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1. 发明公开

EP2166405A2 Liquid crystal display unit 审中-公开
标题翻译：液晶显示单元
公开(公告)号：EP2166405A2
公开(公告)日：2010-03-24
申请号：EP09251394.4
申请日：2009-05-27
申请人： Hitachi, Ltd.
发明人： Yamashita, Yoshiharu , Morishima, Akitoshi , Sato, Katsunari , Nishijima, Abiko , Ohashi, Shigeo
IPC分类号： G02F1/13357
CPC分类号： G02B6/0085 , G02B6/0031 , G02B6/0073
摘要： There is provided a slim liquid crystal display unit having a large screen by providing a slim structure capable of sufficiently radiating the heat from a light source. The liquid crystal display unit 1 according to the present invention includes: a liquid crystal panel 101; an optical guiding board 121 installed on a rear face thereof; a pair of light source-mounted substrate 132 disposed, opposing right and left side faces thereof; a light source 131 mounted on the light source-mounted substrate 132; a metal frame 133 connected on the opposite side to the optical guiding board 121 of the light source-mounted substrate 132; a chassis member 111 for supporting the optical guiding board 121 and a reflection sheet group 150; and a thermal diffusion member 161 fixed onto the metal frame 133 along with the chassis member 111. The chassis member 111 has a stepped portion 111a in the vicinity of the light source 131. Between the stepped portion 111a and the reflection sheet group 150, a thermal insulation member 112 is attached.
摘要翻译：通过提供能够充分地散发来自光源的热量的纤细结构，提供了具有大屏幕的薄型液晶显示单元。根据本发明的液晶显示单元1包括：液晶面板101; 安装在其后表面上的光导板121; 一对安装有光源的基板132，其设置在其相对的右侧和左侧面上; 安装在安装有光源的基板132上的光源131; 连接在光源安装基板132的导光板121的相反侧的金属框133，用于支撑导光板121和反射片组150的底座构件111; 和与基底构件111一起固定到金属框架133上的热扩散构件161.基底构件111在光源131附近具有台阶部分111a。在台阶部分111a和反射片组150之间，隔热构件112被附接。

2. 发明公开

EP1511369A2 Liquid cooling system and electronic apparatus using the same 审中-公开
标题翻译： Flüssigkeits-Kühlsystemund elektronischerGerätmit diesem系统
公开(公告)号：EP1511369A2
公开(公告)日：2005-03-02
申请号：EP04005161.7
申请日：2004-03-04
申请人： Hitachi, Ltd.
发明人： Minamitani, Rintaro , Matsushita, Shinji , Ohashi, Shigeo , Kondo, Yoshihiro , Naganawa, Takashi , Suzuki, Osamu
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system for use in an electronic apparatus, being super small-sized and thin in the shape and being suitable for cooling a heat-generation part, such as, a semiconductor element having large amount of heat generation, for example, with maintaining the corrosion resistance thereof for a long time period, comprises: a pump (1) for supplying a cooling liquid; a heat-receiving jacket (2), being supplied with the cooling liquid, for receiving heat from an electronic parts; a radiator, being supplied with the cooling liquid passing through the heat-receiving jacket, for radiation heat; and flow passages for circulating the cooling liquid in a route passing through the radiator back to said pump, wherein an ion exchange bag (9), having an ion exchange resin (11) and a bag enclosing it therein, is disposed in a part of the constituent parts of the liquid cooling system, and/or the ion exchange bag (9) is exchangeable.
摘要翻译：一种用于电子设备的液体冷却系统，其尺寸超小型并且薄，并且适于冷却例如具有大量发热量的发热部件的发热部件，例如维持其耐腐蚀性长时间包括：用于供应冷却液的泵（1）; 供给冷却液的受热套（2），用于从电子部件接收热量; 散热器，供给通过热接收护套的冷却液用于辐射热; 以及用于使通过散热器的路线中的冷却液循环回所述泵的流路，其中具有离子交换树脂（11）的离子交换袋（9）和其中包围的袋子被设置在液体冷却系统的组成部分和/或离子交换袋（9）是可更换的。

3. 发明授权

EP0601516B1 Cooling device 失效
标题翻译：冷却装置
公开(公告)号：EP0601516B1
公开(公告)日：1998-10-07
申请号：EP93119629.9
申请日：1993-12-06
申请人： Hitachi, Ltd.
发明人： Sato, Kazuo , Shikida, Mitsuhiro , Ohashi, Shigeo , Hatada, Toshio , Ashiwake, Noriyuki , Tanaka, Shinji , Harada, Takeshi , Honda, Yukio
IPC分类号： H01L23/467 , F04B43/04 , H02N1/00
CPC分类号： H01L23/467 , F04B43/043 , F04B45/047 , H01L2924/0002 , H01L2924/15192 , H02K99/20 , H02N1/006 , H01L2924/00

