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1. 发明公开

EP4407286A1 HEAT FLUX SENSOR DEVICE AND METHOD OF MANUFACTURE THEREOF 审中-公开
公开(公告)号：EP4407286A1
公开(公告)日：2024-07-31
申请号：EP24179474.2
申请日：2024-06-03
申请人： Melexis Technologies NV
发明人： VAN BUGGENHOUT, Carl , BUYDENS, Luc , REEKMANS, Stijn , VAN DAELE, Benny , VAN THIENEN, Jietse , TERRYN, Dirk
IPC分类号： G01J5/00 , G01J5/04 , G01J5/12 , G01K13/20 , G01K7/42
CPC分类号： G01K7/427 , G01K13/20 , G01J5/045 , G01J5/12 , G01J5/0025
摘要： A heat flux sensor device (100) comprising a semiconductor substrate layer (104) and a cap layer (102) that has a substrate-facing side (106) and a reception side (108). The cap layer (102) is bonded on the substrate-facing side (106) to the substrate layer (104), and the substrate layer (104) and the cap layer (102) together defining a first cavity (116). A first thermal sensor element (120, 122) is disposed within the first cavity (116) and configured to translate thermal energy proportional to a temperature difference between the cap layer (102) and the substrate layer (104) into first electrical energy. Signal processing circuitry is provided operably coupled to the first thermal sensor element (120, 122) and configured to use the first electrical energy generated by the first thermal sensor element (120, 122) to measure a heat flux flowing from the cap layer (102) to the substrate layer (104). The first cavity (116) is opaque to infrared electromagnetic radiation incident from the reception side (108) of the cap layer (102).

2. 发明公开

EP4425128A1 THERMAL SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
公开(公告)号：EP4425128A1
公开(公告)日：2024-09-04
申请号：EP23159943.2
申请日：2023-03-03
申请人： Melexis Technologies NV
发明人： VAN BUGGENHOUT, Carl
IPC分类号： G01J5/02 , G01J5/04 , H01L23/10
CPC分类号： G01J5/045 , G01J5/024 , H01L23/10
摘要： A method of manufacturing a thermal sensor (106) comprises providing a first part (102) of a body of the sensor (106), the first part (102) of the body being configured to define a first part (114) of a chamber (310). A second part (104) of the body of the sensor (106) is also provided, the second part (104) of the body being configured to define a second part (118) of the chamber (310). A getter material (112) is disposed in the first part (114) of the body of the sensor (106), and the first part (102) and the second part (104) of the body of the sensor (106) are brought together so that the first and second parts (102, 104) of the chamber (310) define the chamber (310). The chamber (310) is backfilled with a gas to a pressure greater than 10 mbar, and the first part (102) of the body is bonded to the second part (104) of the body so as to seal hermetically the chamber (310).

3. 发明公开

EP4425127A1 SEALED SENSOR DEVICE AND METHOD OF MANUFACTURE THEREOF 审中-公开
公开(公告)号：EP4425127A1
公开(公告)日：2024-09-04
申请号：EP23159942.4
申请日：2023-03-03
申请人： Melexis Technologies NV
发明人： VAN THIENEN, Jietse , VAN BUGGENHOUT, Carl , REEKMANS, Stijn
IPC分类号： G01J5/02 , G01J5/12 , G01L21/00
CPC分类号： G01J5/045 , G01J5/0225 , G01J5/0275 , G01J5/12 , G01K1/00 , G01L19/0672 , G01L9/0055 , G01L9/0047
摘要： A sealed sensor device (104) comprising: an internal atmosphere comprising a gas pressurised to a predetermined pressure, the predetermined pressure being below atmospheric pressure when the internal atmosphere is hermetically sealed from ambient. A sensor cavity (214) is also provided having a periphery and is in fluid communication with the internal atmosphere, thereby comprising the gas and the gas having a mean free path at the predetermined pressure associated therewith. A thermopile (256) is disposed in the sensor cavity (214) for detecting a change in pressure of the internal atmosphere and detecting failure of the hermetic seal. A membrane structure (234) disposed within the cavity comprises the thermopile (256). The membrane structure (234) also comprises a heating element, and a shortest distance from substantially any point on the membrane structure (234) to the periphery of the sensor cavity (214) is less than the mean free path of the gas at the predetermined pressure.

4. 发明公开

EP3486623A1 LOW-DRIFT INFRARED DETECTOR 有权
公开(公告)号：EP3486623A1
公开(公告)日：2019-05-22
申请号：EP17202450.7
申请日：2017-11-17
申请人： Melexis Technologies NV
发明人： VAN BUGGENHOUT, Carl , VANROYE, Karel
IPC分类号： G01J5/12 , G01J5/02
摘要： A semiconductor device (100) for measuring IR radiation comprising: at least one sensor pixel (10); at least one reference pixel (20) shielded from said IR radiation comprising a heater (23); a controller (50) adapted for: measuring a responsivity by applying power to the heater, while not heating the sensor pixel; measuring a first output signal of an unheated pixel and a first reference output signal of the heated pixel, obtaining the responsivity as a function of a measure of the applied power to the heater and of the difference between the first output signal and the first reference output signal; applying a period of cooling down until the temperature of the reference pixel and the sensor pixel are substantially the same; generating the output signal indicative of the IR radiation, based on the difference between the sensor and the reference output signal, by converting this difference using the responsivity.

