 失效
标题翻译：对准设备
公开(公告)号：EP0366880A3
公开(公告)日：1991-05-29
申请号：EP89114147.5
申请日：1989-08-01
申请人： International Business Machines Corporation
发明人： Cipolla, Thomas Mario , Horton, Raymond Robert , Murphy, Philip , Palmer, Michael Jon
IPC分类号： H01L21/00 , H05K13/00
CPC分类号： F16C19/50 , B23K20/02 , H01L21/67144 , H01L24/78 , H01L2224/75745 , H01L2224/75823 , H01L2224/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , Y10S269/903 , H01L2224/48 , H01L2224/45099 , H01L2224/05599
摘要： Apparatus for automatically adjusting the orientation of a first surface (104) of a first body (108) to be against a second surface (106) of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.

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