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41. 发明授权

EP0499197B1 Improved die tooling for metal working and method for its production 失效
标题翻译：用于金属加工和处理它的制备改进的压接工具
公开(公告)号：EP0499197B1
公开(公告)日：1997-03-26
申请号：EP92102234.9
申请日：1992-02-11
申请人： Hughes Aircraft Company
发明人： Matossian, Jesse N. , Wysocki, Joseph A. , Wilson, Robert G. , Yamagishi, Frederic G. , Ryntz, Edward F., Jr.
IPC分类号： C23C18/12 , C23C14/48 , C23C18/14 , B21J13/02 , B21D37/20 , C08J7/04
CPC分类号： C08J7/047 , B21D37/20 , B21J13/02 , C08J2363/00 , C08J2483/00 , C23C18/1204 , C23C18/1295

42. 发明公开

EP0704888A3 Circuit structure with non-migrating silver contacts 失效
标题翻译： Schaltungsstruktur mit migrationsfreien Silberkontakten
公开(公告)号：EP0704888A3
公开(公告)日：1997-03-05
申请号：EP95114149.8
申请日：1995-09-08
申请人： Hughes Aircraft Company
发明人： Wen, Cheng P. , Wong, Wah S. , Chiang, Min-Wen
IPC分类号： H01L21/48 , H01L21/60
CPC分类号： H01L24/10 , H01L23/49816 , H01L23/49866 , H01L23/66 , H01L24/13 , H01L2224/05144 , H01L2224/05666 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/81191 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12032 , H01L2924/14 , H01L2924/1423 , H01L2924/00 , H01L2924/00014
摘要： An integrated circuit assembly that prevents silver migration by providing conductive rims around oxidizable silver contacts that contact a substrate. Typically the silver contacts are supported by respective metal pads on the substrate with a contact potential existing at each contact-pad junction. In many applications an electrical circuit transmits electrical signals via the contacts to produce potential differences between the contacts and create electrical fields at their surfaces. The conductive rims have a work function that is sufficiently small to reduce the electric fields and contact potentials so as to inhibit the ionization of the oxidized contacts' surfaces and prevent silver migration across the metal pads and the substrate.
摘要翻译：一种集成电路组件，其通过在可接触基板的可氧化银触点周围提供导电边缘来防止银迁移。通常，银触点由衬底上的相应金属焊盘支撑，其中每个触点焊点处存在接触电位。在许多应用中，电路经由触点传输电信号，以产生触点之间的电位差，并在其表面产生电场。导电边缘具有足够小的功函数以减小电场和接触电位，从而抑制氧化的接触表面的电离，并防止银迁移穿过金属焊盘和衬底。

43. 发明授权

EP0598381B1 In-tank conductivity sensor 失效
标题翻译：箱内电导率传感器
公开(公告)号：EP0598381B1
公开(公告)日：1997-03-05
申请号：EP93118489.9
申请日：1993-11-16
申请人： Hughes Aircraft Company
发明人： Reddy, Vilambi NRK, c/o R. Radha Krishnan , Eliash, Bruce M. , Ludwig, Frank , Phan, Nguyet H.
IPC分类号： G01N27/07 , G01R27/22
CPC分类号： G01N27/07 , G01R27/22

44. 发明授权

EP0621474B1 Chemically sensitive fiber optic cable 失效
标题翻译：化学敏感光缆
公开(公告)号：EP0621474B1
公开(公告)日：1997-02-05
申请号：EP94106008.9
申请日：1994-04-18
申请人： Hughes Aircraft Company
发明人： Ravetti, Robert G. , Dougherty, Thomas K.
IPC分类号： G01N21/77
CPC分类号： G02B6/02033 , G01N21/7703 , G01N21/80 , G01N21/8507 , G01N2021/758 , G02B6/14 , G02B6/4457

45. 发明授权

EP0532926B1 Electrical circuit with resilient gasket support for raised connection features 失效
标题翻译：用弹性密封环电电路，用于增加接触的连接
公开(公告)号：EP0532926B1
公开(公告)日：1997-01-22
申请号：EP92114178.4
申请日：1992-08-20
申请人： Hughes Aircraft Company
发明人： Betz, Robert K. , Woith, Blake F.
IPC分类号： G01R1/073 , G01R31/28
CPC分类号： G01R1/0735

