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41. 发明公开

EP0038510A1 Ensemble de semiconducteurs de puissance muni de transformateurs et de circuits d'allumage et de protection 无效
标题翻译：建设功率半导体用变压器和点火和安全电路。
公开(公告)号：EP0038510A1
公开(公告)日：1981-10-28
申请号：EP81102843.0
申请日：1981-04-14
申请人： ALSTHOM-ATLANTIQUE Société anonyme dite:
发明人： Masselin, Michel
IPC分类号： H05K7/20 , H01L23/44
CPC分类号： H05K7/20927 , B60L2200/26 , H01L23/44 , H01L2924/0002 , H01L2924/00
摘要： Ensemble de semiconducteurs de puissance muni de transformateurs et de circuits d'allumage et de protection.
Montage disposé de telle sorte qu'on réduit les longueurs des connexions entre les thyristors (2,3), les transformateurs (11) et les circuits de protection (9,10). Pour cela les éléments (9,10, 11) sont disposés sur des plaquettes (7,8) dont le plan est parallèle aux axes des colonnes des thyristors (2,3).
Applications - Alimentation des moteurs en traction ferroviaire.

42. 发明公开

EP3229103A4 ELECTRONIC APPARATUS COOLING DEVICE 无效
公开(公告)号：EP3229103A4
公开(公告)日：2018-07-11
申请号：EP14907366
申请日：2014-12-05
申请人： EXASCALER INC
发明人： SAITO MOTOAKI
IPC分类号： G06F1/20 , F25D9/00 , H01L23/44 , H05K7/20
CPC分类号： H05K7/20236 , F24T10/10 , F25D9/00 , F25D9/005 , G06F1/20 , G06F1/206 , H01L23/44 , H01L2924/0002 , H05K7/20 , Y02E10/12 , H01L2924/00
摘要： Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls 13a to 13e, 14a to 14e are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections 15aa to 15dd are defined. An electronic apparatus 100 is stored in each of the storage sections 15aa to 15dd. Each of the storage sections 15aa to 15dd is formed with an inflow opening 16aa to 16dd or an inflow opening 116aa to 116ee and an outflow opening 17aa to 17ee for the cooling liquid 11. The inflow opening 16aa to 16dd or the inflow opening 116aa to 116ee is formed at a bottom portion or a side surface of each storage section 15aa to 15dd, and the outflow opening 17aa to 17ee is formed in the vicinity of the liquid level of the cooling liquid 11 flowing through each storage section 15aa to 15dd.

43. 发明公开

EP3318954A1 LIQUID IMMERSION COOLING DEVICE 有权
标题翻译：液体浸泡冷却装置
公开(公告)号：EP3318954A1
公开(公告)日：2018-05-09
申请号：EP15897197.8
申请日：2015-07-02
申请人： Exascaler Inc.
发明人： SAITO, Motoaki
IPC分类号： G06F1/20 , H01L23/44 , H05K7/20
CPC分类号： G06F1/20 , B66D3/26 , G06F2200/201 , H01L23/44 , H05K7/20236 , H05K7/20272 , H05K7/20763 , H05K7/20781
摘要： A plurality of inner partitions 13a-13d are disposed within a cooling tank 10 having an open space 10a to form a plurality of arrayed housing parts 14a-14d. At least one unit of electronic device 100 is housed in each of the housing parts. A lifting mechanism 20 includes a tower 21 equipped with a guide and a driving source for raising and lowering an arm 22, a slide mechanism 23 attached to the cooling tank 10, and a stopper 27 for restricting a movement of the tower 21 so that a range in which the tower 21 moves in a width direction of the cooling tank 10 does not exceed at least a width of the open space 10a. The slide mechanism 23 supports the tower 21 movably with respect to the cooling tank 10 in a horizontal plane located above the open space. The liquid immersion cooling system 1 is capable of safely lifting or lowering the electronic devices 100 densely housed within the cooling tank 10 without requiring the stage in the periphery of the installation surface of the cooling tank 10.
摘要翻译：多个内部隔板13a-13d设置在具有开放空间10a的冷却箱10内，以形成多个阵列壳体部分14a-14d。电子设备100的至少一个单元容纳在每个壳体部分中。升降机构20包括：塔架21，该塔架21具备用于使臂22升降的引导件和驱动源;安装在该冷却箱10上的滑动机构23;以及限制塔架21的移动的挡块27，塔21沿冷却箱10的宽度方向移动的范围不超过开放空间10a的宽度。滑动机构23在位于开放空间上方的水平面中相对于冷却箱10可移动地支撑塔架21。液浸冷却系统1能够安全地提升或降低密集容纳在冷却箱10内的电子装置100，而不需要冷却箱10的安装表面周边的台架。

