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11. 发明授权

EP3156517B1 USE OF WATER SOLUBLE AND AIR STABLE PHOSPHAADAMANTANES AS STABILIZER IN ELECTROLYTES FOR ELECTROLESS METAL DEPOSITION 有权转让
公开(公告)号：EP3156517B1
公开(公告)日：2018-12-05
申请号：EP15189465.6
申请日：2015-10-13
申请人： MacDermid Enthone Inc.
发明人： SCHÄFER, Stefan , SÖNTGERATH, Katrin , KLEINFELD, Marlies
IPC分类号： C23C18/36 , C23C18/40 , C23C18/44 , C23C18/50
CPC分类号： C23C18/36 , C23C18/40 , C23C18/44 , C23C18/50
摘要： The present invention relates to the use of water soluble and air stable phosphaadamantanes as stabilizer in electrolytes for electroless metal deposition, an electrolyte as well as a method for the electroless deposition of metals, particularly layers of nickel, copper, cobalt, boron, silver, palladium or gold, as well as layers of alloys comprising at least one of the aforementioned metals as alloying metal. The present invention further relates to an organic stabilizer for electroless plating processes, and an electrolyte for the electroless deposition of a metal layer on a substrate, comprising a metal ion source for the metal to be deposited, a reducing agent, a complexing agent, a stabilizer and preferably an accelerator, as well as a method for the electroless deposition of a metal layer on a surface from an electrolyte according to the invention.

12. 发明公开

EP3380650A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM 有权
公开(公告)号：EP3380650A1
公开(公告)日：2018-10-03
申请号：EP16801787.9
申请日：2016-11-28
申请人： Atotech Deutschland GmbH
发明人： WALTER, Andreas , SUCHENTRUNK, Christof , BECK, Thomas , STEINBERGER, Gerhard , BERA, Holger , BRUNNER, Heiko , RÜCKBROD, Sven
IPC分类号： C23C18/44 , H01L21/288 , H05K3/24
摘要： The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and a cyanide group containing aromatic compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the cyanide group containing aromatic compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The cyanide group containing aromatic compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.

13. 发明公开

EP3334853A1 ELECTROLESS SILVER PLATING BATH AND METHOD OF USING THE SAME 审中-公开
公开(公告)号：EP3334853A1
公开(公告)日：2018-06-20
申请号：EP16837950.1
申请日：2016-08-22
申请人： MacDermid Acumen, Inc.
发明人： KOLOGE, Jordan , JIN, Lei , LONG, Ernest , KONEFAL, Alexander , YAN, Wei
IPC分类号： C23C18/44
CPC分类号： C23C18/32 , C23C18/1641 , C23C18/1844 , C23C18/44
摘要： An electroless silver plating bath and method of use is presented within. The electroless silver plating bath is designed to plate only on the desired metal substrate while preventing plating on areas other than those which are to be plated. The invention uses heavy metal based stabilizers in the electroless silver plating bath to prevent extraneous plating. The ability to control the amount of stabilizer present in the plating bath allows for elimination of extraneous plating and allows for a stable bath. The electroless silver plating bath is very stable and yet plates at an acceptable rate. The electroless silver plating bath prevents corrosion on the underlying metal that is plated on by using the stabilizers as described herein. The silver plating bath presented herein is useful for a wide variety of applications including those in electronic packaging, integrated circuits (IC) and in manufacturing of light emitting diodes (LEDs).

14. 发明授权

EP3144413B1 PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD 有权
标题翻译：镀金化学镀金组合物
公开(公告)号：EP3144413B1
公开(公告)日：2018-04-25
申请号：EP15186095.4
申请日：2015-09-21
申请人： Atotech Deutschland GmbH
发明人： Spreemann, Robert , Noethlich, Christian , Grunow, Sabrina , Voloshyn, Dmytro , Janssen, Boris Alexander , Lautan, Donny
IPC分类号： C23C18/44 , C23C18/18
CPC分类号： C23C18/44 , C23C18/1844
摘要： An electroless aqueous gold plating bath, comprising at least one source of gold ions and at least one reducing agent for gold ions, characterized in that it comprises at least one ethylenediamine derivative according to formula (I) wherein the residues R 1 and R 2 comprise 2 to 12 carbon atoms and are selected from the group consisting of branched alkyl, unbranched alkyl, cycloalkyl or combinations thereof wherein the individual residues R 1 and R 2 are the same or different as plating enhancer compound. The electroless aqueous gold plating bath is suitable to provide soft gold layers useful for wire bonding and soldering applications which are required for electronic components.

15. 发明公开

EP3234218A2 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM 审中-实审转让
标题翻译：镀钯组合物和钯化学镀方法
公开(公告)号：EP3234218A2
公开(公告)日：2017-10-25
申请号：EP15813381.9
申请日：2015-12-17
申请人： Atotech Deutschland GmbH
发明人： WALTER, Andreas , MUSKULUS, Katharina
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , C23C18/1651
摘要： The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aromatic compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aromatic compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aromatic compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.
摘要翻译：本发明涉及一种含水电镀液组合物和一种通过无电镀在衬底上沉积钯层的方法。本发明的水系镀浴组合物含有钯离子源，钯离子还原剂和芳香族化合物。含水电镀液组合物具有提高的钯沉积速率，同时保持浴稳定性。含水电镀液组合物也具有延长的使用寿命。本发明的芳族化合物允许在浴寿命期间将沉积速率调节到恒定的范围并且在较低的温度下无电沉积钯层。本发明的芳族化合物激活具有低沉积速率的无电镀钯浴并重新激活老化的无电镀钯浴。