5. 发明授权

EP3026406B1 RADIATION DETECTOR COMPRISING A COMPENSATING SENSOR 有权
标题翻译：包含补偿传感器的辐射探测器
公开(公告)号：EP3026406B1
公开(公告)日：2018-01-03
申请号：EP15196154.7
申请日：2015-11-24
申请人： Melexis Technologies NV
发明人： VAN BUGGENHOUT, Carl , VAN DER WIEL, Appolonius Jacobus , BUYDENS, Luc
IPC分类号： G01J1/02 , G01J5/02 , G01J5/06 , G01J1/42 , G01J5/04 , G01J5/08 , G01J5/12 , H01L31/0203 , H01L31/0216 , H01L27/146
CPC分类号： H01L31/0203 , B81B7/02 , B81B2201/0207 , B81B2203/0315 , G01J1/0214 , G01J1/0295 , G01J1/4228 , G01J5/0225 , G01J5/024 , G01J5/0285 , G01J5/045 , G01J5/06 , G01J5/0803 , G01J5/12 , G01J2005/068 , H01L27/144 , H01L27/1443 , H01L31/02164 , H01L31/09 , H01L35/28 , H01L35/34
摘要： A chip (100) for radiation measurements, the chip comprising a first substrate (110) comprising a first sensor (111) and a second sensor (116). The chip (100) moreover comprises a second substrate (120) comprising a first cavity (121) and a second cavity (126) both with oblique walls. An internal layer (128) is present on the inside of the second cavity (126). The second substrate (120) is sealed to the first substrate with the cavities (121, 126) on the inside such that the first cavity (121) is above the first sensor (111) and the second cavity (126) is above the second sensor (116).

6. 发明公开

EP3026406A1 RADIATION DETECTOR COMPRISING A COMPENSATING SENSOR 有权
标题翻译： STRAHLUNGSDETEKTOR MIT EINEM KOMPENSATIONSSENSOR
公开(公告)号：EP3026406A1
公开(公告)日：2016-06-01
申请号：EP15196154.7
申请日：2015-11-24
申请人： Melexis Technologies NV
发明人： VAN BUGGENHOUT, Carl , VAN DER WIEL, Appolonius Jacobus , BUYDENS, Luc
IPC分类号： G01J1/02 , G01J5/02 , G01J5/06 , G01J1/42 , G01J5/04 , G01J5/08 , G01J5/12 , H01L31/0203 , H01L31/0216 , H01L27/146
CPC分类号： H01L35/28 , B81B7/02 , B81B2201/0207 , B81B2203/0315 , G01J1/0214 , G01J1/0295 , G01J1/4228 , G01J5/0225 , G01J5/024 , G01J5/0285 , G01J5/045 , G01J5/06 , G01J5/0803 , G01J5/12 , G01J2005/068 , H01L27/144 , H01L27/1443 , H01L31/0203 , H01L31/02164 , H01L31/09 , H01L35/34
摘要： A chip (100) for radiation measurements, the chip comprising a first substrate (110) comprising a first sensor (111) and a second sensor (116). The chip (100) moreover comprises a second substrate (120) comprising a first cavity (121) and a second cavity (126) both with oblique walls. An internal layer (128) is present on the inside of the second cavity (126). The second substrate (120) is sealed to the first substrate with the cavities (121, 126) on the inside such that the first cavity (121) is above the first sensor (111) and the second cavity (126) is above the second sensor (116).
摘要翻译：一种用于辐射测量的芯片（100），所述芯片包括包括第一传感器（111）和第二传感器（116）的第一基板（110）。芯片（100）还包括第二衬底（120），其包括具有倾斜壁的第一空腔（121）和第二空腔（126）。内层（128）存在于第二空腔（126）的内部。第二基板（120）被密封到第一基板上，在内部具有空腔（121,126），使得第一空腔（121）在第一传感器（111）之上，并且第二空腔（126）在第二基板传感器（116）。

7. 发明公开

EP3627708A1 DEVICE AND METHOD FOR ABSOLUTE VOLTAGE MEASUREMENT 有权
公开(公告)号：EP3627708A1
公开(公告)日：2020-03-25
申请号：EP18195910.7
申请日：2018-09-21
申请人： Melexis Technologies NV
发明人： KASSOVSKI, Viktor , PIETTE, Francois , VAN BUGGENHOUT, Carl
IPC分类号： H03M1/06 , G01K7/01 , G01R19/32 , H03M1/12
摘要： A method and a circuit (300) for measuring an absolute voltage signal (vin), the circuit comprising: an A/D convertor (ADC), and a controller (302) adapted for: a) obtaining a first digital reference value (VPTAT) for a first reference signal (vptat) having a positive temperature coefficient; b) obtaining a second digital reference value (VBE) for a second reference signal (vbe) having a negative temperature coefficient; c) obtaining a raw digital signal value (VIN) for the signal (vin) to be measured, while applying a same reference voltage (vref) for step a) to c); and d) calculating the absolute voltage value (VABS) in the digital domain using a mathematical function of the first and second digital reference value (VPTAT, BE), and the raw digital signal value (VIN).

