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71. 发明公开

EP0977471A4 METHOD AND APPARATUS FOR FABRICATING CIRCUIT-FORMING-SUBSTRATE AND CIRCUIT-FORMING-SUBSTRATE MATERIAL 有权
标题翻译：方法和设备制造电路下基板与电路形成衬底材料
公开(公告)号：EP0977471A4
公开(公告)日：2001-10-10
申请号：EP98957171
申请日：1998-12-04
申请人： MATSUSHITA ELECTRONICS CORP
发明人： YAMANE SHIGERU , NISHII TOSHIHIRO , NAKAMURA SHINJI , SAKAI MASAYUKI
IPC分类号： B23K26/00 , B23K26/12 , B23K26/38 , H05K3/00 , H05K3/22 , H05K3/40
CPC分类号： H05K3/0032 , H05K3/227 , H05K3/4069 , H05K2201/0355 , H05K2203/081 , H05K2203/085 , H05K2203/1383 , H05K2203/1388 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T156/1056 , Y10T156/1062 , Y10T428/24994 , Y10T442/2902
摘要： A method of fabricating a circuit-forming-substrate comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability circuit forming substrate.
摘要翻译：一种用于制造印刷布线板，其包括通过在能量束而形成孔的步骤的方法：薄膜由基底材料树脂渗出到孔的内壁表面上，如激光束，worin形成树脂的防止，通过除湿步骤作为用于形成用于互连上形成bothsides或在多个层中的电路的贯通孔或非贯通孔的孔加工工序的预处理降低一个基底材料的吸水百分率，从而它可以通过防止有缺陷的树脂膜形成，实现高品质的孔加工的形成和得到高可靠性的印刷布线板。

72. 发明公开

EP1096842A2 Method of manufacturing multilayered printed wiring board using adhesive film 审中-公开
标题翻译：一种用于使用粘接膜的多层印刷电路板的过程
公开(公告)号：EP1096842A2
公开(公告)日：2001-05-02
申请号：EP00309489.3
申请日：2000-10-27
申请人： Ajinomoto Co., Inc.
发明人： Nakamura, Shigeo, c/o Aminoscience Lab. , Yokota, Tadahiko, c/o Aminoscience Lab.
IPC分类号： H05K3/46
CPC分类号： H05K3/4069 , H05K3/0035 , H05K3/0094 , H05K3/246 , H05K3/381 , H05K3/426 , H05K3/4661 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959 , H05K2203/0191 , H05K2203/066 , H05K2203/068 , H05K2203/085 , H05K2203/1383 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： Herein is disclosed a method of manufacturing a multilayered printed wiring board using an adhesive film comprising a support base film provided with a mold release layer and a thermosetting resin composition laminated on the surface of the mold release layer, said resin composition being provided with the same or smaller area as or than that of the support base film, provided with thermal fluidity and being solid at normal temperatures.
The method includes:

1) directly covering at least the pattern processed portion on one surface or both surfaces of a pattern processed circuit substrate with the resin composition layer of said adhesive film, and performing laminating by heating and pressurizing under a vacuum condition; and
2) thermally curing the resin composition with the support base film attached thereto. Subsequent process steps include uncovering the resin composition layer by stripping at least the support base film.
摘要翻译：在为圆盘游离缺失使用粘合剂膜，其包括支撑基膜，设置有脱模层和层叠在该脱模层的表面上的热固性树脂组合物，所述树脂组合物被提供有相同的制造多层印刷电路板的方法或更小的区域或比该支撑基座的电影，设置有热流动性和在常温下为固体。该方法包括：1）直接覆盖至少所述图案处理在一个表面上或部分用粘合剂。所述电影的树脂组合物层的图案加工的电路基板的两面，并通过加热进行层压和在真空条件下加压; 和2）热固化与膜连接到其上支撑基体的树脂组合物。随后的工艺步骤包括：通过至少剥离支撑基片露出树脂组合物层。

