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71. 发明公开

EP3248936A1 MEMS PRESSURE SENSOR AND MEMS INERTIAL SENSOR INTEGRATION STRUCTURE 有权转让
标题翻译： MEMS压力传感器与MEMS惯性传感器集成结构
公开(公告)号：EP3248936A1
公开(公告)日：2017-11-29
申请号：EP15894015.5
申请日：2015-12-14
申请人： Goertek Inc.
发明人： ZHENG, Guoguang
IPC分类号： B81C1/00 , B81B7/00
CPC分类号： B81B7/02 , B81B3/0021 , B81B7/0061 , B81B2201/0228 , B81B2201/0235 , B81B2201/0264 , B81B2203/04 , B81C1/00166 , B81C1/00269 , G01L9/12 , G01L19/04 , G01P15/125
摘要： The present invention discloses a integrated structure of an MEMS pressure sensor and an MEMS inertia sensor, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second upper electrode forming a reference capacitor together with the second lower electrode; further comprising an inertia-sensitive structure supported above the substrate by a third support part, and a fixed electrode plate forming an inertia detecting capacitor of an inertia sensor together with the inertia-sensitive structure; and a cover body which packages the inertia detecting capacitor composed of the inertia-sensitive structure and the fixed electrode plate on the substrate. The integrated structure according to the present invention integrates the MEMS inertia sensor and the MEMS pressure sensor on the same substrate, which may effectively reduce the area of the chip, so as to reduce the cost of the chip. Single packaging may complete the packaging of the entire chip and reduce the cost of the chip packaging.
摘要翻译：本发明公开了一种MEMS压力传感器与MEMS惯性传感器的集成结构，包括：形成在基板上的绝缘层，均形成在绝缘层上的第一下电极和第二下电极，还包括第一上电极与第一下电极一起形成空气压敏电容器，以及与第二下电极一起形成参考电容器的第二上电极; 还包括由第三支撑部分支撑在所述基板上方的惯性敏感结构以及与所述惯性敏感结构一起形成惯性传感器的惯性检测电容器的固定电极板; 以及将由惯性敏感结构和固定电极板组成的惯性检测电容器封装在基板上的盖体。本发明的集成结构将MEMS惯性传感器和MEMS压力传感器集成在同一个基板上，可以有效减小芯片面积，从而降低芯片成本。单一封装可以完成整个芯片的封装并降低芯片封装的成本。

72. 发明公开

EP3227691A1 A MEMS SENSOR AND A SEMICONDUCTOR PACKAGE 有权
标题翻译： MEMS传感器和半导体封装
公开(公告)号：EP3227691A1
公开(公告)日：2017-10-11
申请号：EP15805296.9
申请日：2015-11-24
申请人： Murata Manufacturing Co., Ltd.
发明人： RYTKÖNEN, Ville-Pekka , LIUKKU, Matti
IPC分类号： G01P15/125 , G01P15/18 , B81B5/00 , G01P15/08
CPC分类号： B60R21/01 , B60R2021/01286 , B81B7/02 , B81B2201/0235 , B81B2201/033 , B81B2203/0154 , B81B2203/0163 , B81B2207/015 , G01P15/125 , G01P15/13 , G01P15/18 , G01P2015/0817
摘要： The MEMS sensor of the invention has movable and fixed components for measuring acceleration in a rotational mode in a direction in-plane perpendicular to spring axis. The components include an element frame, a substrate, a proof-mass a spring connected to the proof-mass and to the substrate, and comb electrodes. The MEMS sensor is mainly characterized by an arrangement of the components causing an inherent sensitivity for measuring accelerations in a range covering longitudinal and transversal accelerations. One or more of the components are tilted compared to the element frame. The semiconductor package of the invention comprises at least one MEMS sensor.
摘要翻译：本发明的MEMS传感器具有可移动和固定的部件，用于在垂直于弹簧轴线的平面内的方向上测量旋转模式下的加速度。这些部件包括与质量块（2）和基板（7）连接的元件框架（1），基板（7），质量块（2），弹簧（5）以及梳形电极（9a ，9b）。 MEMS传感器的主要特征是部件的布置，这些部件的布置导致了在涵盖纵向和横向加速度的范围内测量加速度的固有灵敏度。与元素框架（1）相比，一个或多个组件倾斜。本发明的半导体封装（12）包括至少一个MEMS传感器。

