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    • 1. 发明公开
    • VACUUM VAPOR DEPOSITION METHOD
    • VAKUUMDAMPFABSCHEIDUNGSVERFAHREN
    • EP3103893A1
    • 2016-12-14
    • EP16177892.3
    • 2010-06-28
    • Mitsubishi Heavy Industries, Ltd.
    • Yanagi, Yuji
    • C23C14/12C23C14/24
    • C23C14/24C23C14/12C23C14/243C23C14/543
    • In a vacuum vapor deposition method including a plurality of linear-shaped vaporization sources, equal-thickness surfaces (19a, 19b) are calculated for vaporization containers (8a, 8b), respectively. Each of the equal-thickness surfaces (19a, 19b) indicates where a deposition amount of vapor of a vaporization material released from release holes (13a, 13b) in the corresponding vaporization container (8a, 8b) is the same per unit time. Then, the vaporization containers (8a, 8b) are placed in such a manner that contact points of the respective equal-thickness surfaces (19a, 19b) all coincide with each other on a deposition surface of a substrate (4), each of the contact points being where the corresponding equal-thickness surfaces (19a, 19b) come in contact with the deposition surface of the substrate (4).
    • 在包括多个线性蒸发源的真空气相沉积方法中,分别为蒸发容器(8a,8b)计算等厚度的表面(19a,19b)。 每个等厚度表面(19a,19b)表示在相应的蒸发容器(8a,8b)中从释放孔(13a,13b)释放的蒸发材料的蒸气的沉积量在每单位时间相同的地方。 然后,将蒸发容器(8a,8b)以这样的方式设置,使得各个等厚度表面(19a,19b)的接触点在基板(4)的沉积表面上彼此重合, 接触点是相应的等厚度表面(19a,19b)与衬底(4)的沉积表面接触的位置。
    • 10. 发明公开
    • Vacuum vapor deposition apparatus
    • 真空气相沉积设备
    • EP2284292A1
    • 2011-02-16
    • EP10167474.5
    • 2010-06-28
    • Mitsubishi Heavy Industries, Ltd.
    • Yanagi, Yuji
    • C23C14/12C23C14/24
    • C23C14/24C23C14/12C23C14/243C23C14/543
    • In a vacuum vapor deposition apparatus including a plurality of linear-shaped vaporization sources, equal-thickness surfaces (19a, 19b) are calculated for vaporization containers (8a, 8b), respectively. Each of the equal-thickness surfaces (19a, 19b) indicates where a deposition amount of vapor of a vaporization material released from release holes (13a, 13b) in the corresponding vaporization container (8a, 8b) is the same per unit time. Then, the vaporization containers (8a, 8b) are placed in such a manner that contact points of the respective equal-thickness surfaces (19a, 19b) all coincide with each other on a deposition surface of a substrate (4), each of the contact points being where the corresponding equal-thickness surfaces (19a, 19b) come in contact with the deposition surface of the substrate (4).
    • 在具有多个线状的气化源的真空蒸镀装置中,分别计算蒸发容器(8a,8b)的等厚面(19a,19b)。 每个等厚表面(19a,19b)指示从相应汽化容器(8a,8b)中的释放孔(13a,13b)释放的汽化材料的蒸汽沉积量每单位时间相同的位置。 然后,以使各等厚表面(19a,19b)的接触点在基板(4)的蒸镀面上全部一致的方式配置蒸发容器(8a,8b) 接触点是对应的等厚度表面(19a,19b)与衬底(4)的沉积表面接触的地方。