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1. 发明公开

EP1009206A2 Method of vacuum-laminating adhesive film 审中-公开
标题翻译： Verfahren zur Vakuumlaminierung eines Klebefilms
公开(公告)号：EP1009206A2
公开(公告)日：2000-06-14
申请号：EP99308985.3
申请日：1999-11-11
申请人： Ajinomoto Co., Inc.
发明人： Nakamura, Shigeo, c/o Aminoscience Laboratories , Furuta, Kiyonori, c/o Aminoscience Laboratories
IPC分类号： H05K3/46 , B32B31/00
CPC分类号： H05K3/4673 , B32B37/12 , B32B37/26 , B32B2457/08 , H05K3/4661 , H05K2203/066 , H05K2203/068 , H05K2203/085 , H05K2203/1572 , Y10T156/1041
摘要： Herein is disclosed a vacuum-laminating method of an adhesive film while adhesive bleeding is reduced, i.e.,. a method of vacuum laminating an adhesive film which comprises a supporting base film disposed on at least one surface of a pattern-processed circuit substrate and a resin composition having a thermal flowability and being in the solid state at normal temperature disposed on the surface of said supporting base film so that said resin composition is laminated under heating and pressing conditions,
said method comprising the steps of:

(1) sheeting said adhesive film having the same size as or a smaller size than that of said circuit substrate in a state wherein the surface of said resin composition in said adhesive film is allowed to provisionally partially adhere to one surface or both surfaces of said circuit substrate; and
(2) disposing a protecting film having an area larger than that of said adhesive film on said adhesive film provisionally adhering to said circuit substrate so that the center of said protecting film is disposed at substantially the same position as that of the center of said adhesive film, followed by vacuum laminating under heating and pressing conditions.

Furthermore is disclosed the method as set forth above, further comprising a post-treatment step in which said adhesive film is smoothed by heating and pressing using a pressing metal plate or a laminating metal roll which can be used even when a protecting film having an area larger than that of said adhesive film is disposed between said supporting base film and said pressing metal plate or laminating metal roll, wherein said adhesive film comprises said supporting base film and said resin composition having a thermal flowability and being in the solid state at normal temperature disposed on the surface of said supporting base film and is vacuum-laminated in the order of supporting base film/resin composition/circuit substrate.
摘要翻译：本文公开了粘合剂膜的真空层压方法，同时粘合剂渗色减少，即，一种真空层压粘合剂膜的方法，其包括设置在图案处理电路基板的至少一个表面上的支撑基膜和具有热流动性并在常温下处于固态的树脂组合物，该树脂组合物设置在所述支撑基膜，使得所述树脂组合物在加热和加压条件下层压，所述方法包括以下步骤：（1）在所述粘合膜的尺寸或尺寸小于所述电路基板的尺寸下，在所述粘合膜中的所述树脂组合物的表面被允许临时部分地粘附到所述电路基板的一个表面或两个表面; 和（2）在所述胶粘剂膜上设置具有比所述粘合剂膜的面积大的面积的保护膜临时附着到所述电路基板上，使得所述保护膜的中心处于与所述电路基板的中心大致相同的位置粘合膜，然后在加热和压制条件下进行真空层压。此外公开了上述方法，还包括后处理步骤，其中所述粘合剂膜通过使用压制金属板或层压金属辊进行加热和加压而平滑，即使当具有面积的保护膜时也可使用大于所述粘合膜的尺寸设置在所述支撑基膜和所述压制金属板或层压金属辊之间，其中所述粘合膜包括所述支撑基膜，并且所述树脂组合物具有热流动性并且在常温下处于固态设置在所述支撑基膜的表面上，并以支撑基膜/树脂组合物/电路基板的顺序进行真空层叠。

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