73. 发明公开

EP1009206A2 Method of vacuum-laminating adhesive film 审中-公开
标题翻译： Verfahren zur Vakuumlaminierung eines Klebefilms
公开(公告)号：EP1009206A2
公开(公告)日：2000-06-14
申请号：EP99308985.3
申请日：1999-11-11
申请人： Ajinomoto Co., Inc.
发明人： Nakamura, Shigeo, c/o Aminoscience Laboratories , Furuta, Kiyonori, c/o Aminoscience Laboratories
IPC分类号： H05K3/46 , B32B31/00
CPC分类号： H05K3/4673 , B32B37/12 , B32B37/26 , B32B2457/08 , H05K3/4661 , H05K2203/066 , H05K2203/068 , H05K2203/085 , H05K2203/1572 , Y10T156/1041
摘要： Herein is disclosed a vacuum-laminating method of an adhesive film while adhesive bleeding is reduced, i.e.,. a method of vacuum laminating an adhesive film which comprises a supporting base film disposed on at least one surface of a pattern-processed circuit substrate and a resin composition having a thermal flowability and being in the solid state at normal temperature disposed on the surface of said supporting base film so that said resin composition is laminated under heating and pressing conditions,
said method comprising the steps of:

(1) sheeting said adhesive film having the same size as or a smaller size than that of said circuit substrate in a state wherein the surface of said resin composition in said adhesive film is allowed to provisionally partially adhere to one surface or both surfaces of said circuit substrate; and
(2) disposing a protecting film having an area larger than that of said adhesive film on said adhesive film provisionally adhering to said circuit substrate so that the center of said protecting film is disposed at substantially the same position as that of the center of said adhesive film, followed by vacuum laminating under heating and pressing conditions.

Furthermore is disclosed the method as set forth above, further comprising a post-treatment step in which said adhesive film is smoothed by heating and pressing using a pressing metal plate or a laminating metal roll which can be used even when a protecting film having an area larger than that of said adhesive film is disposed between said supporting base film and said pressing metal plate or laminating metal roll, wherein said adhesive film comprises said supporting base film and said resin composition having a thermal flowability and being in the solid state at normal temperature disposed on the surface of said supporting base film and is vacuum-laminated in the order of supporting base film/resin composition/circuit substrate.
摘要翻译：本文公开了粘合剂膜的真空层压方法，同时粘合剂渗色减少，即，一种真空层压粘合剂膜的方法，其包括设置在图案处理电路基板的至少一个表面上的支撑基膜和具有热流动性并在常温下处于固态的树脂组合物，该树脂组合物设置在所述支撑基膜，使得所述树脂组合物在加热和加压条件下层压，所述方法包括以下步骤：（1）在所述粘合膜的尺寸或尺寸小于所述电路基板的尺寸下，在所述粘合膜中的所述树脂组合物的表面被允许临时部分地粘附到所述电路基板的一个表面或两个表面; 和（2）在所述胶粘剂膜上设置具有比所述粘合剂膜的面积大的面积的保护膜临时附着到所述电路基板上，使得所述保护膜的中心处于与所述电路基板的中心大致相同的位置粘合膜，然后在加热和压制条件下进行真空层压。此外公开了上述方法，还包括后处理步骤，其中所述粘合剂膜通过使用压制金属板或层压金属辊进行加热和加压而平滑，即使当具有面积的保护膜时也可使用大于所述粘合膜的尺寸设置在所述支撑基膜和所述压制金属板或层压金属辊之间，其中所述粘合膜包括所述支撑基膜，并且所述树脂组合物具有热流动性并且在常温下处于固态设置在所述支撑基膜的表面上，并以支撑基膜/树脂组合物/电路基板的顺序进行真空层叠。

74. 发明公开

EP0977471A1 METHOD AND APPARATUS FOR FABRICATING CIRCUIT-FORMING-SUBSTRATE AND CIRCUIT-FORMING-SUBSTRATE MATERIAL 有权
标题翻译：方法和设备制造电路下基板与电路形成衬底材料
公开(公告)号：EP0977471A1
公开(公告)日：2000-02-02
申请号：EP98957171.6
申请日：1998-12-04
申请人： Matsushita Electronics Corporation
发明人： YAMANE, Shigeru , NISHII, Toshihiro , NAKAMURA, Shinji , SAKAI, Masayuki
IPC分类号： H05K3/00
CPC分类号： H05K3/0032 , H05K3/227 , H05K3/4069 , H05K2201/0355 , H05K2203/081 , H05K2203/085 , H05K2203/1383 , H05K2203/1388 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T156/1056 , Y10T156/1062 , Y10T428/24994 , Y10T442/2902
摘要： A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a though-hole or non-though-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.

