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61. 发明公开

EP2330613A2 Apparatus for inspecting light emitting diode package and inspecting method using the same 有权转让
标题翻译： Vorrichtung zurPrüfungeines lichtemittierendenDiodengehäusesundPrüfungsverfahrendamit
公开(公告)号：EP2330613A2
公开(公告)日：2011-06-08
申请号：EP10193225.9
申请日：2010-12-01
申请人： Samsung LED Co., Ltd.
发明人： Lim, Ssang Gun , Ko, Seung Gyu , Kwon, Dae Kab , An, Ju-Hun , JI, Won Soo
IPC分类号： H01L21/00
CPC分类号： H01L21/67271 , G09G3/14 , H01L21/67259 , H01L21/67282 , H01L21/67294 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.
摘要翻译：提供一种用于检查发光二极管（LED）封装的装置，以检查LED以确定其是否有缺陷，并且当LED发生故障时丢弃该LED。用于检查LED封装的装置包括：检查单元，通过目视检查来检查LED，以确定LED是否有缺陷; 以及当从所述检查单元提供的LED中的所述检查单元的检查结果基于所述LED被确定为有缺陷时，废弃所述LED的废品。由于检查LED和丢弃有缺陷的LED的操作是自动化的，并且可以作为顺序处理快速处理，因此可以提高生产率。

62. 发明公开

EP2315265A1 Side view light emitting diode package 有权转让
标题翻译： Leuchtdiodeneinheit mit seitlicher Abstrahlung
公开(公告)号：EP2315265A1
公开(公告)日：2011-04-27
申请号：EP10075610.5
申请日：2006-11-24
申请人： Samsung LED Co., Ltd.
发明人： Kim, Chang Wook , Han, Yoon Suk , Song, Young Jae , Kim, Byung Man , Roh, Jae Ky , Hong, Seong Jae
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , G02B6/0073 , H01L33/483 , H01L33/54 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/00 , H01L2224/48227 , H01L2224/4554
摘要： A side view LED package for a backlight unit includes a package body (106) having a cavity with an inclined inner sidewall (107), first and second lead frames (104) arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip (102). The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.
摘要翻译：用于背光单元的侧视图LED封装包括具有倾斜内侧壁（107）的空腔的封装主体（106），布置在封装主体中的第一和第二引线框架（104），封装体的空腔暴露于将第一引线框架和第二引线框架中的至少一个的部分放置在空腔的底部到外部，安装在腔的底部以电连接到第一引线框架和第二引线框架的发光二极管芯片，以及透明密封剂布置在围绕发光二极管芯片（102）的空腔中。空腔的深度大于发光二极管芯片的安装高度，不超过安装高度的六倍。侧壁的高度被缩短以改善发射光的束角特性，增加光量，并防止侧壁的模制缺陷。

63. 发明公开

EP1992871A3 Plane light source and LCD backlight unit having the same 有权转让
标题翻译：面光源和LCD背光单元，从而
公开(公告)号：EP1992871A3
公开(公告)日：2011-04-20
申请号：EP08251718.6
申请日：2008-05-15
申请人： Samsung LED Co., Ltd.
发明人： Jeong, Young June, c/o 104-701 Doosan Apt
IPC分类号： F21V8/00 , G02B6/00 , G02F1/13357
CPC分类号： F21V21/00 , F21V11/00 , G02F1/133603 , G02F2001/133613
摘要： A plane light source (200) and an LCD backlight unit having the same. A plane light source (200) having a plurality of light emitting devices (202) arranged in a light emitting device matrix having rows and columns at a substrate according to an aspect of the invention includes a first matrix having a plurality of light emitting devices (202) arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, each of the light emitting devices (202) located within a rectangle formed by four neighboring light emitting devices included in the first matrix, wherein a pitch S between one light emitting device (202) included in the light emitting device matrix and another light emitting device (202) most adjacent to the one light emitting device (202) satisfies the following equation to obtain uniform luminance distribution at a position distant from a light emitting surface of the light emitting device by an optical length ℓ , S ≤ l 2 × tan θ 2 + α where -π /18 ≤ α ≤ π /18 is satisfied, and θ is an orientation angle of the light emitting device.

64. 发明公开

EP1833101A3 Backlight unit equipped with light emitting diodes 审中-公开
公开(公告)号：EP1833101A3
公开(公告)日：2011-03-09
申请号：EP07103453.2
申请日：2007-03-02
申请人： Samsung LED Co., Ltd.
发明人： Jeong, Gi Ho , Kim, Dong Jin , Kwon, Jae Wook , Yang, Yoon Tak , Yun, Hyeong Won , Lee, Hyun Ho , Park, Jeong Hoon
IPC分类号： H05K1/02
CPC分类号： H05K1/0206 , F21K9/00 , G02F1/133603 , G02F2001/133628 , H01L2224/48091 , H05K3/0061 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014
摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages arc mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.

