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21. 发明公开

EP1348971A1 Senderseitige Zusatzschaltung für den Boundary Scan bei der Datenübertragung mit differentiellen Signalen 有权
标题翻译：发信人Zusatzschaltungfürden Boundary Scan bei derDatenübertragungmit differentiellen Signalen
公开(公告)号：EP1348971A1
公开(公告)日：2003-10-01
申请号：EP02007170.0
申请日：2002-03-28
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： König, Wilhelm , Parker, Heinz , Zettl, Gerhard
IPC分类号： G01R31/3185 , G01R31/316 , G01R31/04
CPC分类号： G01R31/31855 , G01R31/046
摘要： Senderseitige Zusatzschaltung (ZL,DC1,DC2,CC1) für den Boundary Scan bei Datenübertragung mit differentiellen Signalen.
Für integrierte Schaltkreise mit differentieller Signalübertragung wird eine Ausgangsschaltung (ZAT1,AT1,ZAT2) vorgeschlagen, die im Zuge eines Boundary Scan-Tests beim Empfangsschaltkreis eine Unterbrechung in einer oder in beiden Signalleitungen (L1,L2) eindeutig erkennbar macht.
摘要翻译：该电路检测到驱动器（AT1）连接到的差分信号导体的中断，从而可以以高阻抗方式切换驱动器，并提供两个输出驱动器（ZAT1,2），其输出可以连接到单独的差分信号源，并且每个可以以高阻抗方式切换。AN独立权利要求还包括以下内容：用于差分数据传输的输出电路，其具有到终止电位的线路连接。

22. 发明授权

EP0689854B1 Implant with indicating device 失效
标题翻译：植入物具有显示装置
公开(公告)号：EP0689854B1
公开(公告)日：2001-10-31
申请号：EP95850121.5
申请日：1995-06-27
申请人： St. Jude Medical AB
发明人： Fröberg, Paul , Franberg, Per , Högnelid, Kurt , Killander, Fredrik , Magnusson, Peter , Nyman, Per
IPC分类号： A61N1/08 , A61N1/372 , G01R31/04 , H01R13/703
CPC分类号： A61N1/3931 , A61N1/08 , A61N1/3752 , G01R31/046 , H01R12/7094 , H01R13/641

23. 发明授权

EP0571963B1 Method of connection testing electronic boards 失效
标题翻译：用于测试的电子卡的连接方法
公开(公告)号：EP0571963B1
公开(公告)日：1998-08-26
申请号：EP93108451.1
申请日：1993-05-25
申请人： SPEA S.r.l. Sistemi per l'Elettronica e l'Automazione
发明人： Bonaria, Luciano
IPC分类号： G01R31/04 , G01R31/316
CPC分类号： G01R31/046 , G01R31/2808

24. 发明公开

EP0653642A1 System for measuring the integrity of an electrical contact 失效
标题翻译： Vorrichtung zur Messung der Unversehrtheit eines elektrischen Kontakts。
公开(公告)号：EP0653642A1
公开(公告)日：1995-05-17
申请号：EP94112262.4
申请日：1994-08-05
申请人： Hewlett-Packard Company
发明人： Crook, David T. , Keirn, Kevin W. , Cilingiroglu, Ugur
IPC分类号： G01R31/312 , G01R31/04 , H05K13/08
CPC分类号： G01R31/046 , G01R31/04 , G01R31/043 , G01R31/045 , G01R31/048 , G01R31/312
摘要： Disclosed is a system that determines whether pins (12) of electrical components (10) such as connectors, switches, and sockets are present and properly soldered to a printed circuit board (14). The system uses an oscillator (20) which supplies a signal, typically ten kiloHertz (10 kHz) at 0.2 volts, to the pin under test. A conductive electrode (30) is placed on top of the component. The electrode is connected to a current measuring device. Another pin of the component is connected (50) to a common signal return (22).
摘要翻译：公开了一种确定诸如连接器，开关和插座的电气部件（10）的引脚（12）是否存在并被适当地焊接到印刷电路板（14）的系统。该系统使用振荡器（20），该振荡器（20）将0.2V的通常为10千赫兹（10kHz）的信号提供给被测试的引脚。导电电极（30）放置在部件的顶部。电极连接到电流测量装置。该组件的另一个引脚连接（50）到一个公共信号返回（22）。

