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    • 41. 发明公开
    • Method of manufacturing an optoelectronic semiconductor device
    • Verfahren zur Herstellung einer optoelektrischen Halbleitervorrichtung。
    • EP0602725A2
    • 1994-06-22
    • EP93203456.4
    • 1993-12-09
    • Philips Electronics N.V.
    • Binsma, Johannes Jordanus Mariavan der Heijden, Johannes Martinus Maria
    • H01L33/00H01S3/19H01S3/085H01S3/025G02F1/313
    • H01S5/026H01L33/0066H01S5/06256H01S5/125H01S5/2277H01S5/50
    • The invention relates to a method of manufacturing an optoelectronic semiconductor device whereby two comparatively thin layers are provided next to one another on a substrate by means of a non-selective growing process, an etching process, and a selective growing process, a cladding layer being present over said thin layers. In the known method, first the one thin layer and the cladding layer are grown, the latter is locally removed, and the other thin layer and the cladding layer are then grown in that position.
      This method has the disadvantage that unevennesses (steps or openings) often arise at the surface of the layer structure above the transition between the thin layers.
      A method according to the invention is characterized in that in a first non-selective growing process the one layer and a small portion of the cladding layer are provided, these layers are locally removed in the etching process, and the other thin layer and a small portion of the cladding layer are provided in that location in the selective growing process, after which in a second non-selective growing process the major portion of the cladding layer is provided. The layer structure obtained has a substantially plane surface which is free from defects and is very suitable for further processing. The thin layers may be, inter alia, an active and a radiation-guiding layer. According to the invention, especially devices having a mesa structure can be manufactured with a high accuracy and yield.
    • 本发明涉及一种制造光电半导体器件的方法,其中通过非选择性生长工艺,蚀刻工艺和选择性生长工艺,在衬底上彼此相邻设置两个相对较薄的层,包层为 存在于所述薄层之上。 在已知的方法中,首先生长一个薄层和包覆层,然后将其局部去除,然后在该位置生长另一个薄层和包覆层。 该方法的缺点在于,层间结构的表面上经常出现在薄层之间的过渡之上的不均匀(台阶或开口)。 根据本发明的方法的特征在于,在第一非选择性生长工艺中,提供了一层和一小部分包覆层,这些层在蚀刻工艺中局部去除,另一薄层和小 在选择性生长过程中在该位置设置包覆层的部分,之后在第二非选择性生长工艺中提供包覆层的主要部分。 获得的层结构具有基本上平面的表面,其没有缺陷,非常适于进一步加工。 特别地,薄层可以是有源和辐射引导层。 根据本发明,特别是具有台面结构的装置可以以高精度和高产率制造。