专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP2696374A4 SUBSTRATE PROCESSING SYSTEM HAVING FUNCTION FOR PREVENTING DAMAGE 审中-公开
标题翻译：基板处理系统，防损功能
公开(公告)号：EP2696374A4
公开(公告)日：2016-01-20
申请号：EP12753371
申请日：2012-06-22
申请人： SNU PRECISION CO LTD
发明人： PARK SANG HYUN , LEE DONG HYUN , OH HYUN PIL , JEON KWANG JIN , KWON JIN HAON , PARK SUNG JIN
IPC分类号： H01L31/18 , B01J3/00 , C23C14/06 , C23C14/24 , H01J37/32 , H01L31/042
CPC分类号： H01J37/32807 , B01J3/002 , C23C14/06 , C23C14/243

2. 发明授权

EP2519656B1 VAPORIZATION APPARATUS 有权
标题翻译：汽化装置
公开(公告)号：EP2519656B1
公开(公告)日：2017-10-04
申请号：EP10841200.8
申请日：2010-12-24
申请人： SNU Precision Co., Ltd.
发明人： SEO, Seung Cheol , GONG, Doo Won , LEE, Jong Ha , LEE, Kyung Bum , JUNG, Sung Jae , CHO, Whang Sin
IPC分类号： C23C14/24 , C23C14/54 , B01D1/00 , C23C16/448 , C23C16/52
CPC分类号： C23C16/4485 , B01D1/0017 , B01D1/0082 , C23C14/24 , C23C14/543 , C23C16/52

3. 发明公开

EP2511395A3 Depositing apparatus for forming thin film 审中-公开
标题翻译：用于生产薄膜的沉积装置
公开(公告)号：EP2511395A3
公开(公告)日：2015-02-18
申请号：EP12163927.2
申请日：2012-04-12
申请人： SNU Precision Co., Ltd.
发明人： Cho, Whang Sin , Song, Ki Chul , Jung, Seung Chul , Ahn, Woo Jung
IPC分类号： C23C14/12 , C23C14/24 , C23C14/26 , C23C14/54 , H05B33/10 , C23C14/56
CPC分类号： C23C14/24 , C23C14/12 , C23C14/26 , C23C14/544 , C23C14/564
摘要： Disclosed is a depositing apparatus for forming a thin film, the apparatus including a source container in which a source material to be deposited on a substrate is accommodated in a solid or liquid state; an evaporation chamber which couples and communicates with the source container above the source container, and through which an evaporated source material from the source container passes; a spraying hole which is formed on a top of the evaporation chamber, and sprays upward the evaporated source material passed through the evaporation chamber; a first heater which is provided above the source material inside the evaporation chamber or the source container, and supplies heat to the source material to evaporate the source material accommodated in the source container; and a block plate which is provided above the first heater inside the evaporation chamber, and prevents the source material or foreign materials contained in the source container from being sputtered and attached to the spraying hole while the first heater supplies heat to the source material.

4. 发明公开

EP2530705A4 VACUUM DEPOSITION APPARATUS 审中-公开
标题翻译：真空蒸发
公开(公告)号：EP2530705A4
公开(公告)日：2014-07-02
申请号：EP11737256
申请日：2011-01-21
申请人： SNU PRECISION CO LTD
发明人： BAK BYEONG MIN , GONG DOO WON , KWON JIN HAON , JUNG YONG BEOM , CHO WHANG SIN , JUNG SUNG JAE
IPC分类号： H01L21/205 , C23C14/56 , C23C16/44 , C23C16/54
CPC分类号： C23C14/56 , C23C16/4412 , C23C16/54

5. 发明公开

EP2412005A4 SOURCE SUPPLYING UNIT, METHOD FOR SUPPLYING SOURCE, AND THIN FILM DEPOSITING APPARATUS 审中-公开
标题翻译：电源提供方法电源供给和薄膜沉淀装置
公开(公告)号：EP2412005A4
公开(公告)日：2013-11-20
申请号：EP10756370
申请日：2010-03-26
申请人： SNU PRECISION CO LTD
发明人： BAE KYUNG BIN , RHO JUN SEO , CHO WHANG SIN , KWON JIN HAON , LEE JONG HA , KIM YOU HYUN , YOON HYUNG SEOK
IPC分类号： H01L21/203
CPC分类号： H01L21/67115 , C23C14/243 , C23C14/26 , H01L21/67109
摘要： Provided are a source supplying unit and a method for supplying a source. The source supplying unit includes a pot configured to store a source material, an injector communicating with the pot to inject the source material evaporated from the pot, a high frequency coil part surrounding an outside of the pot, and a resistance-type heating part disposed at an outside of the injector. Since a high frequency induction heating method and a resistance-type heating method are combined to evaporate a source material to be supplied, a large amount of source material can be used, and the thickness and quality of a thin film can be easily controlled.