8. 发明授权

EP2999660B1 PACKAGING OF SEMICONDUCTOR DEVICES 有权
公开(公告)号：EP2999660B1
公开(公告)日：2018-07-04
申请号：EP14725743.0
申请日：2014-05-23
申请人： Melexis Technologies NV
发明人： VAN BUGGENHOUT, Carl
IPC分类号： B81C1/00 , H01L23/31
CPC分类号： H01L23/041 , B81C1/00269 , B81C2203/0118 , H01L21/52 , H01L21/56 , H01L23/16 , H01L23/3142 , H01L23/3157 , H01L2224/16 , H01L2924/0002 , H01L2924/00
摘要： A packaged semiconductor device comprising a stack including a die comprising a functional circuit, and a cap which is wafer bonded to the die for protecting the functional circuit as well as a mold component for packaging the stack. At least the cap and/or the die comprises at least one groove at least partially in contact with the mold component, for increasing adhesion of the mold component to the stack. A corresponding method for manufacturing such a packaged device also is described.

9. 发明公开

EP3118594A1 INFRARED SENSING DEVICES AND METHODS 有权
标题翻译： INFRAROTMESSVORRICHTUNGEN UND VERFAHREN
公开(公告)号：EP3118594A1
公开(公告)日：2017-01-18
申请号：EP16179859.0
申请日：2016-07-18
申请人： Melexis Technologies NV
发明人： VAN BUGGENHOUT, Carl , MAES, Ben , VANROYE, Karel , REEKMANS, Stijn
IPC分类号： G01J5/06 , G01J5/12
CPC分类号： G01J1/0252 , G01J1/4228 , G01J5/06 , G01J5/12 , G01J2005/066 , G01J2005/068
摘要： An infrared sensor assembly for sensing infrared radiation from an object is disclosed. The infrared sensor assembly comprises a sensor array comprising a plurality of sensing elements, provided on or embedded in a substrate extending in a substrate plane. The sensor array comprises at least two infrared sensing elements, each infrared sensing element having a radiation responsive element providing a proportionate electrical signal in response to infrared radiation incident thereto and at least two blind sensing elements, at least one blind sensing element being interspersed among the at least two sensing elements, each blind sensing element being shielded from incident infrared radiation from the object and providing a proportionate electrical signal in response to parasitic thermal fluxes. The output of the sensor array is a function of the infrared sensing elements and of the blind sensing elements such that parasitic thermal fluxes are at least partly compensated for.
摘要翻译：公开了一种用于感测来自物体的红外辐射的红外传感器组件。红外传感器组件包括传感器阵列，该传感器阵列包括设置在基板平面上延伸的基板上或嵌入到基板中的多个感测元件。传感器阵列包括至少两个红外感测元件，每个红外感测元件具有响应于入射到其上的红外辐射的比例电信号和至少两个盲感测元件的辐射响应元件，至少一个盲感测元件散布在至少两个感测元件，每个盲感测元件被屏蔽不受来自物体的入射红外辐射，并响应于寄生热通量提供成比例的电信号。传感器阵列的输出是红外感测元件和盲目感测元件的函数，使得寄生热通量至少部分被补偿。

10. 发明公开

EP3084375A1 INFRARED THERMAL SENSOR WITH BEAM WITHOUT THERMOCOUPLE 有权
标题翻译： INFRAROTWÄRMESENSORMIT EINEM BALKEN OHNE THERMOELEMENT
公开(公告)号：EP3084375A1
公开(公告)日：2016-10-26
申请号：EP14820803.6
申请日：2014-12-13
申请人： Melexis Technologies NV
发明人： MAES, Ben , VAN BUGGENHOUT, Carl , VAN DER WIEL, Appolonius Jacobus
IPC分类号： G01J5/02 , G01J5/12 , G01J5/16
CPC分类号： G01J5/023 , G01J5/0225 , G01J5/12 , G01J5/14 , G01J5/16 , G01J2005/123
摘要： An infrared thermal sensor for sensing infrared radiation is disclosed. The infrared thermal sensor comprises a substrate and a cap structure together forming a sealed cavity, a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture and a plurality of beams for suspending the membrane. At least one beam has a thermocouple arranged therein or thereon for measuring a temperature difference (ΔT) between the membrane and the substrate, the plurality of beams. Furthermore at least one beam is mechanically supporting the membrane without a thermocouple being present therein or thereon.
摘要翻译：公开了用于感测红外辐射的红外热传感器。红外热传感器包括一个基板和盖结构，一起形成一个密封的空腔，一个布置在所述空腔中的隔膜，用于通过窗口或孔接收红外辐射（IR）和多个用于悬挂隔膜的光束。至少一个光束具有布置在其中或其上的热电偶，用于测量膜与基板之间的温度差（ΔT），多个光束。此外，至少一个梁机械地支撑膜，而不存在其中或之上的热电偶。

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