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41. 发明公开

EP1356897A1 Robot mechanism comprising two arms 有权转让
标题翻译：机械工程师
公开(公告)号：EP1356897A1
公开(公告)日：2003-10-29
申请号：EP03252615.4
申请日：2003-04-25
申请人： Teijin Seiki Co., Ltd.
发明人： Mori, Hiroki c/o Tsu Plant of Teijin Seiki Co.Ltd , Watanabe, Tetsuya Tsu Plant of Teijin Seiki Co.Ltd , Okuno, Chohei
IPC分类号： B25J9/10 , H01L21/00
CPC分类号： B25J9/1065 , H01L21/67739 , Y10S414/13 , Y10T74/20329
摘要： Herein disclosed is a robot arm mechanism comprising a first handling member 116 for supporting and handling a first object; a second handling member 117 for supporting and handling a second object; a first robot arm 110a including a first arm link 131 and a second arm link 142, the first end portion of the second arm link 142 being pivotably connected to the second end portion of the first arm link 131, and the second end portion of the second arm link 142 being connected to the first handling member 116 to allow the first handling member 116 to support the first object in a stable condition; a second robot arm 110b including a first arm link 132 and a second arm link 152, the first end portion of the second arm link 152 being pivotably connected to the second end portion of the first arm link 132, the second arm link 152 being inclined with respect to the second arm link 142 of the first robot arm 110a at a preset angle defined between the central line of the second arm link 152 of the second robot arm 110b and the central line of the second arm link 142 of the first robot arm 110a, and the second end portion of the second arm link 152 being connected to the second handling member 117 to allow the second handling member 117 to support the second object in a stable condition; a robot arm moving mechanism for allowing one of the first arm links 131 and 132 of the first and second robot arms 110a and 110b to be angularly moved with respect to the other of the first arm links 131 and 132 of the first and second robot arms 110a to 110b; and an angle keeping mechanism for keeping substantially fixed the preset angle defined between the central line of the second arm link 152 of the second robot arm 110b and the central line of the second arm link 142 of the first robot arm 110a as one of the first arm links 131 and 132 of the first and second robot arms 110a and 110b is angularly moved with respect to the other of the first arm links 131 and 132 of the first and second robot arms 110a and 110b.
摘要翻译：这里公开了一种机器人臂机构，包括用于支撑和处理第一物体的第一处理构件116; 用于支撑和处理第二物体的第二处理构件117; 包括第一臂连杆131和第二臂连杆142的第一机器人臂110a，第二臂连杆142的第一端部可枢转地连接到第一臂连杆131的第二端部，并且第二臂部第二臂连杆142连接到第一处理构件116，以允许第一处理构件116在稳定的状态下支撑第一物体; 包括第一臂连杆132和第二臂连杆152的第二机器人臂110b，第二臂连杆152的第一端部可枢转地连接到第一臂连杆132的第二端部，第二臂连杆152倾斜相对于第一机器人臂110a的第二臂连杆142以第二机器人臂110b的第二臂连杆152的中心线与第一机器人手臂的第二臂连杆142的中心线之间限定的预设角度并且第二臂连杆152的第二端部连接到第二处理构件117，以允许第二处理构件117在稳定的状态下支撑第二物体; 机器人臂移动机构，用于使第一和第二机器人臂110a和110b的第一臂连杆131和132中的一个相对于第一和第二机器人臂的第一臂连杆131和132中的另一个成角度地移动 110a至110b; 以及角度保持机构，用于将第二机器人臂110b的第二臂连杆152的中心线与第一机器人手臂110a的第二臂连杆142的中心线之间限定的预设角度基本固定为第一第一和第二机器人臂110a和110b的臂连杆131和132相对于第一和第二机器人臂110a和110b的第一臂连杆131和132中的另一个成角度地移动。

42. 发明授权

EP0516136B1 Semiconductor manufacturing apparatus 失效
标题翻译：半导体制造工厂
公开(公告)号：EP0516136B1
公开(公告)日：1996-03-13
申请号：EP92109073.4
申请日：1992-05-29
申请人： Tokyo Electron Kabushiki Kaisha
发明人： Kumagai, Hiromi
IPC分类号： H01L21/00
CPC分类号： H01L21/67069 , H01L21/67739 , H01L21/67742 , H01L21/67745 , H01L21/67751 , H01L21/67754 , Y10S414/137 , Y10S414/139 , Y10S414/14

