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1. 发明公开

EP1096842A2 Method of manufacturing multilayered printed wiring board using adhesive film 审中-公开
标题翻译：一种用于使用粘接膜的多层印刷电路板的过程
公开(公告)号：EP1096842A2
公开(公告)日：2001-05-02
申请号：EP00309489.3
申请日：2000-10-27
申请人： Ajinomoto Co., Inc.
发明人： Nakamura, Shigeo, c/o Aminoscience Lab. , Yokota, Tadahiko, c/o Aminoscience Lab.
IPC分类号： H05K3/46
CPC分类号： H05K3/4069 , H05K3/0035 , H05K3/0094 , H05K3/246 , H05K3/381 , H05K3/426 , H05K3/4661 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959 , H05K2203/0191 , H05K2203/066 , H05K2203/068 , H05K2203/085 , H05K2203/1383 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： Herein is disclosed a method of manufacturing a multilayered printed wiring board using an adhesive film comprising a support base film provided with a mold release layer and a thermosetting resin composition laminated on the surface of the mold release layer, said resin composition being provided with the same or smaller area as or than that of the support base film, provided with thermal fluidity and being solid at normal temperatures.
The method includes:

1) directly covering at least the pattern processed portion on one surface or both surfaces of a pattern processed circuit substrate with the resin composition layer of said adhesive film, and performing laminating by heating and pressurizing under a vacuum condition; and
2) thermally curing the resin composition with the support base film attached thereto. Subsequent process steps include uncovering the resin composition layer by stripping at least the support base film.
摘要翻译：在为圆盘游离缺失使用粘合剂膜，其包括支撑基膜，设置有脱模层和层叠在该脱模层的表面上的热固性树脂组合物，所述树脂组合物被提供有相同的制造多层印刷电路板的方法或更小的区域或比该支撑基座的电影，设置有热流动性和在常温下为固体。该方法包括：1）直接覆盖至少所述图案处理在一个表面上或部分用粘合剂。所述电影的树脂组合物层的图案加工的电路基板的两面，并通过加热进行层压和在真空条件下加压; 和2）热固化与膜连接到其上支撑基体的树脂组合物。随后的工艺步骤包括：通过至少剥离支撑基片露出树脂组合物层。

2. 发明授权

EP1092739B1 Epoxy resin composition and uses thereof 有权
标题翻译：环氧树脂和它们的用途
公开(公告)号：EP1092739B1
公开(公告)日：2002-12-11
申请号：EP00308974.5
申请日：2000-10-12
申请人： Ajinomoto Co., Inc.
发明人： Nakamura, Shigeo, c/o Aminoscience Lab. , Yokota, Tadahiko, c/o Aminoscience Lab.
IPC分类号： C08G59/20 , C08G59/62 , C08L63/00 , C09J171/00
CPC分类号： H05K3/4661 , C08G59/621 , C08L63/00 , C08L71/00 , C08L71/02 , G03F7/038 , H01L23/49894 , H01L2924/0002 , Y10S428/901 , Y10T428/24994 , Y10T428/249941 , Y10T428/26 , Y10T428/287 , Y10T428/2971 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529 , C08L2666/14 , H01L2924/00

3. 发明公开

EP1092739A1 Epoxy resin composition and uses thereof 有权
标题翻译： Epoxidharzzusammensetzung und ihre Verwendung
公开(公告)号：EP1092739A1
公开(公告)日：2001-04-18
申请号：EP00308974.5
申请日：2000-10-12
申请人： Ajinomoto Co., Inc.
发明人： Nakamura, Shigeo, c/o Aminoscience Lab. , Yokota, Tadahiko, c/o Aminoscience Lab.
IPC分类号： C08G59/20 , C08G59/62 , C08L63/00 , C09J171/00
CPC分类号： H05K3/4661 , C08G59/621 , C08L63/00 , C08L71/00 , C08L71/02 , G03F7/038 , H01L23/49894 , H01L2924/0002 , Y10S428/901 , Y10T428/24994 , Y10T428/249941 , Y10T428/26 , Y10T428/287 , Y10T428/2971 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529 , C08L2666/14 , H01L2924/00
摘要： An epoxy resin composition comprises, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bishphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator. Particularly preferred embodiments of the epoxy resin composition include those wherein the epoxy resin (A) contains a phosphorus atom, the phenolic curing agent (B) contains a nitrogen atom, and the phenoxy resin (C) contains a bisphenol S skeleton and a biphenyl skeleton. An adhesive film may be formed by coating the epoxy resin composition on a supporting base film. A prepreg is obtainable by coating and/or impregnating a sheet-shape reinforced base material made of a fiber with the resin composition, and multilayer printed-wiring board can be made using them. Embodiments of the epoxy resin composition are of utility in production of multilayer printed-wiring boards of the build-up type which are formed by stacking alternately conductor circuitry layers and insulating layers. In this application, they facilitate formation of a conductor layer excellent in adhesiveness without requiring the use of a roughening component, which deteriorates performance in the insulating layer.
摘要翻译：作为必要成分，环氧树脂组合物包含（A）在一个分子中具有两个以上环氧基的环氧树脂，（B）酚类固化剂，（C）含有双酚S骨架的苯氧基树脂，重均分子量分子量为5,000〜100,000，（D）固化促进剂。环氧树脂组合物的特别优选的实施方式包括环氧树脂（A）含有磷原子，酚类固化剂（B）含有氮原子，苯氧基树脂（C）含有双酚S骨架和联苯骨架。可以通过将环氧树脂组合物涂布在支撑基底膜上来形成粘合膜。通过用树脂组合物涂布和/或浸渍由纤维制成的片状增强基材可以获得预浸料，并且可以使用它们来制备多层印刷布线板。环氧树脂组合物的实施方案可用于生产通过层叠交替导电电路层和绝缘层而形成的积层型多层印刷电路板。在本申请中，它们有助于形成粘合性优异的导体层，而不需要使用粗糙化部件，这会降低绝缘层的性能。

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