46. 发明授权

EP0651404B1 Internal cooling of electric automobile charging transformer 失效
标题翻译：电动车辆的内部冷却系统适于充电的变压器
公开(公告)号：EP0651404B1
公开(公告)日：1997-01-02
申请号：EP94117148.0
申请日：1994-10-29
申请人： Hughes Aircraft Company
发明人： Quon, William , Tanzer, Herbert J.
IPC分类号： H01F38/00 , H01F38/14 , H02J7/00
CPC分类号： H02J7/0042 , B60L11/182 , B60L2230/14 , H01F27/2876 , H01F38/14 , Y02T10/7005 , Y02T10/7088 , Y02T90/122 , Y02T90/14

47. 发明授权

EP0583736B1 Plasma-enhanced magnetron-sputtered deposition of materials 失效
标题翻译：由等离子体所支持磁控溅射装置材料的沉淀
公开(公告)号：EP0583736B1
公开(公告)日：1996-12-18
申请号：EP93112909.2
申请日：1993-08-12
申请人： Hughes Aircraft Company
发明人： Nieh, Simon K. , Matossian, Jesse N. , Krajenbrink, Frans G.
IPC分类号： C23C14/00 , C23C14/32 , C23C14/34 , C23C14/35 , C23C14/42 , H01J37/32 , H01J37/34
CPC分类号： H01J37/32706 , C23C14/0036 , C23C14/32 , C23C14/355 , H01J37/3405

48. 发明授权

EP0337338B1 Method for displaying intervisibility data 失效
标题翻译：一种用于显示可视数据的方法
公开(公告)号：EP0337338B1
公开(公告)日：1996-12-18
申请号：EP89106258.0
申请日：1989-04-08
申请人： Hughes Aircraft Company
发明人： Huss, Ronald E. , Denlinger, Robert M.
IPC分类号： G06T15/20
CPC分类号： G09B9/301 , G06T15/20

49. 发明公开

EP0742146A1 Mechanism for mounting and actuating a momentum wheel with high vibration isolation 失效
标题翻译：用于安装和用于具有高振动隔离的一飞轮的致动的装置
公开(公告)号：EP0742146A1
公开(公告)日：1996-11-13
申请号：EP95303193.7
申请日：1995-05-11
申请人： Hughes Aircraft Company
发明人： Harrell, John P.
IPC分类号： B64G1/28 , G01C19/16
CPC分类号： G01C19/16 , B64G1/281 , B64G1/285
摘要： An apparatus for mounting a momentum wheel assembly (10) to a spacecraft (54). The momentum wheel assembly (10) includes a momentum wheel which has a primary spin axis coinciding with the primary spin axis of the spacecraft and spins in a direction opposite that of the spacecraft (54). Suspension isolation struts (20) attach the momentum wheel assembly (10) to the spacecraft (54) and provide substantial vibration isolation between the spacecraft (54) and the momentum wheel assembly (10). Voice coil actuators (40) attach to an adaptor ring (14) which in turn attaches to the spacecraft (54). The voice coil actuators (40) magnetically interact with a magnetically conductive element (42) attached to the momentum wheel assembly case (12). Interaction between the voice coil actuators (40) and the magnetic element (42) provides forces which displace the momentum wheel assembly case (12) in two axes orthogonal to the primary spin axis.
摘要翻译：对于动量轮组件（10）安装到航天器（54）的装置。动量轮组件（10）包括一个动量轮其中有一个主旋轴与航天器的主旋轴线重合和旋转在相反的方向上做了航天器（54）的。悬浮液隔离支柱（20）的动量轮组件（10）连接到航天器（54），并提供太空船（54）和动量轮组件（10）之间的显着的振动隔离。音圈致动器（40）附连到适配环（14），其依次附连到航天器（54）。音圈致动器（40）磁性地附连到动量轮组件壳体（12）导磁元件（42）相互作用。音圈致动器（40）和所述磁性元件（42）之间的相互作用提供力，其在移位两个正交轴到主自旋轴的动量轮组件壳体（12）。