25. 发明公开

EP0571963A2 Method of connection testing electronic boards 失效
标题翻译： Verfahren zumPrüfender Verbindungen elektronischer Karten。
公开(公告)号：EP0571963A2
公开(公告)日：1993-12-01
申请号：EP93108451.1
申请日：1993-05-25
申请人： SPEA S.r.l. Sistemi per l'Elettronica e l'Automazione
发明人： Bonaria, Luciano
IPC分类号： G01R31/04 , G01R31/28
CPC分类号： G01R31/046 , G01R31/2808
摘要： A method based on the observation that the clamping diodes (4, 8) between pins (2, 3) having similar functional characteristics form multicollector structures, which, when biased, supply comparable collector currents in the event of correct connection. The method therefore comprises stages consisting in grouping (30) the clamping diodes (4, 8) according to function or structure; biasing (32) the resulting multiterminal structures (10) so as to produce currents (I Ci ); measuring (33) the currents; comparing (35, 36) the measured currents; and detecting (36, 37) faulty connections on the basis of marked variations in the currents.
摘要翻译：基于以下观察的方法：具有相似功能特性的引脚（2,3）之间的钳位二极管（4,8）形成多集电极结构，当偏置时，在正确连接的情况下提供可比集电极电流。因此，该方法包括根据功能或结构将钳位二极管（4,8）分组（30）的阶段; 偏置（32）所得的多端结构（10）以产生电流（ICi）; 测量（33）电流; 比较（35,36）测量电流; 并根据电流的显着变化检测（36,37）故障连接。

26. 发明公开

EP0301084A4 APPARATUS AND METHOD FOR TESTING CONTACT INTERRUPTIONS OF CIRCUIT INTERCONNECTION DEVICES. 失效
标题翻译：设备和器件切换连接之间的检测联系中断。
公开(公告)号：EP0301084A4
公开(公告)日：1989-06-13
申请号：EP88902312
申请日：1988-02-10
申请人： DIGITAL EQUIPMENT CORP
发明人： WISSELL DANIEL
IPC分类号： G01R29/027 , G01R31/02 , G01R31/04 , G01M19/00 , G07C11/00
CPC分类号： G01R31/046 , G01R29/0273 , G01R31/026

27. 发明公开

EP2952918A1 OPTICAL NON-DESTRUCTIVE INSPECTION METHOD AND OPTICAL NON-DESTRUCTIVE INSPECTION APPARATUS 审中-公开
标题翻译：方法为光学破坏测试光破坏试验设备
公开(公告)号：EP2952918A1
公开(公告)日：2015-12-09
申请号：EP15170094.5
申请日：2015-06-01
申请人： JTEKT CORPORATION
发明人： Matsumoto, Naoki , Matsumoto, Jun , Yoshida, Kouya , Seo, Ryotaro
IPC分类号： G01R31/04 , G01R31/309
CPC分类号： G01J5/0896 , B23K1/0056 , G01J5/0806 , G01R31/046 , G01R31/309 , H05K3/306 , H05K3/325 , H05K2201/1059 , H05K2203/107 , H05K2203/1105 , H05K2203/162
摘要： An optical non-destructive inspection method includes: heating including setting a measurement spot (SP) on a surface of a workpiece and irradiating the measurement spot with heating laser light using a heating laser light source (21), heat ray detectors (31, 32), and a controller (50); acquiring a temperature rise property that is a temperature rise state of the measurement spot according to a heating time by detecting a heat ray radiated from the measurement spot to determine a temperature at the measurement spot; and determining whether or not a pressure contact state at pressure contact portions (91B, 92B), which include a contact area and a contact pressure, is appropriate based on the temperature rise property.
摘要翻译：光学非破坏检查方法，包括：加热包含工件的一个表面上设置一个测定点（SP），并使用加热激光器光源（21），热射线检测器（31照射测量光斑用加热用激光光，32 ），以及控制器（50）; 通过检测热射线获取的温度上升特性都在测量点gemäß到加热时间的温度上升状态从测定点到确定性矿辐射在所述测量点的温度; 和确定性采矿是否在压力接触部分（91B，92B），其中包括一个接触区域和接触压力，是适当的基础上，温度上升特性的压接状态。

