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    • 3. 发明公开
    • GROUP-III NITRIDE BASED HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) WITH BARRIER/SPACER LAYER
    • 具有阻挡层/间隔层的基于III族氮化物的高电子迁移率晶体管(HEMT)
    • EP1390983A1
    • 2004-02-25
    • EP02769655.8
    • 2002-04-11
    • Cree, Inc.The Regent of the University of California
    • SMORCHKOVA, Ioulia, P.WALUKIEWICZ, WladyslawCHAVARKAR, PrashantWU, YifengKELLER, StaciaMISHRA, Umesh
    • H01L29/778
    • H01L29/7783H01L29/2003
    • A group III nitride based high electron mobility transistor (HEMT) (10) is disclosed that provides improved high frequency performance. One embodiment of the HEMT (10) comprises a GaN buffer layer (26), with an AlyGa1-yN (y=1 or y 1) layer (28) on the Gan buffer layer (26). An AlxGa1-xN (0≤x≤0.5) barrier layer (30) is on the AlyGa1-yN layer (28), opposite the GaN buffer layer (26), the AlyGa1-yN layer (28) having a higher Al concentration than that of the AlxGa1-xN barrirer layer (30). A preferred AlyGa1-yN layer (28) has y=1 or y≃1 and a preferred AlxGa1-xN barrier layer (30) has 0≤0.5. A 2DEG (38) forms at the interface between the GaN buffer layer (26) and the AlyGa1-yN layer (28). Respective source, drain and gate contacts (32, 34, 36) are formed on the AlxGa1-xN barrier layer (30). The HEMT (10) can also include a substrate (22) adjacent to the buffer layer (26), opposite the AlyGa1-yN layer (28) and a nucleation layer (24) can be included between the GaN buffer layer (26) and the substrate (22).
    • 公开了III族氮化物基高电子迁移率晶体管(HEMT)(10),其提供改进的高频性能。 HEMT(10)的一个实施例包括GaN缓冲层(26),在Gan缓冲层(26)上具有AlyGa1-yN(y = 1或y1)层(28)。 Al x Ga 1-x N(0≤x≤0.5)阻挡层(30)位于与GaN缓冲层(26)相对的Al y Ga 1-y N层(28)上,Al y Ga 1-y N层 AlxGa1-xN分枝层(30)的结构。 优选的AlyGa1-yN层(28)具有y = 1或y≥1,优选的Al x Ga 1-x N势垒层(30)具有0≤0.5。 2DEG(38)在GaN缓冲层(26)与AlyGa1-yN层(28)之间的界面处形成。 在Al x Ga 1-x N势垒层(30)上形成各自的源极,漏极和栅极接触(32,34,36)。 HEMT(10)还可以包括与AlyGa1-yN层(28)相对的与缓冲层(26)相邻的衬底(22),并且成核层(24)可以包括在GaN缓冲层(26)和 衬底(22)。