50. 发明公开

EP0647828A3 Cofocal optical systems for thickness measurements of patterned wafers 有权转让
标题翻译： Optisches KonfokalsystemfürDickenmessungen a einer Halbleiterscheibe mit einem Muster。
公开(公告)号：EP0647828A3
公开(公告)日：1996-11-13
申请号：EP94307402.1
申请日：1994-10-10
申请人： Hughes Aircraft Company
发明人： Ledger, Anthony M.
IPC分类号： G01B11/06
CPC分类号： G03F7/70483 , G01B11/06
摘要： An optical system (10) for providing low and high resolution images of a patterned wafer (11) to provide for film thickness measurements thereof. The optical system (10) comprises a spectrally filtered light source (18) for providing light to illuminate the wafer (11). A low resolution imaging system (34) is provided for imaging the wafer (11) at a relatively low resolution. A high resolution imaging system (37) is provided for imaging a subarea of the wafer (11) at a relatively high resolution to create an enlarged image in the same object plane as the wafer (11). An image producing system (35) is provided for producing a visual image of the wafer (11) derived from the low and high resolution images. The high resolution imaging system (37) uses subaperture optical elements, comprising either a small scanning lens or a sparse array of lenses, to image small areas of the wafer (11) at higher resolution, and the subaperture optical elements (37) create an enlarged image in the same object plane as the actual wafer (11). Both areas are then imaged onto the image producing system (35) such as a CCD array (35) of a CCD camera (35a), by the low resolution imaging system (34) (a lens or reflector) to provide a common or cofocal feature of the present invention. This arrangement avoids frequent refocussing to make thickness measurements on different parts of the wafer (11). The present invention allows the determination of thin film thicknesses of patterned wafers (11), planar wafers (11), and silicon-on-insulator (SOI) wafers (11), even though the spatial frequencies of the patterns are radically different in all these cases. The present invention provides the ability to make thickness maps of magnified regions within a semiconductor chip as well as test pads located in scribe alleys thereon. The use of high resolution multispectral subimages significantly increases the speed at which thickness maps of these patterned regions are generated. The invention may also be used to measure the that also allows determination of position and orientation of the wafer (11) since the wafer edges are in focus.
摘要翻译：一种用于提供图形化晶片（11）的低分辨率图像以提供其薄膜厚度测量的光学系统（10）。光学系统（10）包括用于提供光以照亮晶片（11）的经光谱滤波的光源（18）。提供了一种低分辨率成像系统（34），用于以相对低的分辨率对晶片（11）进行成像。提供了一种高分辨率成像系统（37），用于以相对高的分辨率对晶片（11）的子区域进行成像，以在与晶片（11）相同的物体平面中产生放大的图像。提供了一种图像产生系统（35），用于产生从低和高分辨率图像导出的晶片（11）的视觉图像。高分辨率成像系统（37）使用包括小扫描透镜或稀疏阵列的子孔径光学元件以较高分辨率对晶片（11）的小区域进行成像，并且子孔径光学元件（37）产生在与实际晶片（11）相同的物平面内的放大图像。然后将这两个区域通过低分辨率成像系统（34）（透镜或反射器）成像到诸如CCD相机（35a）的CCD阵列（35）的图像产生系统（35）上，以提供共同或共焦特征。这种布置避免了频繁地重新聚焦以在晶片（11）的不同部分上进行厚度测量。本发明允许确定图案化晶片（11），平面晶片（11）和绝缘体上硅（SOI）晶片（11）的薄膜厚度，即使图案的空间频率完全不同这些情况。本发明提供了制造半导体芯片内的放大区域的厚度图以及位于其上的划线槽中的测试焊盘的能力。使用高分辨率多光谱子图像显着地增加了这些图案化区域的厚度图产生的速度。本发明还可以用于测量由于晶片边缘被聚焦而允许确定晶片（11）的位置和取向。

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