28. 发明公开

EP2555006A3 Semiconductor device 有权转让
标题翻译：半导体器件
公开(公告)号：EP2555006A3
公开(公告)日：2014-12-10
申请号：EP12157652.4
申请日：2012-03-01
申请人： Samsung Display Co., Ltd.
发明人： Yeo, Dong-Hyun , Kim, Yong-Bum , Jeon, Byung-Kil , Jun, Bong-Ju
IPC分类号： G01R31/04
CPC分类号： G01R31/046 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A semiconductor device includes a circuit board including a ground portion, and a semiconductor package disposed on the circuit board. The semiconductor package includes an external connecting pad and an exposed pad. The exposed pad and the ground portion are electrically connected at a first surface of the exposed pad. A semiconductor chip is disposed on a second surface of the exposed pad and electrically connected to the external connecting pad. The first surface of the exposed pad is located external to the semiconductor package, and the second surface of the exposed pad is located within the semiconductor package. A test pad is disposed on the semiconductor chip and is electrically connected to the exposed pad.
摘要翻译：一种半导体器件包括：包括接地部分的电路板以及设置在电路板上的半导体封装。半导体封装包括外部连接焊盘和暴露的焊盘。暴露的焊盘和接地部分在暴露的焊盘的第一表面处电连接。半导体芯片设置在暴露焊盘的第二表面上并电连接到外部连接焊盘。暴露焊盘的第一表面位于半导体封装外部，并且暴露焊盘的第二表面位于半导体封装内。测试垫布置在半导体芯片上并且电连接到暴露的焊盘。

29. 发明公开

EP2491409A2 CAPACITIVE OPENS TESTING IN LOW SIGNAL ENVIRONMENTS 有权
标题翻译：测试电容开孔ON信号较弱ENVIRONMENTS
公开(公告)号：EP2491409A2
公开(公告)日：2012-08-29
申请号：EP10843363.2
申请日：2010-12-21
申请人： Teradyne, Inc.
发明人： SUTO, Anthony, J.
IPC分类号： G01R27/26
CPC分类号： G01R31/312 , G01R31/046
摘要： An improved system for capacitive testing electrical connections in a low signal environment. The system includes features that increase sensitivity of a capacitive probe. One feature is a spacer positioned to allow the probe to be partially inserted into the component without contacting the pins. The spacer may be a collar on the probe that contacts the housing of the component, contacts the substrate of the circuit assembly, or both. In some other embodiments, the spacer may be a riser extending beyond the surface of the sense plate that contacts the component, a riser portion of the component, or a combination of both. The spacer improves sensitivity by establishing a small gap between a sense plate of the probe and pins under test without risk of damage to the pins. A second feature is a guard plate of the probe with reduced capacitance to a sense plate of the probe. Reducing capacitance also increases the sensitivity of the probe.

30. 发明公开

EP2104863A1 A METHOD FOR DETERMINING THE CURRENT RETURN PATH INTEGRITY IN AN ELECTRIC DEVICE CONNECTED OR CONNECTABLE TO A FURTHER DEVICE 有权
标题翻译：程序是BACK确定当前WAY INTEGRITY IN的电设备具有连接另一设备或可连接
公开(公告)号：EP2104863A1
公开(公告)日：2009-09-30
申请号：EP07847223.0
申请日：2007-11-20
申请人： International Business Machines Corporation
发明人： FRECH, Roland , KLINK, Erich , SAALMÜLLER, Jürgen
IPC分类号： G01R31/28 , G01R31/02 , G01R31/3185 , H04B3/46 , H04M3/34
CPC分类号： G01R27/28 , G01R27/16 , G01R31/025 , G01R31/046 , G01R31/2839 , G01R31/31855 , H04B3/487
摘要： A method for determining current return path integrity in an electric device with a plurality of signal lines and supply lines. A library with at least one reference signal pattern of a near end crosstalk signal on a defined signal line arising from an input signal on another defined signal line is provided, a predetermined signal to a selected signal line of the electric device is applied, the near end crosstalk signal on at least one further signal line of the electric device is detected, said near end crosstalk signal is compared with the corresponding reference signal pattern from the library, and if there is a deviation between the near end crosstalk signal and the corresponding reference signal pattern, an information that there is any defect in the electric device is displayed.

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