43. 发明公开

EP0546011A1 METHOD AND APPARATUS FOR REDUCING WAFER CONTAMINATION 失效
标题翻译：方法和设备以减少晶片污染。
公开(公告)号：EP0546011A1
公开(公告)日：1993-06-16
申请号：EP91915417.0
申请日：1991-08-22
申请人： MATERIALS RESEARCH CORPORATION
发明人： HURWITT, Steven, D.
IPC分类号： B01J3 , C23C14 , H01L21
CPC分类号： H01L21/67017 , C23C14/564 , H01L21/67739
摘要： Une chambre (15) hermétiquement fermée telle qu'une chambre de traitement d'un appareil de traitement de substrats est actionnée à l'aide d'une plaque de guidage (30) espacée d'un substrat (20) supporté à l'intérieur de la chambre pour former un intervalle (31) qui recouvre la surface du substrat (28) à protéger contre la contamination par l'humidité (27a) se condensant dans la chambre pendant son évacuation rapide ou par des particules (27) ramassées par le gaz lors de l'écoulement turbulent entrant ou sortant de la chambre. Pendant l'évacuation de la chambre, soit par pompage soit par ventilation, du gaz sec et propre est introduit par un orifice (35) ménagé au centre de la plaque de manière à s'écouler vers l'extérieur depuis le bord de l'intervalle à une pression suffisante pour déplacer ou empêcher les particules et le condensat d'humidité portés par le gaz à l'intérieur de la chambre d'entrer dans l'intervalle et de contaminer la surface du substrat à protéger. Pendant l'évacuation de la chambre, du gaz est introduit au travers de l'intervalle à un débit inférieur à celui du gaz d'évacuation. Pendant le remplissage de la chambre, au moins une partie du gaz propre de remplissage est introduit au travers de l'orifice ménagé dans la plaque à un débit suffisant pour empêcher les particules portées par le gaz d'entrer dans l'intervalle.

44. 发明授权

EP2491583B1 APPARATUS FOR PROCESSING CONTINUOUS LENGTHS OF FLEXIBLE FOIL 有权
标题翻译：用于处理柔性箔的连续长度的设备
公开(公告)号：EP2491583B1
公开(公告)日：2017-11-22
申请号：EP09765150.9
申请日：2009-10-19
申请人： M-Solv Ltd
发明人： RUMSBY, Philip Thomas
IPC分类号： H01L21/677 , B23K26/08 , B23K26/00
CPC分类号： H01L21/67739 , B23K26/0084 , B23K26/082 , B23K26/0846 , H01L31/18

45. 发明公开

EP3174089A1 SEMICONDUCTOR MANUFACTURING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR 有权
标题翻译：半导体制造装置以及制造半导体的方法
公开(公告)号：EP3174089A1
公开(公告)日：2017-05-31
申请号：EP15824999.5
申请日：2015-07-08
申请人： Sumitomo Chemical Company Limited
发明人： FUJIKURA Hajime , KONNO Taichiro , NONAKA Takehiro , NUMATA Takayuki
IPC分类号： H01L21/677 , B65G49/07 , C23C16/44 , H01L21/205
CPC分类号： C23C16/46 , C23C16/44 , H01L21/205 , H01L21/67109 , H01L21/67115 , H01L21/67173 , H01L21/67706 , H01L21/67739 , H01L21/6776
摘要： Techniques are provided to improve the quality of the thin films deposited on substrates. A substrate transporting mechanism is configured to transport a plurality of substrates arranged in a line along a transport path extending in a first container from an entrance to an exit, and to load and unload substrates into and out of a second container in order. The driving units to drive the substrate transporting mechanism are configured to be detachable from the substrate transporting mechanism provided in the first container and are respectively provided in a substrate loading chamber and a substrate unloading chamber.
摘要翻译：提供技术来改善沉积在基底上的薄膜的质量。衬底传送机构被构造成沿着在第一容器中延伸的传送路径从入口到出口地布置成一条线的多个衬底传送，并且将衬底依次装入第二容器和从第二容器卸载。用于驱动基板输送机构的驱动单元被构造成可从设置在第一容器中的基板输送机构拆卸并且分别设置在基板装载室和基板卸载室中。