6. 发明公开

EP2519656A2 VAPORIZATION APPARATUS AND METHOD FOR CONTROLLING THE SAME 有权
标题翻译： VERDAMPFUNGSVORRICHTUNG
公开(公告)号：EP2519656A2
公开(公告)日：2012-11-07
申请号：EP10841200.8
申请日：2010-12-24
申请人： SNU Precision Co., Ltd.
发明人： SEO, Seung Cheol , GONG, Doo Won , LEE, Jong Ha , LEE, Kyung Bum , JUNG, Sung Jae , CHO, Whang Sin
IPC分类号： C23C14/24
CPC分类号： C23C16/4485 , B01D1/0017 , B01D1/0082 , C23C14/24 , C23C14/543 , C23C16/52
摘要： Disclosed are a vaporization apparatus and a control method for the same. The vaporization apparatus includes a vaporization crucible adapted to receive a raw material; a vaporization heating unit adapted to vaporize the raw material by heating the vaporization crucible; a temperature measuring unit adapted to measure temperature of the vaporization crucible; a power measuring unit adapted to measure an applied power of the vaporization heating unit; and a control unit adapted to control a vaporization quantity of the raw material based on any one of a temperature variation value of the temperature measuring unit and a power variation value of the power measuring unit. The vaporization apparatus uses a non-contact/electronic method which measures a vaporization quantity through a temperature variation value and a power variation value during vaporization of a raw material. Therefore, since, differently from a contact method, a vaporization quantity measuring unit does not directly contact a raw material gas, various raw materials can be supplied and large quantity raw material supply or long time raw material supply can be achieved without deterioration of the function. In addition, preciseness of the raw material supply may be enhanced since the electronic method is capable of precise measurement of the vaporization quantity.
摘要翻译：公开了一种蒸发装置及其控制方法。蒸发装置包括适于容纳原料的蒸发坩埚; 蒸发加热单元，其适于通过加热所述蒸发坩埚来蒸发所述原料; 适于测量蒸发坩埚的温度的温度测量单元; 功率测量单元，其适于测量所述汽化加热单元的施加功率; 以及控制单元，其适于基于所述温度测量单元的温度变化值和所述功率测量单元的功率变化值中的任一个来控制所述原料的蒸发量。蒸发装置使用在原料蒸发期间通过温度变化值和功率变化值来测量蒸发量的非接触/电子方法。因此，与接触方法不同的是，蒸发量测量单元不直接接触原料气体，可以提供各种原料，并且可以实现大量的原料供给或长时间的原料供应而不会使功能变差。此外，由于电子方法能够精确地测量蒸发量，所以可以提高原料供应的精度。

7. 发明公开

EP2696374A1 SUBSTRATE PROCESSING SYSTEM HAVING FUNCTION FOR PREVENTING DAMAGE 审中-公开
标题翻译：子系统麻省理工学院
公开(公告)号：EP2696374A1
公开(公告)日：2014-02-12
申请号：EP12753371.9
申请日：2012-06-22
申请人： SNU Precision Co., Ltd.
发明人： PARK, Sang Hyun , LEE, Dong Hyun , OH, Hyun Pil , JEON, Kwang Jin , KWON, Jin Haon , PARK, Sung Jin
IPC分类号： H01L31/18 , H01L31/042
CPC分类号： H01J37/32807 , B01J3/002 , C23C14/06 , C23C14/243
摘要： Disclosed is a substrate processing system with a damage preventing function, comprising: a fluid tank which stores fluid; a chamber which receives the fluid from the fluid tank and provides a space where a substrate is processed; a pipe which connects the fluid tank and the chamber and through which the fluid flows; and a damage preventing unit which allows the fluid tank to be changed in position corresponding to thermal expansion caused in the pipe by receiving heat as the fluid flows in the pipe. With this, the substrate processing system with the damage preventing function for allowing the fluid tank to correspond to change in volume due to the thermal expansion of the pipe and preventing the fluid tank from damage is provided.
摘要翻译：公开了一种具有防损功能的基板处理系统，包括：存储流体的流体箱; 接收来自流体箱的流体并提供衬底被处理的空间的腔室; 连接流体箱和室的管道，流体流过该管道; 以及损坏防止单元，其允许流体箱在管道中随着流体流动而受到热量而在管道中引起的热膨胀相应地改变位置。由此，提供了具有防止流体槽对应于由于管道的热膨胀而导致的体积变化并防止流体箱损坏的损伤防止功能的基板处理系统。