44. 发明公开

EP3317708A2 SYSTEM FOR COMPENSATION OF EXPANSION/CONTRACTION OF A COOLING MEDIUM INSIDE A SEALED CLOSURE 无效
标题翻译：用于补偿冷却介质在密封封闭装置中膨胀/收缩的系统
公开(公告)号：EP3317708A2
公开(公告)日：2018-05-09
申请号：EP16733955.5
申请日：2016-06-30
申请人： CommScope Connectivity Belgium BVBA
发明人： DE JAEGERE, Nicolas , CAMS, Eddy Luc , MULLANEY, Julian S.
IPC分类号： G02B6/44 , H01L23/42 , H01L23/44 , H05K5/02 , H05K7/20 , H01L23/24
CPC分类号： G02B6/4448 , H01L23/36 , H01L23/44 , H01L23/473 , H05K5/068 , H05K7/20236
摘要： A closure (100) protects telecommunications circuitry from environmental factors. The closure includes a base (128) having a sidewall (134) extending upwardly from a bottom (118), the sidewall (134) defining at least one cable port (122). The closure also includes a cover (126) that attaches to the base (128) to close an interior (130) of the closure (100). In addition, electronic circuitry (132) disposed within the interior (130) of the closure (100). Encompassing the electronic circuitry (132) is a cooling medium (138) dispersed through the interior (130). Further, a pressure regulating device (136) is placed in the interior (130) to maintain a viable internal operating pressure for the closure.

45. 发明公开

EP3132221A4 ENHANCED BOILING WITH SELECTIVE PLACEMENT OF NUCLEATION SITES 有权
公开(公告)号：EP3132221A4
公开(公告)日：2018-01-03
申请号：EP15793355
申请日：2015-05-18
申请人： KANDLIKAR SATISH G , PATIL CHINMAY
发明人： KANDLIKAR SATISH G , PATIL CHINMAY
IPC分类号： F28F3/02 , F28F13/02 , F28F13/18 , H01L23/427 , H01L23/44
CPC分类号： F28F13/187 , H01L23/427 , H01L23/44 , H01L2924/0002 , H01L2924/00
摘要： A heat transfer system includes a substrate having a heat exchange region including a surface having an enhancement region including alternating regions of selectively placed plurality of nucleation sites and regions lacking selectively placed nucleation sites, such that bubble formation and departure during boiling of a liquid in contact with the enhancement region induces liquid motion over the surface of the regions lacking selectively placed nucleation sites sufficient to enhance both critical heat flux and heat transfer coefficient at the critical heat flux in the enhancement region of the system.

46. 发明公开

EP2325880A3 Immersion cooling apparatus for a power semiconductor device 审中-公开
标题翻译：用于功率半导体器件的浸没式冷却装置
公开(公告)号：EP2325880A3
公开(公告)日：2018-01-03
申请号：EP10191187.3
申请日：2010-11-15
申请人： Delphi Technologies, Inc.
发明人： Lowry, Michael J.
IPC分类号： H01L23/433 , H01L23/44 , H01L23/473 , H01L23/40
CPC分类号： H01L23/433 , H01L23/44 , H01L23/473 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： An immersion cooling apparatus includes a multi-terminal thermally conductive module (14) that supports and encloses a power semiconductor device (72, 74) and a housing (12) defining a flow-through chamber (26) in which the thermally conductive module (14) is mounted and through which liquid coolant is circulated. The thermally conductive module (14) has first and second oppositely disposed connector headers (38, 40) housing terminal pins or blades (50, 52) electrically coupled to the semiconductor device (72, 74), and the connector headers (38, 40) protrude through openings (19a, 20a) in oppositely disposed sidewalls (19, 20) of the housing (12) so that the portion (36) of the thermally conductive module (14) between the connector headers (38, 40) is suspended in the chamber (26) and immersed in the circulating coolant. The thermally conductive module (14) is sealed against the housing sidewalls (19, 20) around the openings (19a, 20a), and one of the sidewalls (20) is removable to facilitate installation of the thermally conductive module (14) in the housing (12) or its subsequent removal.
摘要翻译：一种浸入式冷却设备包括支撑和封装功率半导体器件（72,74）和限定流通室（26）的壳体（12）的多端子导热模块（14），导热模块（ 14）被安装并且液体冷却剂通过该环路被循环。导热模块（14）具有第一和第二相对布置的连接器头（38,40），其容纳电连接到半导体器件（72,74）的端子引脚或刀片（50,52），并且连接器头部（38,40 ）穿过壳体（12）的相对设置的侧壁（19,20）中的开口（19a，20a）突出，使得连接器集管（38,40）之间的导热模块（14）的部分（36）被悬挂在腔室（26）中并浸入循环的冷却剂中。所述导热模块（14）相对于所述开口（19a，20a）周围的所述壳体侧壁（19,20）密封，并且所述侧壁（20）中的一个是可移除的，以便于将所述导热模块（14）住房（12）或随后的拆除。