46. 发明公开

EP3138123A1 GAS CUSHION APPARATUS AND TECHNIQUES FOR SUBSTRATE COATING 有权
标题翻译： GASPOLSTERVORRICHTUNG UND TECHNIKEN ZUR SUBSTRATBESCHICHTUNG
公开(公告)号：EP3138123A1
公开(公告)日：2017-03-08
申请号：EP15786568.4
申请日：2015-04-27
申请人： Kateeva, Inc.
发明人： KO, Alexander Sou-Kang , MAUCK, Justin , VRONSKY, Eliyahu , MADIGAN, Conor F. , RABINOVICH, Eugene , HARJEE, Nahid , BUCHNER, Christopher , LEWIS, Gregory
IPC分类号： H01L21/67 , H01L21/673 , H01L21/677 , H01L21/683
CPC分类号： B05B15/60 , B05C13/00 , B05C15/00 , B05D3/0254 , B05D3/065 , B41J3/407 , C23C14/00 , H01L21/4867 , H01L21/67017 , H01L21/6715 , H01L21/67161 , H01L21/67196 , H01L21/67207 , H01L21/67248 , H01L21/67259 , H01L21/67276 , H01L21/67739 , H01L21/67748 , H01L21/6776 , H01L21/67784 , H01L21/67787 , H01L21/6838 , H01L23/5328 , H01L51/00 , H01L2924/0002 , H05K3/0091 , H01L2924/00
摘要： A coating can be provided on a substrate. Fabrication of the coating can include forming a solid layer in a specified region of the substrate while supporting the substrate in a coating system using a gas cushion. For example, a liquid coating can be printed over the specified region while the substrate is supported by the gas cushion. The substrate can be held for a specified duration after the printing the patterned liquid. The substrate can be conveyed to a treatment zone while supported using the gas cushion. The liquid coating can be treated to provide the solid layer including continuing to support the substrate using the gas cushion.
摘要翻译：可以在基板上设置涂层。涂层的制造可以包括在衬底的特定区域中形成固体层，同时使用气垫将衬底支撑在涂覆系统中。例如，当衬底被气垫支撑时，可以在指定区域上印刷液体涂层。在印刷图案化液体之后，可将基材保持一段指定的时间。衬底可以被运送到处理区，同时使用气垫支撑。可以处理液体涂层以提供固体层，包括使用气垫继续支撑基底。

47. 发明公开

EP2333814A3 Auto-sequencing multi-directional inline processing apparatus 有权转让
标题翻译：用自动测序多方向直列处理装置
公开(公告)号：EP2333814A3
公开(公告)日：2015-05-27
申请号：EP10194527.7
申请日：2010-12-10
申请人： Orbotech LT Solar, LLC
发明人： Blonigan, Wendell Thomas , Toshima, Masato , Law, Kam S. , Berkstresser, David Eric , Kleinke, Steve , Stevens, Craig Lyle
IPC分类号： H01L21/677 , H01L21/67 , H01J37/32 , C23C16/455
CPC分类号： H01L21/67745 , C23C16/45565 , G06T7/0004 , H01J37/32733 , H01L21/67173 , H01L21/67739 , H01L21/67748 , H01L21/67754 , Y10T29/49948
摘要： An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

48. 发明公开

EP2698816A2 Method and apparatus for plasma dicing a semi-conductor wafer 审中-公开
公开(公告)号：EP2698816A2
公开(公告)日：2014-02-19
申请号：EP13188085.8
申请日：2012-03-12
申请人： Plasma-Therm, LLC
发明人： Johnson, Chris , Johnson, David , Martinez, Linnell , Pays-Volard, David , Westerman, Russell
IPC分类号： H01L21/3065 , H01L21/683 , H01L21/687 , H01L21/67 , H01L21/78
CPC分类号： H01L21/78 , H01J37/321 , H01J37/32155 , H01J37/32422 , H01J37/32623 , H01J37/32642 , H01J37/32651 , H01J37/32724 , H01L21/3065 , H01L21/30655 , H01L21/31116 , H01L21/67011 , H01L21/67069 , H01L21/67739 , H01L21/68 , H01L21/6831 , H01L21/6833 , H01L21/68735 , H01L21/68742 , H01L21/782 , H01L2221/68327 , Y10S414/139
摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

50. 发明公开

EP1780784A3 Batch forming apparatus, substrate processing system, batch forming method, and storage medium 审中-公开
标题翻译：批次产生装置，基板处理系统，批次形成方法及存储介质
公开(公告)号：EP1780784A3
公开(公告)日：2011-07-06
申请号：EP06022531.5
申请日：2006-10-27
申请人： TOKYO ELECTRON LIMITED
发明人： Kamikawa, Yuji , Egashira, Koji
IPC分类号： H01L21/677
CPC分类号： H01L21/67739 , H01L21/67718 , H01L21/67763 , H01L21/67778 , H01L21/67781 , Y10S414/138
摘要： A batch forming apparatus forms a batch of substrates by combining a plurality of substrates that have been taken out from a plurality of carriers each containing therein the substrates in a stacked manner. The batch forming apparatus includes: a substrate transfer mechanism that takes out the substrates from each carrier and transfer the substrates; a substrate relative positional relationship changing mechanism that rearranges one or more substrates out of the substrates transferred by the substrate transfer mechanism one by one relative to other substrates to change positional relationships of the substrates relative to each other; and a batch forming mechanism that forms a batch of substrates out of the substrates that have been transferred thereto by the substrate transfer mechanism, with positional relationships of the substrates having been changed relative to each other by the substrate relative positional relationship changing mechanism. A substrate processing system includes such a batch forming apparatus, and a substrate processing apparatus that process the batch of substrates formed by the batch forming apparatus.

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