4. 发明公开

EP0489326A2 Cooling system of electronic computer 失效
标题翻译： Elektronisches-电脑Kühlsystem。
公开(公告)号：EP0489326A2
公开(公告)日：1992-06-10
申请号：EP91120034.3
申请日：1991-11-25
申请人： HITACHI, LTD.
发明人： Ohashi, Shigeo , Nakajima, Tadakatsu , Kuwahara, Heikichi , Hatada, Toshio , Matsushima, Hitoshi , Sato, Motohiro , Inouye, Hiroshi , Ohba, Takao , Yamagiwa, Akira
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/208 , F28D15/0233 , F28D15/0275 , G06F1/20 , G06F1/206 , G06F2200/201 , H05K7/20809
摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members (4, 41) for thermally connecting semiconductor devices (1) whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards (2) onto which the semiconductor devices (1) and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing (5). Or, the circuit boards (2) and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members (4, 41) is obtained.
摘要翻译：一种电子计算机冷却系统，具有用于冷却电子计算机的冷却装置和用于将通过冷却升高其运行速度的半导体装置（1）冷却到冷却装置的低温源的冷却构件（41,41）。安装构成电子计算机的半导体装置（1）等的电路板（2），冷却装置等冷却装置紧密地封闭在单个壳体（5）中。或者，电路板（2）和冷却装置分别紧密地封闭在分离的可拆卸的壳体中。因此，可以获得通过使用冷却部件（41,41）可靠地冷却期望的半导体器件的结构。

5. 发明公开

EP1524888A3 Cooling device and electronic apparatus building in the same 审中-公开
标题翻译：冷却器和这些含电子设备
公开(公告)号：EP1524888A3
公开(公告)日：2007-10-17
申请号：EP04005162.5
申请日：2004-03-04
申请人： Hitachi, Ltd.
发明人： Suzuki, Osamu , Ohashi, Shigeo , Matsushima, Hitoshi , Matsushita, Shinji , Asano, Ichirou , Minamitani, Rintaro
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： F28F9/262 , F28D1/05366 , F28D15/00 , F28D2021/0031 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： In a liquid cooling system (107, 108) of low costs and being installable with high density into a server having a several kinds of predetermined heights of housings, each of devices building up the liquid cooling system is set to be within about 44 mm, being the standard height of a lack when installing into a cabinet for the server lack of lack-mount method, in particular, about from 40 mm to 36 mm, and this is combined with, thereby building up a liquid cooling system of low costs and enabling high density installation, for an electronic apparatus of lack-mount method having different heights.

6. 发明授权

EP0489326B1 Cooling system of electronic computer 失效
标题翻译：电子计算机的冷却系统
公开(公告)号：EP0489326B1
公开(公告)日：1999-05-26
申请号：EP91120034.3
申请日：1991-11-25
申请人： Hitachi, Ltd.
发明人： Ohashi, Shigeo , Nakajima, Tadakatsu , Kuwahara, Heikichi , Hatada, Toshio , Matsushima, Hitoshi , Sato, Motohiro , Inouye, Hiroshi , Ohba, Takao , Yamagiwa, Akira
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/208 , F28D15/0233 , F28D15/0275 , G06F1/20 , G06F1/206 , G06F2200/201 , H05K7/20809

7. 发明公开

EP0489326A3 Cooling system of electronic computer 失效
标题翻译：电子计算机冷却系统
公开(公告)号：EP0489326A3
公开(公告)日：1993-06-30
申请号：EP91120034.3
申请日：1991-11-25
申请人： HITACHI, LTD.
发明人： Ohashi, Shigeo , Nakajima, Tadakatsu , Kuwahara, Heikichi , Hatada, Toshio , Matsushima, Hitoshi , Sato, Motohiro , Inouye, Hiroshi , Ohba, Takao , Yamagiwa, Akira
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/208 , F28D15/0233 , F28D15/0275 , G06F1/20 , G06F1/206 , G06F2200/201 , H05K7/20809
摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members (4, 41) for thermally connecting semiconductor devices (1) whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards (2) onto which the semiconductor devices (1) and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing (5). Or, the circuit boards (2) and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members (4, 41) is obtained.