73. 发明公开

EP3140246A1 INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTAL SENSOR AND METHODOLOGY FOR FABRICATING SAME 有权转让
标题翻译：利用MEMS声传感器和环境传感器及其制造方法集成包胶
公开(公告)号：EP3140246A1
公开(公告)日：2017-03-15
申请号：EP15788858.7
申请日：2015-05-08
申请人： InvenSense, Inc.
发明人： TSAI, Julius Ming-Lin , CAGDASER, Baris , LIM, Martin , KHENKIN, Aleksey S.
IPC分类号： B81C1/00 , B81B7/02 , G01L23/08
CPC分类号： B81B7/02 , B81B2201/0214 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/16152 , H04R1/04 , H04R19/04 , H04R29/004 , H04R2201/003 , H01L2924/00014 , H01L2924/00
摘要： An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
摘要翻译：至少一个环境传感器和至少一个MEMS声学传感器的集成封装游离缺失盘。所述包中包含的共享端口没有公开这两个传感器的环境，worin环境和声学传感器测量声波的环境传感器测量特性。的端口暴露传感器对环境空气流和声音传感器声波。声音传感器的一个例子是一个麦克风和所述环境传感器的一个例子是一个湿度传感器。

75. 发明公开

EP3052901A1 INERTIAL AND PRESSURE SENSORS ON SINGLE CHIP 有权
标题翻译：单芯片上的惯性和压力传感器
公开(公告)号：EP3052901A1
公开(公告)日：2016-08-10
申请号：EP14851277.5
申请日：2014-10-02
申请人： Robert Bosch GmbH
发明人： FEYH, Ando , O'BRIEN, Gary
IPC分类号： G01D21/02 , G01P15/08 , G01P13/00 , G01L9/06 , G01L7/08
CPC分类号： B81B7/02 , B81B2201/025 , B81B2201/0264 , G01C25/00 , G01D21/02 , G01L19/0092 , G01L19/12 , G01P15/0802 , G01P15/125 , G01P15/18
摘要： In accordance with one embodiment, a single chip combination inertial and pressure sensor device includes a substrate, an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure, and a pressure sensor including a gap formed in the sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane.
摘要翻译：根据一个实施例，单芯片组合惯性和压力传感器装置包括基板，惯性传感器和可移动感测结构，所述惯性传感器包括可移动地支撑在所述基板上方的可移动感测结构以及邻近所述可移动感测结构定位的第一固定电极，包括在可移动感测结构正上方的位置处的传感器中形成的间隙以及形成在装置的盖层中的柔性膜，柔性膜限定间隙的边界并且被配置为朝向和远离间隙弯曲对柔性膜上方压力变化的响应。

76. 发明公开

EP3050100A1 MAGNETIC FIELD SHIELDING FOR PACKAGING BUILD-UP ARCHITECTURES 审中-公开
标题翻译：磁屏蔽用于包装的设计架构
公开(公告)号：EP3050100A1
公开(公告)日：2016-08-03
申请号：EP13894179.4
申请日：2013-09-27
申请人： Intel Corporation
发明人： OSTER, Sasha , HANEY, Sarah , TEH, Weng Hong , EID, Feras
IPC分类号： H01L23/552
CPC分类号： H05K9/0052 , B32B37/24 , B32B38/10 , B32B2037/243 , B32B2457/00 , B81B7/0029 , B81B7/0032 , B81B7/02 , B81C1/0023 , G06F1/182 , H01L21/568 , H01L23/552 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2924/12042 , H01L2924/14 , H01L2924/1434 , H01L2924/1461 , H05K1/115 , Y10T156/10 , H01L2924/00
摘要： Magnetic field shielding material with high relative permeability incorporated into a build-up package, for example to restrict a field of a magnet integrated with the build-up to a target device configured to operate in the field. In embodiments, a first device is physically coupled to the build-up. In embodiments, a magnetic field shielding material is disposed in contact with the build-up and in proximity to the first device to restrict a magnetic field either to a region occupied by the first device or to a region exclusive of the first device. A field shielding material may be disposed within build-up near a permanent magnet also within the build-up to reduce exposure of another device, such as an IC, to the magnetic field without reducing MEMS device exposure.

