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41. 发明公开

EP3170200A4 METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS 有权
公开(公告)号：EP3170200A4
公开(公告)日：2018-01-24
申请号：EP15822244
申请日：2015-06-25
申请人： MICRON TECHNOLOGY INC
发明人： VADHAVKAR SAMEER S , LI XIAO , GROOTHUIS STEVEN K , LI JIAN , GANDHI JASPREET S , DERDERIAN JAMES M , HEMBREE DAVID R
IPC分类号： H01L25/065 , H01L23/04 , H01L23/28 , H01L23/367 , H01L23/48
CPC分类号： H01L25/50 , H01L21/50 , H01L21/563 , H01L23/04 , H01L23/3675 , H01L23/44 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/18 , H01L2224/1134 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/17519 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/2939 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83101 , H01L2224/83102 , H01L2224/83104 , H01L2224/83424 , H01L2224/83447 , H01L2224/8388 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/156 , H01L2924/16235 , H01L2924/16251 , H01L2924/1815 , H01L2924/0715 , H01L2924/00014 , H01L2924/01006 , H01L2924/014 , H01L2924/01047 , H01L2924/00012 , H01L2924/0665 , H01L2924/00
摘要： Method for packaging a semiconductor die assemblies. In one embodiment, a method is directed to packaging a semiconductor die assembly having a first die and a plurality of second dies arranged in a stack over the first die, wherein the first die has a peripheral region extending laterally outward from the stack of second dies. The method can comprise coupling a thermal transfer structure to the peripheral region of the first die and flowing an underfill material between the second dies. The underfill material is flowed after coupling the thermal transfer structure to the peripheral region of the first die such that the thermal transfer structure limits lateral flow of the underfill material.

42. 发明公开

EP3211668A1 ARRANGEMENT FOR SUBSEA COOLING OF SEMICONDUCTOR MODULES 有权
标题翻译：用于半导体模块的海底冷却的布置
公开(公告)号：EP3211668A1
公开(公告)日：2017-08-30
申请号：EP16156804.3
申请日：2016-02-23
申请人： ABB Schweiz AG
发明人： LENDENMANN, Heinz , GRADINGER, Thomas , WAGNER, Thomas , KOIVULUOMA, Timo , LANERYD, Tor
IPC分类号： H01L23/44 , H05K7/00
CPC分类号： H01L23/44 , H01L21/52 , H01L21/54 , H01L23/3672 , H01L23/3736 , H01L25/072 , H01L25/0753 , H01L25/18 , H01L25/50 , H01L33/642 , H02B1/565 , H05K7/20236 , H05K7/20927
摘要： There is presented an arrangement for subsea cooling of a semiconductor module. The arrangement comprises a tank. The tank is filled with a dielectric fluid. The arrangement comprises at least one semiconductor module. The at least one semiconductor module is placed in the tank. Each at least one semiconductor module comprises semiconductor submodules and is attached to a heat sink. The semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection. The heat sink comprises a first part having a first thermal resistance from the semiconductor module to the dielectric fluid. The heat sink comprises a second part having a second thermal resistance from the semiconductor module to the dielectric fluid. The second thermal resistance is higher than the first thermal resistance. The heat sink is oriented such that, when the arrangement is installed, the first part is vertically higher than the second part.
摘要翻译：提出了用于半导体模块的海底冷却的布置。该装置包括一个罐。该罐充满介电流体。该装置包括至少一个半导体模块。该至少一个半导体模块被放置在罐中。每个至少一个半导体模块包括半导体子模块并连接到散热器。半导体子模块产生热量，从而使介电流体通过自然对流而循环。散热器包括具有从半导体模块到介电流体的第一热阻的第一部分。散热器包括具有从半导体模块到介电流体的第二热阻的第二部分。第二热阻高于第一热阻。散热器被定向成使得当安装布置时，第一部分垂直地高于第二部分。

43. 发明公开

EP3208844A1 POWERMAP OPTIMIZED THERMALLY AWARE 3D CHIP PACKAGE 有权转让
标题翻译： POWERMAP优化了热感应3D芯片封装
公开(公告)号：EP3208844A1
公开(公告)日：2017-08-23
申请号：EP17156635.9
申请日：2017-02-17
申请人： Google Inc.
发明人： IYENGAR, Madhu Krishnan , KANG, Teck-Gyu , MALONE, Christopher Gregory , JOUPPI, Norman Paul
IPC分类号： H01L23/44
CPC分类号： H01L23/473 , H01L23/04 , H01L23/3675 , H01L23/3732 , H01L23/3736 , H01L23/3737 , H01L23/44 , H01L23/498 , H01L25/0652 , H01L25/18
摘要： A semiconductor package (100) includes a substrate (110), an integrated circuit (120), a memory support (140), stacked memory (130), and a lid (150). The integrated circuit has a low power region (124) and a high power region (122). The memory support is disposed on the low power region of the integrated circuit and is configured to allow a flow of fluid (250) therethrough to conduct heat away from the low power region of the integrated circuit. The lid defines a first port (152, 152a), a second port (152, 152b), and a lid volume fluidly connecting the first port and the second port. The lid volume (160) is configured to house the integrated circuit, the memory support, and the stacked memory, while directing the flow of fluid to flow over the integrated circuit, the memory support, and the stacked memory.
摘要翻译：半导体封装（100）包括衬底（110），集成电路（120），存储器支撑件（140），堆叠式存储器（130）和盖子（150）。集成电路具有低功率区域（124）和高功率区域（122）。存储器支撑设置在集成电路的低功率区域上，并被配置为允许流体（250）流过其中以将热量从集成电路的低功率区域导出。盖限定第一端口（152,152a），第二端口（152,152b）和流体连接第一端口和第二端口的盖体积。盖体积（160）被配置为容纳集成电路，存储器支撑件和堆叠存储器，同时引导流体流动流过集成电路，存储器支撑件和堆叠存储器。