65. 发明公开

EP2023205A3 Apparatus for forming nano pattern and method for forming the nano pattern using the same 有权转让
标题翻译：设备用于形成纳米图案，和方法，用于使用本机形成纳米图案
公开(公告)号：EP2023205A3
公开(公告)日：2011-01-05
申请号：EP08012920.8
申请日：2008-07-17
申请人： Samsung LED Co., Ltd.
发明人： Park, Moo Youn , Kim, Jin Ha , Hwang, Soo Ryong , Jung, Il Hyung , Lee, Jong Ho
IPC分类号： G03F7/20 , G03H1/04
CPC分类号： G03F7/70408 , G02B5/1857
摘要： The present invention relates to an apparatus for forming a nano pattern capable of fabricating the uniform nano pattern at a low cost including a laser for generating a beam; a beam splitter for splitting the beam from the laser into two beams with the same intensity; variable mirrors for reflecting the two beams split by the beam splitter to a substrate; beam expansion units for expanding diameters of the beams by being positioned on paths of the two beams traveling toward the substrate; and a beam blocking unit, installed on an upper part of the substrate, transmitting only a specific region expanded through the beam expansion unit and blocking regions a remaining region, and a method for forming the nano pattern using the same.

66. 发明公开

EP2262013A2 Nitride-based light emitting device and method of manufacturing the same 有权转让
标题翻译：维多利亚·祖尔·赫斯特隆
公开(公告)号：EP2262013A2
公开(公告)日：2010-12-15
申请号：EP10181626.2
申请日：2004-10-05
申请人： Samsung LED Co., Ltd. , Gwangju Institute of Science and Technology
发明人： Seong, Tae-yeon , Kim, Kyoung-kook , Song, June-o , Leem, Dong-seok
IPC分类号： H01L33/40 , H01L33/42
CPC分类号： H01L33/42 , H01L33/32 , H01L33/405 , H01L2933/0016
摘要： Provided are a nitride-based light emitting device and a method of manufacturing the same. The nitride-based light emitting device has a structure in which at least an n-cladding layer (130), an active layer (140), and a p-cladding layer (150) are sequentially formed on a substrate (110). The light emitting device further includes an ohmic contact layer (230) composed of a zinc (Zn)-containing oxide containing a p-type dopant formed on the p-cladding layer. The method of manufacturing the nitride-based light emitting device includes forming an ohmic contact layer composed of Zn-containing oxide containing a p-type dopant on the p-cladding layer, the ohmic contact layer being made and annealing the resultant structure. The nitride-based light emitting device and manufacturing method provide excellent I-V characteristics by improving ohmic contact with a p-cladding layer while significantly enhancing light emission efficiency of the device due to high light transmittance of a transparent electrode.
摘要翻译：提供一种氮化物系发光器件及其制造方法。氮化物系发光器件具有在衬底（110）上依次形成至少n包层（130），有源层（140）和p包层（150）的结构。该发光器件还包括由含有含锌（Zn）的氧化物构成的欧姆接触层（230），该氧化物含有形成在p包覆层上的p型掺杂剂，以及由至少一种元素组成的反射层（240）在欧姆接触层上形成的由Ag，Al，Zn，Mg，Ru，Ti，Rh，Cr和Pt组成的组。制造氮化物系发光器件的方法包括在p包层上形成由含有p型掺杂剂的含Zn氧化物构成的欧姆接触层，在欧姆接触层上形成至少一种元素的反射层由Ag，Al，Zn，Mg，Ru，Ti，Rh，Cr和Pt组成的组，并退火所得结构。氮化物系发光器件和制造方法通过改善与p型包层的欧姆接触而提供优异的I-V特性，同时由于反射型p电极的高反射率而显着提高了器件的发光效率。

67. 发明公开

EP1914813A3 Semiconductor optoelectronic device 有权转让
标题翻译：一种光电子半导体器件
公开(公告)号：EP1914813A3
公开(公告)日：2010-10-20
申请号：EP07106325.9
申请日：2007-04-17
申请人： Samsung LED Co., Ltd.
发明人： Son, Joong-kon, c/o Samsung Advanced Inst. of Technology , Ryu, Han-youl, c/o Samsung Advanced Instituteof Technology , Sakong, Tan, c/o Samsung Advanced Institute of Technology , Paek, Ho-sun, c/o Samsung Advanced Institute of Technology , Lee, Sung-nam, c/o Samsung Advanced Inst. of Technology
IPC分类号： H01S5/343 , H01L33/00 , H01S5/20 , H01S5/32 , H01S5/00 , H01S5/34
CPC分类号： H01L33/02 , B82Y20/00 , H01L33/06 , H01L33/32 , H01S5/0014 , H01S5/2004 , H01S5/2009 , H01S5/321 , H01S5/3213 , H01S5/3403 , H01S5/3406 , H01S5/34333
摘要： Provided is a semiconductor opto-electronic device including: an active layer including a quantum well and a barrier layer; upper and lower waveguide layers formed on and underneath the active layer, respectively; upper and lower clad layers formed on and underneath the upper and lower waveguide layers, respectively; a substrate supporting the resultant stack structure; an upper optical confinement layer (OCL) provided between the active layer and the upper and lower waveguide layers and having an energy gap smaller than an energy gap of the upper waveguide layer and equal to or larger than an energy gap of the barrier layer; and a lower OCL having an energy gap smaller than an energy gap of the lower waveguide layer and equal to or smaller than the energy gap of the barrier layer.