77. 发明授权

EP2902791B1 Atomic referenced optical accelerometer 失效转让
标题翻译：原子引用光学加速度计
公开(公告)号：EP2902791B1
公开(公告)日：2016-07-27
申请号：EP15151352.0
申请日：2015-01-15
申请人： Honeywell International Inc.
发明人： Salit, Kenneth , Salit, Mary , Compton, Robert , Ridley, Jeff A. , Nelson, Karl
IPC分类号： G01P15/093 , G01P15/13 , G01P1/00
CPC分类号： G01P15/093 , B81B7/02 , G01P1/006 , G01P15/08 , G01P15/12 , G01P15/131
摘要： In some examples, a micro-electro-mechanical system (MEMS) optical accelerometer includes a housing comprising an internal chamber that includes a Fabry-Perot cavity and a proof mass affixed to the housing via one or more elastic elements, a light source configured to emit radiation, a first detector configured to receive radiation transmitted through the Fabry-Perot cavity and configured to generate one or more signals that indicate a position of the proof mass. The MEMS optical accelerometer further comprises an atomic wavelength reference and a second detector configured to detect radiation transmitted through the atomic wavelength reference and configured to generate one or more signals that indicate a wavelength of the radiation emitted by the light source, and a servomechanism electrically coupled to the second photo detector and the light source, configured to adjust the light source to maintain the radiation emitted by the light source at approximately a selected wavelength.

78. 发明公开

EP3026406A1 RADIATION DETECTOR COMPRISING A COMPENSATING SENSOR 有权
标题翻译： STRAHLUNGSDETEKTOR MIT EINEM KOMPENSATIONSSENSOR
公开(公告)号：EP3026406A1
公开(公告)日：2016-06-01
申请号：EP15196154.7
申请日：2015-11-24
申请人： Melexis Technologies NV
发明人： VAN BUGGENHOUT, Carl , VAN DER WIEL, Appolonius Jacobus , BUYDENS, Luc
IPC分类号： G01J1/02 , G01J5/02 , G01J5/06 , G01J1/42 , G01J5/04 , G01J5/08 , G01J5/12 , H01L31/0203 , H01L31/0216 , H01L27/146
CPC分类号： H01L35/28 , B81B7/02 , B81B2201/0207 , B81B2203/0315 , G01J1/0214 , G01J1/0295 , G01J1/4228 , G01J5/0225 , G01J5/024 , G01J5/0285 , G01J5/045 , G01J5/06 , G01J5/0803 , G01J5/12 , G01J2005/068 , H01L27/144 , H01L27/1443 , H01L31/0203 , H01L31/02164 , H01L31/09 , H01L35/34
摘要： A chip (100) for radiation measurements, the chip comprising a first substrate (110) comprising a first sensor (111) and a second sensor (116). The chip (100) moreover comprises a second substrate (120) comprising a first cavity (121) and a second cavity (126) both with oblique walls. An internal layer (128) is present on the inside of the second cavity (126). The second substrate (120) is sealed to the first substrate with the cavities (121, 126) on the inside such that the first cavity (121) is above the first sensor (111) and the second cavity (126) is above the second sensor (116).
摘要翻译：一种用于辐射测量的芯片（100），所述芯片包括包括第一传感器（111）和第二传感器（116）的第一基板（110）。芯片（100）还包括第二衬底（120），其包括具有倾斜壁的第一空腔（121）和第二空腔（126）。内层（128）存在于第二空腔（126）的内部。第二基板（120）被密封到第一基板上，在内部具有空腔（121,126），使得第一空腔（121）在第一传感器（111）之上，并且第二空腔（126）在第二基板传感器（116）。