8. 发明公开

EP2562288A2 VACUUM DEPOSITION APPARATUS 审中-公开
标题翻译： VAKUUMABSCHEIDUNGSVORRICHTUNG
公开(公告)号：EP2562288A2
公开(公告)日：2013-02-27
申请号：EP12753370.1
申请日：2012-05-22
申请人： SNU Precision Co., Ltd.
发明人： KONG, Doo Won , LEE, Jong Ha , JUNG, Sung Jea , PARK, Sang Hyun
IPC分类号： C23C14/24
CPC分类号： C23C16/4401 , C23C14/50 , C23C14/562 , C23C14/564 , C23C16/4586 , C23C16/545
摘要： Disclosed is a vacuum deposition apparatus for depositing a source on a substrate arranged in a vacuum chamber, the vacuum deposition apparatus including: a substrate carrier which carries the substrate; a nozzle which is arranged to be opposite to the substrate carrier and jets a source to the substrate arranged on the substrate carrier; and a temperature controller which controls a surface temperature of the substrate carrier so that the source can be prevented from being deposited on the substrate carrier.
With this, there is provided a vacuum deposition apparatus which can minimizes deterioration in productivity caused when sources deposited as particles on the substrate carrier for carrying a substrate.
摘要翻译：公开了一种用于在布置在真空室中的基板上沉积源的真空沉积设备，该真空沉积设备包括：承载基板的基板载体; 布置成与衬底载体相对的喷嘴，并将源喷射到布置在衬底载体上的衬底上; 以及温度控制器，其控制衬底载体的表面温度，使得可以防止源沉积在衬底载体上。由此，提供了一种真空沉积装置，其可以最小化当作为颗粒沉积在用于承载基板的基板载体上的源时产生的生产率的劣化。

9. 发明公开

EP2530705A2 VACUUM DEPOSITION APPARATUS 审中-公开
标题翻译： VAKUUMAUFDAMPFUNGSVORRICHTUNG
公开(公告)号：EP2530705A2
公开(公告)日：2012-12-05
申请号：EP11737256.5
申请日：2011-01-21
申请人： SNU Precision Co., Ltd.
发明人： BAK, Byeong Min , GONG, Doo Won , KWON, Jin Haon , JUNG, Yong Beom , CHO, Whang Sin , JUNG, Sung Jae
IPC分类号： H01L21/205
CPC分类号： C23C14/56 , C23C16/4412 , C23C16/54
摘要： Disclosed is a vacuum deposition apparatus, which comprises: a chamber mounted with a source for jetting an application material in the gaseous state for deposition onto a substrate; heaters formed to the inner wall of the chamber and internal parts; a pump for aspirating air out of the chamber; and a plurality of cold traps interposed between the chamber and the pump for cooling the air aspirated by the pump to remove the application material from the air. According to the vacuum deposition apparatus, it is possible to prevent direct damage to the internal parts or the inner wall of the chamber by application materials accumulated thereon. Additionally, the plurality of cold traps prevent pollution and stoppage in continuous production which allows substitution to be carried out without stoppage. Therefore, productivity may be improved compared to other equipment with similar specifications.
摘要翻译：公开了一种真空沉积设备，其包括：安装有用于喷射处于气态的涂布材料的源的腔室，用于沉积到衬底上; 加热器形成在腔室的内壁和内部部件上; 用于将空气抽出室的泵; 以及插入在所述室和所述泵之间的多个冷阱，用于冷却由所述泵抽吸的空气以从所述空气中移除所述施加材料。根据真空沉积装置，可以通过积聚在其上的施加材料来防止对室的内部部件或内壁的直接损坏。此外，多个冷阱能够防止连续生产中的污染和停止，从而能够不间断地进行替代。因此，与具有相似规格的其他设备相比，可以提高生产率。

10. 发明公开

EP2412005A2 SOURCE SUPPLYING UNIT, METHOD FOR SUPPLYING SOURCE, AND THIN FILM DEPOSITING APPARATUS 审中-公开
标题翻译：电源提供方法电源供给和薄膜沉淀装置
公开(公告)号：EP2412005A2
公开(公告)日：2012-02-01
申请号：EP10756370.2
申请日：2010-03-26
申请人： SNU Precision Co., Ltd.
发明人： BAE, Kyung Bin , RHO, Jun Seo , CHO, Whang Sin , KWON, Jin Haon , LEE, Jong Ha , KIM, You Hyun , YOON, Hyung Seok
IPC分类号： H01L21/203
CPC分类号： H01L21/67115 , C23C14/243 , C23C14/26 , H01L21/67109
摘要： Provided are a source supplying unit and a method for supplying a source. The source supplying unit includes a pot configured to store a source material, an injector communicating with the pot to inject the source material evaporated from the pot, a high frequency coil part surrounding an outside of the pot, and a resistance-type heating part disposed at an outside of the injector. Since a high frequency induction heating method and a resistance-type heating method are combined to evaporate a source material to be supplied, a large amount of source material can be used, and the thickness and quality of a thin film can be easily controlled.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式