8. 发明公开

EP0534440A1 Cooled electronic device 失效
标题翻译： Gekühlteelektronische Anordnung。
公开(公告)号：EP0534440A1
公开(公告)日：1993-03-31
申请号：EP92116400.0
申请日：1992-09-24
申请人： HITACHI, LTD.
发明人： Ohashi, Shigeo , Hatada, Toshio , Inouye, Hiroshi
IPC分类号： H01L23/44 , H01L23/42 , H01L23/473
CPC分类号： H01L23/473 , H01L23/42 , H01L23/44 , H01L2924/0002 , H05K7/20236 , H01L2924/00
摘要： A wiring substrate (2) having a number of semi-conductor elements (1) mounted thereon are contained together with a coolant (3) in a flexible film (6) formed in sack-shape, the sack is then sealed, and a heat transfer member (32) is pressed to the outside of the flexible film (6). A temperature difference between the surface of the semi-conductor element (1) and the heat transfer member-pressed surface of the coolant (3) causes a convection which acts to transmit the heat generated at the semiconductor elements (1) to the heat transfer member (32). Although the heights of the semiconductor elements (1) mounted on the substrate (2) are different from each other, the flexible film (6) formed in sack-shape can be freely transformed so as to be in close contact with the element at every portion irrespective of the different heights thereof, and the cooling operation can desirably be carried out without applying excessive load to the substrate (2) and the semiconductor elements (1).
摘要翻译：具有安装在其上的多个半导体元件（1）的布线基板（2）与形成为袋状的柔性膜（6）中的冷却剂（3）一起容纳，然后密封袋，并且将热量传递构件（32）被压到柔性膜（6）的外部。半导体元件（1）的表面和冷却剂（3）的传热构件压制表面之间的温差导致对流，其作用是将在半导体元件（1）处产生的热量传递到传热会员（32）。虽然安装在基板（2）上的半导体元件（1）的高度彼此不同，但是形成为袋状的柔性膜（6）可以自由变形，以便在每一个位置与元件紧密接触部分而不管其不同的高度，并且可以期望地执行冷却操作，而不对基板（2）和半导体元件（1）施加过大的负载。

9. 发明公开

EP0601516A1 Cooling device 失效
标题翻译： Kühlungseinrichtung。
公开(公告)号：EP0601516A1
公开(公告)日：1994-06-15
申请号：EP93119629.9
申请日：1993-12-06
申请人： HITACHI, LTD.
发明人： Sato, Kazuo , Shikida, Mitsuhiro , Ohashi, Shigeo , Hatada, Toshio , Ashiwake, Noriyuki , Tanaka, Shinji , Harada, Takeshi , Honda, Yukio
IPC分类号： H01L23/467 , F04B43/04 , H02N1/00
CPC分类号： H01L23/467 , F04B43/043 , F04B45/047 , H01L2924/0002 , H01L2924/15192 , H02K99/20 , H02N1/006 , H01L2924/00
摘要： A cooling device (1) according to the present invention, in which a space (37) is formed by means of flat electrodes (31, 32) and side plates (5, 6) disposed on the ends of the flat electrodes (31, 32), and a flexible film (4) fastened in that space (37) in a shape of the letter S, is fixed to a semiconductor package (2) so that one of the flat electrodes (31, 32) is fitted on the semiconductor package (2). The respective flat electrodes (31, 32) are alternately powered to move the S shaped section of the flexible film (4).
摘要翻译：根据本发明的冷却装置（1），其中通过平面电极（31,32）和设置在扁平电极（31,32）的端部上的侧板（5,6）形成空间（37） 32），并且固定在该字形S的形状的空间（37）中的柔性膜（4）固定到半导体封装（2），使得一个平板电极（31,32）安装在半导体封装（2）。各个扁平电极（31,32）交替供电以移动柔性膜（4）的S形部分。

10. 发明授权

EP0298372B1 Semiconductor cooling apparatus 失效
标题翻译：半导体冷却装置
公开(公告)号：EP0298372B1
公开(公告)日：1993-01-13
申请号：EP88110467.3
申请日：1988-06-30
申请人： HITACHI, LTD.
发明人： Ohashi, Shigeo , Kuwabara, Heikichi , Nakajima, Tadakatsu , Nakayama, Wataru , Sato, Motohiro , Kasai, Kenichi
IPC分类号： H01L23/42 , H05K7/20
CPC分类号： H01L23/427 , H01L23/44 , H01L2924/0002 , H01L2924/00

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