47. 发明公开

EP3168869A1 AN INTEGRATED CIRCUIT PACKAGE WITH ENHANCED COOLING STRUCTURE 有权
标题翻译：具有增强型冷却结构的集成电路封装
公开(公告)号：EP3168869A1
公开(公告)日：2017-05-17
申请号：EP16197872.1
申请日：2016-11-09
申请人： Altera Corporation
发明人： Gutala, Ravi , Rahman, Arifur , Chandrasekar, Karthik
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , G01K7/343 , G01N25/00 , H01L21/486 , H01L21/4882 , H01L23/367 , H01L23/3677 , H01L23/44 , H01L23/467 , H01L23/49827 , H01L25/065
摘要： An integrated circuit package may include an integrated circuit die having first and second circuit regions and a surface. The first circuit region of the integrated circuit package has an operating temperature that is different than that of the second circuit region. A cooling structure is formed on the surface of the integrated circuit die. The cooling structure includes a group of micropipe interconnects arranged to form a cooling channel that allows for the flow of coolant. The cooling channel includes first and second subchannels. The first sub-channel has a first size that allows a higher flow rate of the coolant to cool the first circuit region. The second sub-channel has a second size that allows a lower flow rate of the coolant to cool the second circuit region.
摘要翻译：集成电路封装可以包括具有第一和第二电路区域和表面的集成电路管芯。集成电路封装的第一电路区域的工作温度不同于第二电路区域的工作温度。冷却结构形成在集成电路管芯的表面上。冷却结构包括一组微管互连，其被布置成形成允许冷却剂流动的冷却通道。冷却通道包括第一和第二子通道。第一子通道具有允许冷却剂的较高流速冷却第一回路区域的第一尺寸。第二子通道具有第二尺寸，其允许冷却剂的较低流率冷却第二回路区域。

48. 发明公开

EP3092879A1 DISPOSITIF ÉLECTRONIQUE DE PUISSANCE À REFROIDISSEMENT AMÉLIORÉ 有权转让
标题翻译： ELEKTRONISCHE STROMVORRICHTUNG MIT VERBESSERTERKÜHLUNG
公开(公告)号：EP3092879A1
公开(公告)日：2016-11-16
申请号：EP15705209.3
申请日：2015-01-07
申请人： Safran Electronics & Defense
发明人： RIOU, Jean-Christophe
IPC分类号： H05K7/20 , H01L23/44
CPC分类号： H01L23/44 , B81B7/0093 , B81B2201/01 , H01L23/06 , H01L23/3675 , H01L23/3736 , H01L23/49541 , H01L23/49568 , H01L24/48 , H01L24/73 , H01L25/074 , H01L2224/48091 , H01L2224/48106 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01022 , H01L2924/01026 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/10272 , H01L2924/1033 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/1461 , H01L2924/19107 , H05K7/20236 , H05K7/20927 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要： The invention relates to an electronic device comprising at least one electronic component mounted on a support and surrounded by a deformable envelope containing a thermally conductive and electrically insulating liquid, said device comprising a heat dissipation plate which is substantially parallel to the support and at a distance therefrom, and means for heat transfer by conduction between the envelope and the plate, the thermally conductive and electrically insulating liquid being selected and the envelope being arranged such that a thermal expansion of the oil generates a force pressing the envelope against the means for heat exchange by conduction.
摘要翻译：本申请人最初提交的标题和摘要的翻译。没有考虑到PCT当局可能随后根据职权作出的任何变更，例如根据PCT细则37.2,38.2和/或48.3。

49. 发明公开

EP2789009A1 DESIGN OF A HEAT DISSIPATION STRUCTURE FOR AN INTEGRATED CIRCUIT (IC) CHIP 有权
标题翻译： DRAFT热扩散结构用于芯片在集成电路
公开(公告)号：EP2789009A1
公开(公告)日：2014-10-15
申请号：EP12790708.7
申请日：2012-10-11
申请人： Oracle International Corporation
发明人： ANKIREDDI, Seshasayee S. , COPELAND, David W.
IPC分类号： H01L23/367 , H01L23/44
CPC分类号： H01L23/3675 , H01L23/367 , H01L23/3672 , H01L23/44 , H01L23/473 , H01L23/498 , H01L2224/16225 , H01L2224/73253 , H05K1/0272 , H05K7/20927
摘要： An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer.

50. 发明公开

EP1946032A4 STRUCTURED THERMAL TRANSFER ARTICLE 审中-公开
标题翻译：结构化热传递制品
公开(公告)号：EP1946032A4
公开(公告)日：2010-10-06
申请号：EP06826485
申请日：2006-10-23
申请人： 3M INNOVATIVE PROPERTIES CO
发明人： TUMA PHILLIP E , PALMGREN GARY M
IPC分类号： H01L23/373 , F28F21/08
CPC分类号： H01L23/3736 , H01L23/3732 , H01L23/3733 , H01L23/44 , H01L2924/0002 , Y10T29/49393 , H01L2924/00

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