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41. 发明公开

EP0195992A3 Gripping equipment in a laminating machine 失效
标题翻译：运输设备在层压机
公开(公告)号：EP0195992A3
公开(公告)日：1988-10-05
申请号：EP86103529
申请日：1986-03-15
申请人： HOECHST AKTIENGESELLSCHAFT
发明人： Kühnert, Hans-Günter Egbert
IPC分类号： B29C31/00 , B29C67/18 , G03F07/16
CPC分类号： B65H5/10 , B29C31/00 , G03F7/161 , Y10T83/0538 , Y10T83/2185 , Y10T83/293 , Y10T83/4632 , Y10T83/654 , Y10T83/6568 , Y10T83/6579 , Y10T83/6608
摘要： Die Greifereinrichtung 1 weist zumindest zwei Vakuum greifer 8,8 auf, die entlang einer Querstrebe 13 der Greifereinrichtung horizontal verschiebbar und festleg bar sind. Die Greifereinrichtung ist vertikal auf und ab verfahrbar und enthält ein sich über die Breite der Querstrebe erstreckendes Blasrohr 6, aus dem ein Luft strom austritt, der den festzuhaltenden und zu trans portierenden Fotoresistfilm 24 mit seiner fotoresist freien Rückseite gegen die Vakuumgreifer 8,8 drückt. Sobald diese mit Vakuum beaufschlagt sind, wird der Fotoresistfilm festgehalten und nach unten transpor tiert. Auf der Oberseite des Blasrohrs 6 sind Anschlag schrauben 14,15 angeordnet, die beim Hochfahren der Greifereinrichtung an der Unterseite von vertikal ver schiebbaren Befestigungselementen 16,17, an denen eine Schneidleiste 7 mit einer Schneidnut 20 befestigt ist, anliegen. Beim Hochfahren der Greifereinrichtung wird die Schneidleiste 7 mithochgenommen, wobei der Fotore sistfilm 24 durch die Abschrägung der Schneidleiste von der Saugplatte 23, die unter Vakuum steht, abgehoben wird.

42. 发明公开

EP0207893A3 Image-forming process 失效
标题翻译：图像形成过程
公开(公告)号：EP0207893A3
公开(公告)日：1988-07-27
申请号：EP86810270
申请日：1986-06-13
申请人： CIBA-GEIGY AG
发明人： Goodin, Jonathan William, Dr. , Irving, Edward, Dr. , Banks, Christopher Paul
IPC分类号： G03F07/16 , G03F07/20
CPC分类号： G03F7/2022 , G03F7/029 , G03F7/168 , H05K3/0082 , H05K3/064

43. 发明公开

EP0215358A3 Method and device employing input and output staging chamber devices for reduced pressure lamination 失效
标题翻译：使用输入和输出分层室的方法和装置，用于降低压力层压
公开(公告)号：EP0215358A3
公开(公告)日：1988-06-01
申请号：EP86111989
申请日：1986-08-29
申请人： Hitachi Chemical Co., Ltd.
发明人： Tomisawa, Yoshiaki c/o Hitachi Chemical , Satou, Tadaji c/o Hitachi Chemical , Hayashi, Nobuyuki c/o Hitachi Chemical , Miyamae, Yusuke Hitachi Kasei Setsubi Kenetsu K.K.
IPC分类号： B29C67/18 , G03F07/16 , B32B31/20 , H05K03/00
CPC分类号： B32B37/226 , B29C2791/006 , B29L2031/3425 , B32B38/185 , B32B2309/68 , H05K3/281 , H05K2203/068 , H05K2203/085 , Y10T156/1052 , Y10T156/1343
摘要： In this method for reduced pressure lamination of a light sensitive material (44) in film form to a printed circuit base board (2), when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive layer to the printed circuit base board (2) under reduced pressure, a main container (9) for carrying out the adhesion and an intake container (8) and an exit container (10) connected thereto are provided, the base board (2) is supplied to the intake container (8) set to atmospheric pressure, and thereafter the pressure in the intake container (8) is reduced, next the base board (2) is supplied Into the main container (9) at reduced pressure and the light sensitive material (44) in film form is adhered to the base board (2), next the light sensitive material (44) in film form Is in the case that it is continuous cut to the dimensions of the base board (2), and after supplying the base board (2) to which the light sensitive material (44) in film form has been adhered to the exit container (10) at reduced pressure, the exit container (10) is set to atmospheric pressure and the base board (2) to which the light sensitive material (44) in film form has been adhered is ejected from the exit container (10). A reduced pressure adhesion device is also described for performing the method.

44. 发明公开

EP0204415A3 A method for preparing a printed circuit board 失效
标题翻译：一种制备印刷电路板的方法
公开(公告)号：EP0204415A3
公开(公告)日：1987-10-28
申请号：EP86303108
申请日：1986-04-24
申请人： Nippon Paint Co., Ltd.
发明人： Ishikawa, Katsukiyo , Nishijima, Kanji , Seio, Mamoru c/o Nippon Paint Co
IPC分类号： H05K03/34 , G03F07/16 , G03F07/10
CPC分类号： G03F7/164 , G03F7/004 , H05K3/062 , H05K3/108 , H05K3/3473 , H05K3/427 , H05K2203/0793 , H05K2203/135 , Y10T29/49165
摘要： The invention provides a method for preparing a printed circuit board with solder plated circuit and :hrough-holes, using a specifically prepared ohotoresist material and a combination of exposure, development, solder plating and etching means. This method is particularly useful for the preparation of a printed circuit-board with solder plated circuit and through-holes bearing a high density circuit pattern.