79. 发明公开

EP3006396A1 CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFERENT CONTROLLED PRESSURES AND METHODS OF MANUFACTURE 有权
标题翻译：带有多个空腔各种控制的新闻媒体及其制造方法集成的CMOS MEMS器件
公开(公告)号：EP3006396A1
公开(公告)日：2016-04-13
申请号：EP15188710.6
申请日：2015-10-07
申请人： InvenSense, Inc.
发明人： LEE, Daesung , SHIN, Jongwoo , SHIN, Jong Il , SMEYS, Peter , LIM, Martin
IPC分类号： B81B7/02 , B81B7/00
CPC分类号： B81C1/0023 , B81B7/0038 , B81B7/0041 , B81B7/02 , B81B2201/0228 , B81B2207/017 , B81C1/00285 , B81C2203/019 , B81C2203/035 , B81C2203/0785
摘要： An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing and patterning an outgassing source layer and a first outgassing barrier layer on the substrate, resulting in two cross-sections. In one of the two cross-sections a top surface of the outgassing source layer is not covered by the outgassing barrier layer and in the other of the two cross-sections the outgassing source layer is encapsulated in the outgassing barrier layer. The method also includes depositing conformally a second outgassing barrier layer and etching the second outgassing barrier layer such that a spacer of the second outgassing barrier layer is left on sidewalls of the outgassing source layer.
摘要翻译：一种集成MEMS装置包括两个基板，其中第一和第二基板之间耦合在一起，并且具有两个外壳那里。一个在第一和第二衬底均包括在除气源极层和除气阻挡层以在两个外壳内调节压力。该方法包括沉积和放气源层和在脱气基板的第一阻挡层，在两个横截面所得的图案化。在两个交叉部分中的一个放气源层的顶部表面不被放气阻挡层和在所述两个横截面脱气源层被封装脱气阻挡层中的覆盖。因此，该方法包括共形地沉积第二脱气阻挡层和蚀刻所述第二阻挡层放气搜索做了第二脱气阻挡层的间隔物留在脱气源层的侧壁上。

80. 发明公开

EP2971593A1 GAS TURBINE ENGINE AND ELECTRICAL SYSTEM COMPRISING ELECTRICAL BUSES 有权转让
标题翻译： GASTURBINENTRIEBWERK UND ELEKTRISCHES SYSTEM MIT ELEKTRISCHEN BUSSCHIENEN
公开(公告)号：EP2971593A1
公开(公告)日：2016-01-20
申请号：EP13808338.1
申请日：2013-11-25
申请人： Rolls-Royce North American Technologies, Inc. , Rolls-Royce Corporation
发明人： FRENCH, Mat , ALT, John, Timothy , BLACKWELDER, Mark, Jon
IPC分类号： F01D15/10 , F02C7/36 , F02C9/00 , H02J9/06
CPC分类号： H02P9/48 , B81B7/02 , B81B2201/0257 , B81B2201/0264 , B81C1/00158 , B81C1/00301 , F01D15/10 , F02C7/268 , F02C7/32 , F02C7/36 , F02C9/00 , F02K3/06 , F02N11/0862 , F05B2220/706 , F05D2220/76 , F05D2270/62 , H02J1/102 , H02J1/16 , H02J3/30 , H02J3/32 , H02J3/38 , H02J9/061 , H02K7/1823 , H02P2101/25 , H02P2101/30
摘要： A gas turbine engine includes an electrical system that includes a controller coupled to a first inverter/converter controller, a second inverter/converter controller, and a converter/controller that is coupled to an energy storage device. The system is configured to provide electrical power to a first electrical bus and a second electrical bus, from first and second electrical machines, under the direction of the controller. The converter controller is configured to control the amount of electrical power supplied to the first electrical bus and the second electrical bus from the energy storage system. The amount of electrical power received from the first electrical bus and the second electrical bus, and energy supplied to the energy storage system are under the direction of the controller.
摘要翻译：燃气涡轮发动机包括电气系统，其包括耦合到第一逆变器/转换器控制器的控制器，第二逆变器/转换器控制器和耦合到能量存储装置的转换器/控制器。该系统被配置为在控制器的方向下从第一和第二电机向第一电总线和第二电总线提供电力。转换器控制器被配置为控制从能量存储系统提供给第一电总线和第二电总线的电力量。从第一电气总线和第二电气总线接收的电力量以及供应到能量存储系统的能量在控制器的指导下。

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