44. 发明授权

EP2789009B1 DESIGN OF A HEAT DISSIPATION STRUCTURE FOR AN INTEGRATED CIRCUIT (IC) CHIP 有权
标题翻译： DRAFT热扩散结构用于芯片在集成电路
公开(公告)号：EP2789009B1
公开(公告)日：2017-03-22
申请号：EP12790708.7
申请日：2012-10-11
申请人： Oracle International Corporation
发明人： ANKIREDDI, Seshasayee S. , COPELAND, David W.
IPC分类号： H01L23/367 , H01L23/44 , H01L23/473
CPC分类号： H01L23/3675 , H01L23/367 , H01L23/3672 , H01L23/44 , H01L23/473 , H01L23/498 , H01L2224/16225 , H01L2224/73253 , H05K1/0272 , H05K7/20927

45. 发明公开

EP2325880A2 Immersion cooling apparatus for a power semiconductor device 审中-公开
标题翻译： Tauchkühlgerätfürein Leistungshalbleiterelement
公开(公告)号：EP2325880A2
公开(公告)日：2011-05-25
申请号：EP10191187.3
申请日：2010-11-15
申请人： Delphi Technologies, Inc.
发明人： Lowry, Michael J.
IPC分类号： H01L23/433 , H01L23/44 , H01L23/473 , H01L23/40
CPC分类号： H01L23/433 , H01L23/44 , H01L23/473 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： An immersion cooling apparatus includes a multi-terminal thermally conductive module (14) that supports and encloses a power semiconductor device (72, 74) and a housing (12) defining a flow-through chamber (26) in which the thermally conductive module (14) is mounted and through which liquid coolant is circulated. The thermally conductive module (14) has first and second oppositely disposed connector headers (38, 40) housing terminal pins or blades (50, 52) electrically coupled to the semiconductor device (72, 74), and the connector headers (38, 40) protrude through openings (19a, 20a) in oppositely disposed sidewalls (19, 20) of the housing (12) so that the portion (36) of the thermally conductive module (14) between the connector headers (38, 40) is suspended in the chamber (26) and immersed in the circulating coolant. The thermally conductive module (14) is sealed against the housing sidewalls (19, 20) around the openings (19a, 20a), and one of the sidewalls (20) is removable to facilitate installation of the thermally conductive module (14) in the housing (12) or its subsequent removal.
摘要翻译：一种浸入式冷却装置包括支撑和封闭功率半导体器件（72,74）的多端导热模块（14）和限定流通室（26）的壳体（12），其中导热模块 14）被安装并且液体冷却剂通过其循环。导热模块（14）具有第一和第二相对设置的连接器集管（38,40），其容纳电耦合到半导体器件（72,74）的端子引脚或刀片（50,52），并且连接器插头（38,40 ）突出穿过壳体（12）的相对设置的侧壁（19,20）中的开口（19a，20a），使得连接器集管（38,40）之间的导热模块（14）的部分（36）被悬挂在室（26）中并浸没在循环冷却剂中。导热模块（14）围绕开口（19a，20a）密封抵靠壳体侧壁（19,20），并且其中一个侧壁（20）是可拆卸的，以便于将导热模块（14）安装在房屋（12）或其后拆除。

46. 发明公开

EP1748688A3 Electronic package and method of cooling electronics 审中-公开
标题翻译：电子封装和冷却电子的方法
公开(公告)号：EP1748688A3
公开(公告)日：2009-06-03
申请号：EP06076287.9
申请日：2006-06-23
申请人： Delphi Technologies, Inc.
发明人： Berlin, Carl W. , Chengalva, Suresh K. , Brandenburg, Scott D. , Myers, Bruce A.
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L23/44 , H01L2224/16225 , H01L2224/48091 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K7/20236 , H05K7/20909 , H01L2924/00014 , H01L2924/00
摘要： An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.