75. 发明授权

EP0326577B1 REINFORCED PLASTIC LAMINATES FOR USE IN THE PRODUCTION OF PRINTED CIRCUIT BOARDS AND PROCESS FOR MAKING SUCH LAMINATES AND RESULTING PRODUCTS 失效转让
标题翻译：增强塑料层压FOR USE IN印刷电路和方法的生产用于生产层压板获得的产品
公开(公告)号：EP0326577B1
公开(公告)日：1996-12-11
申请号：EP87907042.3
申请日：1987-09-10
申请人： COMPOSITECH LTD.
发明人： MEDNEY, Jonas , KLIMPL, Fred E.
IPC分类号： B32B5/12 , B32B31/00 , B31C13/00 , H05K3/46
CPC分类号： B29C70/347 , B29C53/564 , B29C53/58 , B29C53/76 , B29C53/8016 , B29C53/821 , B29C70/202 , B29C2793/009 , B29L2031/3425 , H05K1/0366 , H05K3/0047 , H05K3/4626 , H05K2201/0145 , H05K2201/0278 , H05K2201/0287 , H05K2203/085 , H05K2203/1327 , Y10S428/901 , Y10T29/49158 , Y10T29/49176 , Y10T428/24074
摘要： A warp-free laminate is produced by winding a first set of strands or filaments (34) about a flat mandrel with a second set of strands (36) being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings (106, 108, 110, 112, 114) for subsequent printed circuit applications.

76. 发明公开

EP0525355A1 Hörgerät, insbesondere am Kopf tragbares Mini-Hörgerät, und Verfahren zur Herstellung 失效
标题翻译：助听器，尤其是头部便携式微型助听器，以及制造方法。
公开(公告)号：EP0525355A1
公开(公告)日：1993-02-03
申请号：EP92110071.5
申请日：1992-06-15
申请人： Siemens Audiologische Technik GmbH
发明人： Strohmaier, Harald , Sauer, Joseph, Dipl.-Ing. (FH)
IPC分类号： H04R25/00
CPC分类号： H05K3/305 , H04R25/502 , H04R2225/021 , H04R2225/61 , H05K3/281 , H05K3/284 , H05K3/325 , H05K2201/0125 , H05K2201/10636 , H05K2201/10984 , H05K2203/074 , H05K2203/085 , H05K2203/1311 , Y02P70/611 , Y02P70/613 , Y10T29/49146
摘要： Es wird ein insbesondere am Kopf tragbares Mini-Hörgerät mit zugehörigen Herstellungsverfahren vorgeschlagen, das sich durch eine miniaturisierte und vereinfacht herstellbare Verstärkereinheit (4) auszeichnet. Dabei werden die elektrischen Bauelemente (9) mittels eines stark schrumpffähigen Klebers (11) und/oder einer durch Unterdruck ansaugbaren Folie (12) sowohl gegen ein Trägerbauteil (8) fixiert als auch unter Kontaktdruck gegen die Kontaktstellen (10) gehalten.
摘要翻译：一个微型助听器，其可以被磨损，特别是爱在头上，与相关的生产方法被所有其由小型化的放大器单元（4），它可以以简化的方式来产生区分提议。电气部件（9）通过粘合剂（11）以极大的收缩能力和/或可通过负压被吸向下的箔（12）被保持，这两个对的载波要素（8）或针对保持接触点（10）的接触压力下。