68. 发明公开

EP2479810A3 Light-emitting device package and method of manufacturing the same 有权
标题翻译：它们的一种发光器件封装及其制造方法
公开(公告)号：EP2479810A3
公开(公告)日：2012-11-07
申请号：EP12151738.7
申请日：2012-01-19
申请人： Samsung LED Co., Ltd.
发明人： Yoo, Cheol-jun , Song, Young-hee
IPC分类号： H01L33/48 , H01L33/54 , H01L33/62 , H01L33/64
CPC分类号： H01L33/486 , B29C45/14344 , B29C45/14655 , B29C45/14836 , H01L33/54 , H01L33/647 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/4826 , H01L2224/73215 , H01L2924/15311 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package (100) includes, for example, a wiring substrate (101) having an opening (102); a light-emitting device (104) that is disposed on the wiring substrate and covers the opening; a bonding wire (106) electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member (107) that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist (109) and a solder bump (110) formed on the bottom surface of the wiring substrate.

69. 发明公开

EP2515333A2 Light Emitting Device Module and Method of Manufacturing the Same 审中-公开
标题翻译： Lichtemittierendes Vorrichtungsmodul und Verfahren zu seiner Herstellung
公开(公告)号：EP2515333A2
公开(公告)日：2012-10-24
申请号：EP12162585.9
申请日：2012-03-30
申请人： Samsung LED Co., Ltd.
发明人： Kim, Hak Hwan , Moon, Kyung Mi , Paek, Ho Sun , Song, Young Hee
IPC分类号： H01L25/075 , H01L33/50 , H01L33/54
CPC分类号： H01L33/502 , H01L25/0753 , H01L27/15 , H01L33/50 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.
摘要翻译：提供了可应用于各种应用的发光器件（LED）模块及其制造方法。通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量可以提高价格竞争力。在制造LED模块的方法中，可以通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作来最小化和简化操作。可以通过使用金属材料作为基底和凸块来增强散热特性。

70. 发明公开

EP2506686A2 Illumination lighting apparatus and method of controlling illumination 审中-公开
标题翻译： Beleuchtungsvorrichtung und Verfahren zur Steuerung der Beleuchtung
公开(公告)号：EP2506686A2
公开(公告)日：2012-10-03
申请号：EP12162152.8
申请日：2012-03-29
申请人： Samsung LED Co., Ltd.
发明人： Jeon, Jong Hoon , Cha, Min Ho , Jin, Joong Hun
IPC分类号： H05B37/02
CPC分类号： H05B37/0227 , Y02B20/44
摘要： Provided are an illumination lighting apparatus (100) that provides various and intuitional light in response to a motion of a user, and an illumination controlling method. The illumination lighting apparatus (100) may include a lamp unit (110) including at least one light emitting part that is selectively turned on and off, a motion sensing unit (120) including at least one motion sensor (121, 122, 123), transmitting a sensed signal when the at least one motion sensor (121, 122, 123) senses a motion of a user, and enabling the lamp unit (110) to provide a light corresponding to the sensed signal, and a control unit to receive the sensed signal from the motion sensing unit (120) to adjust a light emitting type of the lamp unit (110) in a plurality of modes, and the motion sensing unit (120) may transmit, based on a mode of the control unit, different sensed signals to the control unit to change the light emitting type of the lamp unit (110).
摘要翻译：提供了一种照亮照明装置（100），其提供响应于用户的运动的各种和直观的光以及照明控制方法。照明照明装置（100）可以包括灯单元（110），其包括被选择性地导通和关闭的至少一个发光部分，运动感测单元（120）包括至少一个运动传感器（121,122,123）当所述至少一个运动传感器（121,122,123）感测到用户的运动并使所述灯单元（110）能够提供与所感测的信号相对应的光时，传送感测到的信号，以及控制单元，用于接收来自运动感测单元（120）的感测信号以多种模式调节灯单元（110）的发光类型，运动感测单元（120）可以基于控制单元的模式，将不同的感测信号传送到控制单元以改变灯单元（110）的发光类型。

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