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    • 33. 发明公开
    • Thin film formation method
    • Verfahren zur BildungdünnerSchichten
    • EP1172457A1
    • 2002-01-16
    • EP01116824.2
    • 2001-07-10
    • CANON KABUSHIKI KAISHA
    • Yajima, TakahiroKanai, MasahiroSugiyama, Shuichiro
    • C23C16/24C23C16/509H01L31/028
    • C23C16/509C23C16/24H01L31/202Y02E10/50Y02P70/521
    • In a discharge space, a substrate 201 and a cathode 206 are disposed a distance d (cm) apart from each other, and gas containing one or more silicon compounds and hydrogen are introduced into the discharge space, and a product Pd of a film forming pressure P (Pa) and d, and a hydrogen flow rate M (SLM) are set so as to meet a relation: 80M + 200 ≤ Pd ≤ 160M + 333,    and an RF power is applied to generate a plasma and a non-monocrystal silicon thin film is formed on the substrate 201 in the discharge space. Thereby, there is provided a thin film formation method making it possible to form an amorphous silicon film in which both a uniform film forming rate of a film distribution facilitating an implementation of a large area and a high conversion efficiency can be obtained while achieving an increase in the film forming rate.
    • 在放电空间中,衬底201和阴极206彼此间隔d(cm)设置,含有一个或多个硅化合物和氢的气体被引入到放电空间中,并且成膜的产物Pd 压力P(Pa)和d,氢气流量M(SLM)被设定为满足以下关系: 80M +200≤Pd≤160M+ 333,,并且将RF功率施加到 产生等离子体,并且在放电空间中的基板201上形成非单晶硅薄膜。 因此,提供了一种薄膜形成方法,使得可以形成非晶硅膜,其中可以获得均匀的薄膜分布成膜速率,从而实现大面积的实现和高转换效率,同时实现增加 在成膜率上。