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41. 发明公开

EP1195795A2 Vacuum apparatus and method 有权
标题翻译： Vakuumvorrichtung und -Verfahren
公开(公告)号：EP1195795A2
公开(公告)日：2002-04-10
申请号：EP01308428.0
申请日：2001-10-02
申请人： THE BOC GROUP, INC.
发明人： Ramsay, Bruce Gordon
IPC分类号： H01L21/00
CPC分类号： H01L21/67751 , H01L21/67126 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67739 , H01L21/67757 , H01L21/67766 , H01L21/68707 , Y02A50/412 , Y10S414/139 , Y10S414/14 , Y10S414/141
摘要： A vacuum chamber used for processing articles, such as integrated circuit wafers, display panels, and the like, has a small load lock chamber formed at an opening in a wall of the chamber by a moveable article supporting surface within the chamber and a cover outside of the chamber. The supporting surface and cover are sealed to the chamber wall when urged against it. Articles placed into the load lock chamber, when the cover is opened, are moved into the vacuum chamber for processing by moving the supporting surface away from the wall after the cover has been closed and a vacuum established in the load lock chamber. Articles are removed from the vacuum chamber in a reverse manner. Various mechanisms are described for moving the articles, including a particular robotic device that simultaneously swaps the positions of two articles between the supporting surface and a processing location within the vacuum chamber by first pulling the articles together and then rotating them in a half-circle. Integrated circuit wafers are preferably carried on a domed surface formed of wedge shaped pieces fit together on a frame, where the wedge shaped pieces and their wafers are individually removable from the frame for transfer to another frame at a different location.
摘要翻译：用于处理诸如集成电路晶片，显示面板等的制品的真空室具有通过室内的可移动物品支撑表面形成在室的壁的开口处的小的负载锁定室，的房间。支撑表面和盖子在被推压时密封到室壁。当盖子被打开时，通过在盖子被关闭并且在装载锁定室中建立真空物之后将支撑表面从墙壁移开而将盖子打开时放置到装载锁定室中的物品移动到真空室中以进行处理。物品以相反的方式从真空室中取出。描述了用于移动物品的各种机构，包括特定的机器人装置，其通过首先将物品拉在一起，然后以半圆形的方式旋转，同时在支撑表面和真空室内的处理位置之间交换两个物品的位置。集成电路晶片优选地承载在由楔形块形成的圆顶表面上，所述楔形块在框架上装配在一起，其中楔形片和其晶片可从框架单独移除，以在不同位置转移到另一框架。

42. 发明公开

EP0880794A1 ION BEAM SHIELD FOR IMPLANTATION SYSTEMS 失效转让
标题翻译：用于植入系统的离子束屏蔽
公开(公告)号：EP0880794A1
公开(公告)日：1998-12-02
申请号：EP97906634.0
申请日：1997-02-14
申请人： Eaton Corporation
发明人： BLAKE, Julian, G.
IPC分类号： H01J27 , H01J37 , H01L21
CPC分类号： H01L21/67109 , H01J27/14 , H01J37/08 , H01J37/18 , H01J37/3002 , H01J37/3007 , H01J37/304 , H01J37/3171 , H01J2237/022 , H01J2237/083 , H01J2237/184 , H01J2237/2001 , H01J2237/2007 , H01J2237/20228 , H01J2237/204 , H01J2237/31701 , H01J2237/31705 , H01L21/67069 , H01L21/67739 , H01L21/67748 , H01L21/67751 , H01L21/67778 , H01L21/6838
摘要： An ion implantation system is described having an ion source (330) coupled to a process chamber (318), and a workpiece handling assembly (320) having a workpiece support (348) that is mounted within the process chamber. The system implants ions into a photoresists coated workpiece to change the conductivity of the workpiece. An ion beam shield (410) is provided that is positioned between the ion source and the workpiece support during processing to prevent outgassed photoresist from coating portions of the ion source.
摘要翻译：描述了离子注入系统，其具有耦合到处理室（318）的离子源（330）以及具有安装在处理室内的工件支撑件（348）的工件处理组件（320）。该系统将离子注入涂有光刻胶的工件中以改变工件的导电性。提供离子束屏蔽（410），其在处理期间定位在离子源与工件支撑件之间以防止离开光致抗蚀剂涂覆离子源的部分。