77. 发明公开

EP0509962A1 A process and an apparatus for producing a thin photoimageable coating on a metallic-layered substrate 失效
标题翻译：用于制造金属涂敷的基材上的薄照相记录涂层的方法和装置。
公开(公告)号：EP0509962A1
公开(公告)日：1992-10-21
申请号：EP92810265.6
申请日：1992-04-07
申请人： CIBA-GEIGY AG
发明人： Kapp-Schwoerer, Diethard , Siemers, David C. , Isonhood, James L. , Miller, Donald E.
IPC分类号： G03F7/16
CPC分类号： G03F7/16 , B05C5/004 , B05C5/005 , H05K3/0079 , H05K3/0091 , H05K3/227 , H05K2203/085 , H05K2203/1121 , H05K2203/1509 , H05K2203/159
摘要： A process for producing thin photoresists on printed circuit boards wherein a metallic-layered substrate is conveyed beneath a free falling curtain of a photopolymerizable substance, said substance having a viscosity of 30-120 seconds DIN cup 4 at 25°C, corresponding to 104-608 mPas, and being applied at a curtain height of 5 - 25 cm above the board to form a coating having a dry film thickness less than or equal 25 µm after the coated surfaces are dried, whereupon the surfaces are available for photoimaging, developing, etching and stripping operations. The apparatus for producing such thin photoimageable coatings on metallic-layered substrates comprises vacuum means to maintain the boards on the conveyance means in a flat fixed position as they pass beneath the curtain. According to another aspect of the invention the apparatus also comprises a cooling means for cooling the boards from underneath while their upper side is being dryed subsequent to coating in the coating station.
摘要翻译：一种用于生产印刷电路板上的薄光致抗蚀剂过程worin金属层叠基板被输送的光聚合性物质的自由下落帘幕的下方，具有在25℃的30〜120秒DIN杯4的粘度，对应于104-所述物质 608毫帕·秒，并且被在5-25厘米的板的上方帘高度适用于形成具有干膜厚度小于或等于25微米的涂层表面进行干燥之后，在所述表面，其中可用于照片成像，显影的涂层，蚀刻和剥离操作。用于制造金属寻求层叠基板上的薄光可成像涂层的装置，包括：真空装置，以保持板在输送中的平坦的固定位置的装置，因为它们通过帘下方。。根据本发明的装置，从而包括一个冷却的另一个方面用于从下方冷却板而它们的上侧被dryed之后涂层在涂布工位。

78. 发明授权

EP0245434B1 DEVICE FOR ALIGNING A PHOTOMASK ONTO A PRINTED WIRING BOARD 失效转让
标题翻译：将照相机对准印刷电路板的装置
公开(公告)号：EP0245434B1
公开(公告)日：1990-07-04
申请号：EP86907051.6
申请日：1986-10-24
申请人： ATOCHEM NORTH AMERICA, INC. (a Pennsylvania corp.)
发明人： CRONIN, John, V.
IPC分类号： G03F7/20 , G03B27/20
CPC分类号： G03F7/2014 , G03B27/20 , H05K3/0002 , H05K3/0082 , H05K2203/085
摘要： An apparatus for applying a phototool (48) to a light sensitive substrate (30) by means of a roller (40) for applying the phototool (48) to the substrate (30) and a vacuum restraining means (44) for restraining the phototool (48) to maintain it under tension during application of the phototool (48) to the substrate (30).