45. 发明公开

EP0211667A3 Radiation-sensitive resin composition 无效
标题翻译：辐射敏感性树脂组合物
公开(公告)号：EP0211667A3
公开(公告)日：1987-09-09
申请号：EP86306125
申请日：1986-08-07
申请人： JAPAN SYNTHETIC RUBBER CO., LTD.
发明人： Hosaka, Yoshihiro , Nozue, Ikuo , Takatori, Masashige , Harita, Yoshiyuki
IPC分类号： G03F07/08 , G03F07/10 , G03F07/16
CPC分类号： G03F7/0226 , G03F7/0048 , G03F7/0085
摘要： A radiation-sensitive resin composition comprises a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monooxymonocarboxylic acid ester. This composition has a high storgage stability (i.e., a very small amount of fine particles are formed during storage) and is suited for use as a resist for making integrated circuits.

46. 发明公开

EP0206261A3 Photosensitive coating composition and process for producing a photosensitive layer on a support 有权转让
标题翻译：感光涂料组合物和用于在支持物上生产感光层的方法
公开(公告)号：EP0206261A3
公开(公告)日：1987-09-02
申请号：EP86108378
申请日：1986-06-19
申请人： HOECHST AKTIENGESELLSCHAFT
发明人： Hultzsch, Günther, Dr. Dipl.-Chem.
IPC分类号： G03F07/16 , G03F07/08
CPC分类号： G03F7/016 , G03F7/0226 , G03F7/164 , H05K3/0073

47. 发明公开

EP0174555A3 High resolution solder mask photopolymers for screen coating over circuit traces 失效
标题翻译：高分辨率焊接掩模用于屏幕上涂覆电路的光刻胶
公开(公告)号：EP0174555A3
公开(公告)日：1987-08-19
申请号：EP85110855
申请日：1985-08-28
申请人： Sullivan, Donald Fort
发明人： Sullivan, Donald Fort
IPC分类号： H05K03/34 , B23K35/22 , G03C01/68 , G03F07/16
CPC分类号： H05K3/281 , B23K35/224 , G03F7/027 , G03F7/16 , H05K3/0079 , H05K3/0082 , H05K3/1216 , H05K2203/056 , H05K2203/0577 , H05K2203/066 , H05K2203/0759 , Y10S430/136
摘要： High photo resolution of over 100 lines is obtained for solder masks of thicknesses greater than .002 in. 1.005 cm) with liquid photopolymers of special compositions deposited from mesh screens over printed wiring board traces and photoexposed with a phototool image in contact with the photopolymer. Special interrelated properties of the liquid photopolymer interacting in an explicit process of screen depositing two adjacent liquid polymer layers include freedom from volatiles. a paste-like viscosity permitting use with mesh screens of about 60 mesh to obtain a uniform thickness layer free of bubbles and mesh marks, solder mask insulator and heat resistance characteristics, an ability to photo flash through a phototool image in contact with one layer surface and the other surface exposed to air to polymerize through a significant thickness of about one-third of the layer thickness, photo response to polymerize to a depth of about .02 in. (.05 cm) when exposed to about 1 joule per square cm, absence of ingredients refracting, blocking or reflecting the actinic radiation and good adherence to cooper wiring. These properties react in the process of bubble-free lamination of two paste consistency layers, a first to cover uneven wiring traces and a second to provide a flat photo-image surface, thereby to achieve thicknesses of about .006 in. 1.015 cm) for covering wiring traces .004 in. (.005 cm) thickness over all wiring traces. This is achieved by photo flashing the uppermost layer through a photo image with one surface exposed to air to polymerize a surface layer that covers the traces permitting the unpolymerized liquid paste surface to meet in bubble-free surface contact with an initial layer deposited directly over the wiring traces.

48. 发明公开

EP0185155A3 Photopolymerizable recording material and process for its production 失效
标题翻译：光化学记录材料及其生产工艺
公开(公告)号：EP0185155A3
公开(公告)日：1987-06-03
申请号：EP85112489
申请日：1985-10-03
申请人： HOECHST AKTIENGESELLSCHAFT
发明人： Hilger, Manfred , Klein, Norbert, Dipl.-Ing.
IPC分类号： G03F07/16
CPC分类号： G03C3/00 , G03F7/168 , Y10S430/151 , Y10S430/162 , Y10T156/1038

49. 发明公开

EP0146505A3 Image formation process 有权
标题翻译：图像形成过程
公开(公告)号：EP0146505A3
公开(公告)日：1987-06-03
申请号：EP84810618
申请日：1984-12-14
申请人： CIBA-GEIGY AG
发明人： Irving, Edward, Dr. , Smith, Terence James
IPC分类号： G03F07/16 , G03F07/26
CPC分类号： G03F7/168 , H05K3/0073

50. 发明公开

EP0195322A3 Process for the preparation of a photopolymerisable registration material 失效
标题翻译：制备光致变色注册材料的方法
公开(公告)号：EP0195322A3
公开(公告)日：1987-05-27
申请号：EP86102976
申请日：1986-03-06
申请人： HOECHST AKTIENGESELLSCHAFT
发明人： Hilger, Manfred
IPC分类号： G03F07/16 , G03F07/26
CPC分类号： G03F7/168 , G03F7/38 , Y10S430/111

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