43. 发明公开

EP0880792A1 LOADLOCK ASSEMBLY FOR AN ION IMPLANTATION SYSTEM 失效
标题翻译：负载锁定DEVICE FOR A离子注入
公开(公告)号：EP0880792A1
公开(公告)日：1998-12-02
申请号：EP97906646.0
申请日：1997-02-14
申请人： Eaton Corporation
发明人： ROSE, Peter, John , BRAILOVE, Adam, A.
IPC分类号： C23C14 , H01J27 , H01J37 , H01L21
CPC分类号： H01L21/67109 , H01J27/14 , H01J37/08 , H01J37/18 , H01J37/3002 , H01J37/3007 , H01J37/3171 , H01J2237/022 , H01J2237/083 , H01J2237/184 , H01J2237/2001 , H01J2237/2007 , H01J2237/20228 , H01J2237/204 , H01J2237/31701 , H01J2237/31705 , H01L21/67069 , H01L21/67201 , H01L21/67739 , H01L21/67748 , H01L21/67751 , H01L21/67778 , H01L21/6838
摘要： The present invention provides a loadlock assembly for a high throughput ion implantation system that rapidly and efficiently processes large quantities of workpieces, such as flat panel displays. The loadlock assembly (310) increases the throughput of the implantation system by continuously cycling workpieces through the process chamber (318), thus increasing the system's throughput. The loadlock assembly includes a plurality of loadlock stacking elements (354) that are axially positioned relative to each other to form a stacked array of loadlocks. Additionally, the loadlocks of the array are configured to nest with an adjacent loadlock to form a stackable and nestable loadlock assembly.

44. 发明公开

EP3138123A4 GAS CUSHION APPARATUS AND TECHNIQUES FOR SUBSTRATE COATING 有权
公开(公告)号：EP3138123A4
公开(公告)日：2018-01-17
申请号：EP15786568
申请日：2015-04-27
申请人： KATEEVA INC
发明人： KO ALEXANDER SOU-KANG , MAUCK JUSTIN , VRONSKY ELIYAHU , MADIGAN CONOR F , RABINOVICH EUGENE , HARJEE NAHID , BUCHNER CHRISTOPHER , LEWIS GREGORY
IPC分类号： H01L21/67 , H01L21/673 , H01L21/677 , H01L21/683
CPC分类号： B05D3/0254 , B05B15/06 , B05C13/00 , B05C15/00 , B05D3/065 , B41J3/407 , C23C14/00 , H01L21/4867 , H01L21/67017 , H01L21/6715 , H01L21/67161 , H01L21/67196 , H01L21/67207 , H01L21/67248 , H01L21/67259 , H01L21/67276 , H01L21/67739 , H01L21/67748 , H01L21/6776 , H01L21/67784 , H01L21/67787 , H01L21/6838 , H01L23/5328 , H01L51/00 , H01L2924/0002 , H05K3/0091 , H01L2924/00
摘要： A coating can be provided on a substrate. Fabrication of the coating can include forming a solid layer in a specified region of the substrate while supporting the substrate in a coating system using a gas cushion. For example, a liquid coating can be printed over the specified region while the substrate is supported by the gas cushion. The substrate can be held for a specified duration after the printing the patterned liquid. The substrate can be conveyed to a treatment zone while supported using the gas cushion. The liquid coating can be treated to provide the solid layer including continuing to support the substrate using the gas cushion.

45. 发明授权

EP2960932B1 SMALL PRODUCTION DEVICE AND PRODUCTION SYSTEM USING SAME 有权
标题翻译：小型生产装置和使用相同的生产系统
公开(公告)号：EP2960932B1
公开(公告)日：2017-08-30
申请号：EP14753798.9
申请日：2014-02-17
申请人： National Institute of Advanced Industrial Science and Technology
发明人： HARA, Shiro , MAEKAWA, Hitoshi , NAKANO, Shizuka
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67778 , H01L21/67155 , H01L21/67167 , H01L21/67276 , H01L21/67739 , H01L21/67745

46. 发明公开

EP2852469A4 SYSTEM ARCHITECTURE FOR VACUUM PROCESSING 有权
标题翻译：真空处理系统结构
公开(公告)号：EP2852469A4
公开(公告)日：2015-09-02
申请号：EP13780965
申请日：2013-04-26
申请人： INTEVAC INC , BLUCK TERRY , SHAH VINAY , RIPOSAN ALEX
发明人： BLUCK TERRY , SHAH VINAY , RIPOSAN ALEX
IPC分类号： C23C14/04 , H01L21/673 , H01L21/677 , H01L31/18
CPC分类号： H01L21/67709 , H01L21/67173 , H01L21/67736 , H01L21/67739 , H01L21/67754 , H01L21/67769 , H01L21/67775 , H01L21/67778 , H01L21/67781 , H01L21/68742 , H01L21/68785
摘要： A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