79. 发明公开

EP0269085A2 Apparatus and method for temporarily sealing holes in printed circuit boards 失效
标题翻译：装置和方法用于在印刷电路板的临时密封的孔。
公开(公告)号：EP0269085A2
公开(公告)日：1988-06-01
申请号：EP87117393.6
申请日：1987-11-25
申请人： MultiTek Corporation
发明人： Choinski, Edward J.
IPC分类号： H05K3/00 , H05K3/42
CPC分类号： H05K3/0094 , H05K2203/0278 , H05K2203/0582 , H05K2203/0759 , H05K2203/085 , Y10T29/49155
摘要： The apparatus comprises two major assemblies: a heater block assembly (28) and a vacuum table assembly (30). The heater block assembly employs a temperature controlled, insulated heater block (32) having a surrounding, movable vacuum collar (36). A flexible, thermally conductive vacuum skin (38) is mounted on the movable vacuum collar (36) and forms a vacuum chamber in cooperation with a movable vacuum table (42) having a flat, porous plate (44) whose upper surface is parallel to the vaccum table surface. A sandwich comprising a porous release sheet (64), the printed circuit board (66), a thermodeformable material (70) and a thermally conductive cover sheet (72) is positioned on the vacuum table flat, porous plate (44). Thereafter, the vacuum table (42) and sandwich are moved together so that the table forms a sealing relation with the flexible, thermally conductive vacuum skin (38). A vacuum is then drawn in the now formed vacuum chamber (74) forcing the flexible, thermally conductive vacuum skin (38) against the sandwich to compress the porous release sheet (64) between the printed circuit board (66) and the flat, porous plate (44). At this point, the flexible, thermally conductive vacuum skin (38), sandwich and vacuum table (42) are moved into a position in which the flexible, thermally conductive vacuum skin (38) is forced into thermally conductive contact with the heater block (32). Heat from the heater block softens the thermodeformable material (70) so that it deforms into the holes (68) of the printed circuit board (66) forming protectively sealing plugs (76) therein. After cooling, the vacuum table (42) is moved in the reverse direction to permit removal of the sandwich.
摘要翻译：该装置包括两个主要组件：一个加热器块组件（28）和一个真空台组件（30）。加热器块组件采用具有周边，活动真空环（36）控制的温度，绝缘加热器块（32）。甲柔韧导热真空表层（38）安装在所述活动真空环（36）和在合作用具有扁平的多孔板（44），其上表面是平行的可动真空台（42）形成了一个真空室所述真空台面。包括多孔防粘片（64）夹心，所述印刷电路板（66），一热致变形材料（70）和导热性的罩片（72）被定位在真空台面扁平的多孔板（44）。那里之后，在真空台（42）和三明治一起移动所以没有表形成与柔韧导热真空表层（38）的密封关系。真空然后在已形成真空腔（74）迫使所述柔韧导热真空表层（38）抵靠三明治以压缩所述印刷电路板（66）和平坦的，多孔的多孔防粘片（64）吸入板（44）。在这一点上，所述柔韧导热真空表层（38），夹心和真空台（42）被移动到在其中柔韧导热真空表层（38）被强制进入与加热器块导热接触（位置 32）。从加热块热软化的热致变形材料（70），以便做到了变形为形成保护性密封孔塞（76）在其中的印刷电路板（66）的孔（68）。冷却后，在真空台（42）在相反的方向上移动，以允许去除所述夹层的。

80. 发明公开

EP0215358A3 Method and device employing input and output staging chamber devices for reduced pressure lamination 失效
标题翻译：使用输入和输出分层室的方法和装置，用于降低压力层压
公开(公告)号：EP0215358A3
公开(公告)日：1988-06-01
申请号：EP86111989
申请日：1986-08-29
申请人： Hitachi Chemical Co., Ltd.
发明人： Tomisawa, Yoshiaki c/o Hitachi Chemical , Satou, Tadaji c/o Hitachi Chemical , Hayashi, Nobuyuki c/o Hitachi Chemical , Miyamae, Yusuke Hitachi Kasei Setsubi Kenetsu K.K.
IPC分类号： B29C67/18 , G03F07/16 , B32B31/20 , H05K03/00
CPC分类号： B32B37/226 , B29C2791/006 , B29L2031/3425 , B32B38/185 , B32B2309/68 , H05K3/281 , H05K2203/068 , H05K2203/085 , Y10T156/1052 , Y10T156/1343
摘要： In this method for reduced pressure lamination of a light sensitive material (44) in film form to a printed circuit base board (2), when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive layer to the printed circuit base board (2) under reduced pressure, a main container (9) for carrying out the adhesion and an intake container (8) and an exit container (10) connected thereto are provided, the base board (2) is supplied to the intake container (8) set to atmospheric pressure, and thereafter the pressure in the intake container (8) is reduced, next the base board (2) is supplied Into the main container (9) at reduced pressure and the light sensitive material (44) in film form is adhered to the base board (2), next the light sensitive material (44) in film form Is in the case that it is continuous cut to the dimensions of the base board (2), and after supplying the base board (2) to which the light sensitive material (44) in film form has been adhered to the exit container (10) at reduced pressure, the exit container (10) is set to atmospheric pressure and the base board (2) to which the light sensitive material (44) in film form has been adhered is ejected from the exit container (10). A reduced pressure adhesion device is also described for performing the method.

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