47. 发明授权

EP0298372B1 Semiconductor cooling apparatus 失效
标题翻译：半导体冷却装置
公开(公告)号：EP0298372B1
公开(公告)日：1993-01-13
申请号：EP88110467.3
申请日：1988-06-30
申请人： HITACHI, LTD.
发明人： Ohashi, Shigeo , Kuwabara, Heikichi , Nakajima, Tadakatsu , Nakayama, Wataru , Sato, Motohiro , Kasai, Kenichi
IPC分类号： H01L23/42 , H05K7/20
CPC分类号： H01L23/427 , H01L23/44 , H01L2924/0002 , H01L2924/00

48. 发明公开

EP0298372A3 Semiconductor cooling apparatus 失效
标题翻译：半导体冷却装置及其冷却方法
公开(公告)号：EP0298372A3
公开(公告)日：1989-03-08
申请号：EP88110467.3
申请日：1988-06-30
申请人： HITACHI, LTD.
发明人： Ohashi, Shigeo , Kuwabara, Heikichi , Nakajima, Tadakatsu , Nakayama, Wataru , Sato, Motohiro , Kasai, Kenichi
IPC分类号： H01L23/42 , H05K7/20
CPC分类号： H01L23/427 , H01L23/44 , H01L2924/0002 , H01L2924/00
摘要： High heat generation member (1) of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member (1) and is condensed by a condenser (5) which is provided in an upper portion of a container (2). A refrigerant steam flow path (4) and a condensed refrigerant flow path (6) from the condenser (5) are separated with a partition wall (7). The condensed liquid (3) sent back to the partition wall (7) is supplied to the heat generation member (1) through the partition wall (7).

49. 发明公开

EP0298372A2 Semiconductor cooling apparatus 失效
标题翻译： Halbleiter-Kühlungsapparat。
公开(公告)号：EP0298372A2
公开(公告)日：1989-01-11
申请号：EP88110467.3
申请日：1988-06-30
申请人： HITACHI, LTD.
发明人： Ohashi, Shigeo , Kuwabara, Heikichi , Nakajima, Tadakatsu , Nakayama, Wataru , Sato, Motohiro , Kasai, Kenichi
IPC分类号： H01L23/42 , H05K7/20
CPC分类号： H01L23/427 , H01L23/44 , H01L2924/0002 , H01L2924/00
摘要： High heat generation member (1) of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member (1) and is condensed by a condenser (5) which is provided in an upper portion of a container (2). A refrigerant steam flow path (4) and a condensed refrigerant flow path (6) from the condenser (5) are separated with a partition wall (7). The condensed liquid (3) sent back to the partition wall (7) is supplied to the heat generation member (1) through the partition wall (7).
摘要翻译：电子集成电路等的高发热体（1）被煮沸冷却。制冷剂蒸汽是通过冷却发热件（1）而产生的，并由设置在容器（2）的上部的冷凝器（5）冷凝。来自冷凝器（5）的制冷剂蒸汽流路（4）和冷凝的制冷剂流路（6）被分隔壁（7）分离。送回分隔壁（7）的冷凝液（3）通过分隔壁（7）供给到发热体（1）。

50. 发明公开

EP0061518A1 Wärmeableitungsvorrichtung für gehäuselos montierte elektronische Schaltungen 失效
标题翻译： Wärmeableitungsvorrichtungfürgehäuselosmontierte elektronische Schaltungen。
公开(公告)号：EP0061518A1
公开(公告)日：1982-10-06
申请号：EP81108376.5
申请日：1981-10-15
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： Hermann, Rudolf
IPC分类号： H01L23/36 , H01L23/44
CPC分类号： H01L23/44 , H01L23/3677 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/48091 , H01L2224/48465 , H01L2224/4903 , H01L2924/00014 , H01L2924/01005 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： Die Erfindung bezieht sich auf eine Wärmeableitungsvorrichtung für gehäuselos montierte elektronische Schaltungen mit hoher Verlustleistungsdichte für gasförmige oder flüssige Kühlmedien. Zur Erhöhung der Leistungsfähigkeit von elektronischen Einbausystemen werden auf Epoxid-Leiterplatten großintegrierte Bausteine in geringem Abstand gehäuselos montiert. Dabei soll die auftretende Verlustleistungswärme wirksam abgeführt werden. Die Erfindung sieht hierzu eine gut wärmeleitende Trägerplatte 1 vor, die auf der einen Seite zur Aufnahme von einem oder mehreren integrierten Schaltkreisen 2 dient und auf der anderen Seite mit einzeln angeordneten gut wärmeleitenden Stiften 3 versehen ist, die durch entsprechende Bohrungen 4 der Leiterplatte 5 hindurchgesteckt werden können und auf der Bauteile abgewandten Leiterplattenseite in das Kühlmedium, das flüssig luft- oder gasförmig sein kann, hineinragen. Dadurch erhält man extrem niedrige Chiptemperaturen.
摘要翻译：对于气态或液体冷却剂具有高功率损耗密度的散热装置。为了提高电子模块化包装系统的性能，将高度集成的部件安装在具有狭窄间距和无套管的环氧树脂导体板上。在这些条件下，功率损耗热应有效去除。为此，本发明提供一种具有良好热传导性的承载板1，其用于在一侧接收一个或多个集成电路2，并且在另一侧上设置有具有良好导热性的单独布置的销3，该销可以通过导体板5的匹配孔4推动，并且可以在远离部件的导体板侧突出可能是液体，大气或气体的冷却剂。这实现了极低的芯片温度。

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