47. 发明公开

EP2862956A1 Roller device for vacuum deposition arrangement, vacuum deposition arrangement with roller and method for operating a roller 有权
标题翻译：辊真空蒸镀装置的安排，用于操作一个辊的辊和方法真空沉积组件
公开(公告)号：EP2862956A1
公开(公告)日：2015-04-22
申请号：EP13189388.5
申请日：2013-10-18
申请人： Applied Materials, Inc.
发明人： Sauer, Andreas , Henrich, Jürgen , Deppisch, Thomas , Wagner, Dirk
IPC分类号： C23C16/46 , C23C16/48 , C23C16/54
CPC分类号： B05D1/60 , B05C1/003 , C23C16/46 , C23C16/481 , C23C16/54 , H01L21/67739
摘要： A deposition arrangement (100; 600) for depositing a material on a substrate (110; 640) is described. The deposition arrangement includes a vacuum chamber (120); a roller device (200; 300; 400; 500; 604) within the vacuum chamber (120); and an electrical heating device (61; 220; 320; 420; 520) within the roller device (200; 300; 400; 500; 604), wherein the heating device comprises a first end (250) and a second end (260), and wherein the heating device is held at the first end and at the second end. Also, a method for heating a substrate in a vacuum deposition arrangement is described.
摘要翻译：一种沉积装置（100; 600），用于在基板上沉积材料（110; 640）进行说明。所述沉积装置包括真空室（120）; 的辊装置（200; 300; 400; 500; 604）的真空室中（120）; 和电加热装置（61; 520 220; 320; 420）的辊子装置内的（200; 300; 400; 500; 604）端，worin加热装置包括第一（250）和第二端（260）和worin加热装置是在所述第一端和在第二端保持。这样，描述了用于在真空沉积装置中加热基板的方法。

48. 发明公开

EP2698815A3 Method and apparatus for plasma dicing a semi-conductor wafer 审中-公开
标题翻译：用于等离子体切割半导体晶片的方法和设备
公开(公告)号：EP2698815A3
公开(公告)日：2014-06-25
申请号：EP13188083.3
申请日：2012-03-12
申请人： Plasma-Therm, LLC
发明人： Johnson, Chris , Johnson, David , Martinez, Linnell , Pays-Volard, David , Westerman, Russell , Gordon, Grivna
IPC分类号： H01L21/3065 , H01L21/683 , H01L21/687 , H01L21/67 , H01L21/78 , H01J37/32
CPC分类号： H01L21/78 , H01J37/321 , H01J37/32155 , H01J37/32422 , H01J37/32623 , H01J37/32642 , H01J37/32651 , H01J37/32724 , H01L21/3065 , H01L21/30655 , H01L21/31116 , H01L21/67011 , H01L21/67069 , H01L21/67739 , H01L21/68 , H01L21/6831 , H01L21/6833 , H01L21/68735 , H01L21/68742 , H01L21/782 , H01L2221/68327 , Y10S414/139
摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
摘要翻译：本发明提供了一种用于等离子体切割衬底的方法。该方法包括提供具有壁的处理室; 提供与处理室的壁相邻的等离子体源; 在处理室内提供工件支撑件; 将衬底放置在框架上的支撑膜上以形成工件工件; 将工件装载到工件支撑件上; 提供设置在工件上方的盖环; 通过等离子体源产生等离子体; 并通过产生的等离子体蚀刻工件。

49. 发明授权

EP2336389B1 A showerhead assembly for vacuum processing apparatus 有权转让
标题翻译：为真空处理装置的喷头组件
公开(公告)号：EP2336389B1
公开(公告)日：2014-05-21
申请号：EP10194536.8
申请日：2010-12-10
申请人： Orbotech LT Solar, LLC
发明人： Blonigan, Wendell Thomas , Renta, Michael Allen
IPC分类号： C23C16/455
CPC分类号： H01L21/67745 , C23C16/45565 , G06T7/0004 , H01J37/32733 , H01L21/67173 , H01L21/67739 , H01L21/67748 , H01L21/67754 , Y10T29/49948

50. 发明公开

EP2698812A2 Method and apparatus for plasma dicing a semi-conductor wafer 审中-公开
公开(公告)号：EP2698812A2
公开(公告)日：2014-02-19
申请号：EP13188079.1
申请日：2012-03-12
申请人： Plasma-Therm, LLC
发明人： Johnson, Chris , Johnson, David , Martinez, Linnell , Pays-Volard, David , Westerman, Russell
IPC分类号： H01L21/3065 , H01L21/683 , H01L21/687 , H01L21/67 , H01L21/78
CPC分类号： H01L21/78 , H01J37/321 , H01J37/32155 , H01J37/32422 , H01J37/32623 , H01J37/32642 , H01J37/32651 , H01J37/32724 , H01L21/3065 , H01L21/30655 , H01L21/31116 , H01L21/67011 , H01L21/67069 , H01L21/67739 , H01L21/68 , H01L21/6831 , H01L21/6833 , H01L21/68735 , H01L21/68742 , H01L21/782 , H01L2221/68327 , Y10S414/139
摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

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