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    • 1. 发明公开
    • Power conversion device
    • Leistungswandlungsvorrichtung
    • EP2290681A2
    • 2011-03-02
    • EP10251367.8
    • 2010-07-30
    • Hitachi, Ltd.
    • Funakoshi, SunaoSuzuki, OsamuYasuda, YosukeTanaka, TakeshiHishida, AkihiroYamaguchi, Satoshi
    • H01L23/427
    • H01L23/427H01L23/467H01L2924/0002H05K7/20936H01L2924/00
    • The invention provides a power conversion device capable of cooling the power semiconductors efficiently and downsizing the device. The power conversion device comprises a plurality of power semiconductor devices, a heat receiving member, a plurality of heat pipes and a plurality of heat radiating fins, wherein the plurality of semiconductor devices are attached to one side of the heat receiving member, and the plurality of heat pipes are attached to the other side of the heat receiving member, the plurality of heat pipes have heat receiving sections thermally connected to the heat receiving member, and a portion of the plurality of heat pipes has heat radiating sections erected from both ends of the heat receiving section, and another portion of the plurality of heat pipes has a heat radiating section erected from only one side of the heat receiving section, the plurality of heat radiating fins are disposed on the heat radiating sections of the plurality of heat pipes, and the pipes composing the heat radiating sections of the heat pipes are arranged in a zigzag manner.
    • 本发明提供了能够有效地冷却功率半导体并且使装置小型化的电力转换装置。 电力转换装置包括多个功率半导体装置,受热部件,多个热管和多个散热片,其中多个半导体装置安装在热接收部件的一侧,并且多个 的热管附接到所述受热部件的另一侧,所述多个热管具有与所述受热部件热连接的热接收部,所述多个热管的一部分具有从两端竖立的散热部 所述多个热管的另一部分具有仅从所述受热部的一侧竖立的散热部,所述多个散热片设置在所述多个热管的所述散热部上, 并且构成热管的散热部的管配置成Z字形。
    • 9. 发明公开
    • Liquid cooling system and electronic apparatus using the same
    • Flüssigkeits-Kühlsystemund elektronischerGerätmit diesem系统
    • EP1511369A2
    • 2005-03-02
    • EP04005161.7
    • 2004-03-04
    • Hitachi, Ltd.
    • Minamitani, RintaroMatsushita, ShinjiOhashi, ShigeoKondo, YoshihiroNaganawa, TakashiSuzuki, Osamu
    • H05K7/20
    • H01L23/473G06F1/203G06F2200/201H01L2924/0002H01L2924/00
    • A liquid cooling system for use in an electronic apparatus, being super small-sized and thin in the shape and being suitable for cooling a heat-generation part, such as, a semiconductor element having large amount of heat generation, for example, with maintaining the corrosion resistance thereof for a long time period, comprises: a pump (1) for supplying a cooling liquid; a heat-receiving jacket (2), being supplied with the cooling liquid, for receiving heat from an electronic parts; a radiator, being supplied with the cooling liquid passing through the heat-receiving jacket, for radiation heat; and flow passages for circulating the cooling liquid in a route passing through the radiator back to said pump, wherein an ion exchange bag (9), having an ion exchange resin (11) and a bag enclosing it therein, is disposed in a part of the constituent parts of the liquid cooling system, and/or the ion exchange bag (9) is exchangeable.
    • 一种用于电子设备的液体冷却系统,其尺寸超小型并且薄,并且适于冷却例如具有大量发热量的发热部件的发热部件,例如维持 其耐腐蚀性长时间包括:用于供应冷却液的泵(1); 供给冷却液的受热套(2),用于从电子部件接收热量; 散热器,供给通过热接收护套的冷却液用于辐射热; 以及用于使通过散热器的路线中的冷却液循环回所述泵的流路,其中具有离子交换树脂(11)的离子交换袋(9)和其中包围的袋子被设置在 液体冷却系统的组成部分和/或离子交换袋(9)是可更换的。
    • 10. 发明公开
    • Heat-pipe type cooling apparatus
    • KühlungsapparatvomWärmerohrtyp。
    • EP0661741A1
    • 1995-07-05
    • EP94120127.9
    • 1994-12-19
    • HITACHI, LTD.
    • Suzuki, OsamuKuwahara, HeikichiFujioka, KazumasaSaitoo, SyuujiSuzuki, NobuoIsaka, Koichi
    • H01L23/427
    • F28D15/0275F28F1/32F28F2215/04H01L23/427H01L2924/0002H05K7/20936H01L2924/00
    • A cooling apparatus having a plurality of heat pipes (1a,1b) is improved to reduce the condensation capacity of selected heat pipes when ambient air temperature is low, so as to facilitate start-up of the cooling apparatus from a state in which the working fluid (5) in the heat pipes has been frozen. The cooling apparatus has a block (3) of a high heat conductivity in which one end of each heat pipe serving as an evaporation section of the heat pipe is embedded. Heat radiation fins (2a,2b) are attached to portions of the heat pipes exposed from the block, so that the exposed portions of the heat pipes serve as condensation sections of the respective heat pipes. There are two types of heat radiation fins: a first type fins (2a) which are attached to all the heat pipes and a second type fins (2b) which are attached only to selected heat pipes.
    • 改善了具有多个热管(1a,1b)的冷却装置,以在周围空气温度低时降低所选热管的冷凝能力,以便于冷却装置从工作状态 热管中的流体(5)已被冷冻。 冷却装置具有高导热性的块(3),其中嵌入用作热管的蒸发部的每个热管的一端。 热辐射翅片(2a,2b)附着在从块体露出的热管的部分上,使得热管的暴露部分作为各热管的冷凝部分。 有两种类型的散热翅片:附着在所有热管上的第一类翅片(2a)和仅安装在选定热管上的第二型翅片(2b)。