16. 发明公开

EP3184667A1 MEANS FOR CARRYING OUT ELECTROLESS METAL DEPOSITION WITH ATOMIC SUB-MONOLAYER PRECISION 有权
标题翻译：用原子亚单层精度进行化学镀金属的方法
公开(公告)号：EP3184667A1
公开(公告)日：2017-06-28
申请号：EP15461588.4
申请日：2015-12-23
申请人： Uniwersytet Warszawski
发明人： JURCZAKOWSKI, Rafal , POLCZYNSKI, Piotr , JANUSZEWSKA, Aneta , LEWERA, Adam , SZABAT, Hubert
IPC分类号： C23C18/16 , C23C18/31 , C23C18/42 , C23C18/44
摘要： The present invention relates to a method of deposition of thin metal layers on different substrates by electroless chemical method. In the method of the invention, the potential of the plating solution, i.e. a solution from which the metal deposition is carried out, is controlled with a redox buffer. The appropriate plating solution is also disclosed.
摘要翻译：本发明涉及通过无电化学方法在不同衬底上沉积薄金属层的方法。在本发明的方法中，用氧化还原缓冲液控制电镀液，即进行金属沉积的溶液的电位。也公开了适当的电镀液。

17. 发明公开

EP2979781A4 CONDUCTIVE PARTICLES, METHOD FOR PRODUCING SAME, CONDUCTIVE RESIN COMPOSITION CONTAINING SAME, AND CONDUCTIVE COATED MATERIAL 有权
标题翻译：导电粒子，方法及其生产，导电性树脂组合和真导电材料覆盖
公开(公告)号：EP2979781A4
公开(公告)日：2016-12-07
申请号：EP14773168
申请日：2014-03-20
申请人： TOYO ALUMINIUM KK
发明人： NAKATANI TOSHIO , MINAMIYAMA HIDEAKI , KOIKE KAZUNORI
IPC分类号： B22F1/02 , B22F1/00 , B22F9/00 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/44 , H01B1/00 , H01B1/22 , H01B5/00 , H01B5/14 , H01B13/00
CPC分类号： H01B1/22 , B22F1/025 , C09D1/00 , C23C18/1635 , C23C18/1658 , C23C18/166 , C23C18/44 , C23C30/005 , C23F1/14
摘要： The present invention relates to conductive particles. The conductive particles contain core particles containing aluminum and a metal film covering the core particles, the metal film is higher in conductivity than the core particles, and a surface coverage of the core particles with the metal film is not lower than 80%.

18. 发明授权

EP2703451B1 SILVER COATING PIGMENT, AND METHOD FOR PRODUCING SAME 有权
标题翻译：银涂布颜料及其制造方法
公开(公告)号：EP2703451B1
公开(公告)日：2016-05-25
申请号：EP12776625.1
申请日：2012-04-12
申请人： Cqv Co., Ltd.
发明人： HEO, Dong-Min , JEONG, Jae-Il , KANG, Kwang-Choong , CHOI, Byung-Ki , LIM, Kwang-Soo , CHANG, Kil-Wan , LEE, Man-Su , JANG, Gun-Eik
IPC分类号： C09C1/62 , C09C3/00 , C23C18/16 , C03C17/06 , C09C1/40 , C09C1/00 , C09C1/24 , C09C1/30 , C23C18/18 , C23C18/44 , A61K8/25 , A61Q1/06 , A61K8/26 , A61K8/29 , A61Q1/10 , A61Q3/02 , A61K8/02 , A61K8/19
CPC分类号： C09C1/0078 , A61K8/0241 , A61K8/19 , A61K8/25 , A61K8/26 , A61K8/29 , A61K2800/43 , A61K2800/61 , A61Q1/06 , A61Q1/10 , A61Q3/02 , C01P2004/20 , C01P2006/62 , C01P2006/63 , C01P2006/64 , C09C1/24 , C09C1/30 , C09C1/405 , C09C1/407 , C23C18/1635 , C23C18/1893 , C23C18/44

19. 发明公开

EP3009529A1 PALLADIUM PLATE COATED MATERIAL AND PRODUCTION METHOD THEREFOR 有权
标题翻译：不锈钢材料
公开(公告)号：EP3009529A1
公开(公告)日：2016-04-20
申请号：EP14811652.8
申请日：2014-04-21
申请人： TOYO KOHAN CO., LTD.
发明人： MUKAI, Nobuaki
IPC分类号： C23C18/44 , C23C30/00
CPC分类号： C23C18/50 , C22C5/04 , C23C18/1633 , C23C18/1651 , C23C18/44 , C23C18/48 , C23C28/021
摘要： There is provided a palladium plate coated material (100) comprising: a base material (10); an underlying alloy layer (20) formed on the base material (10); and a palladium plated layer (30) formed on the underlying alloy layer (20). The palladium plate coated material (100) is characterized in that the underlying alloy layer (20) is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).
摘要翻译：提供一种钯板涂覆材料（100），包括：基材（10）; 形成在基材（10）上的下层合金层（20）。和形成在下面的合金层（20）上的镀钯层（30）。钯板涂覆材料（100）的特征在于，下面的合金层（20）由M1-M2-M3合金（其中M1是选自Ni，Fe，Co，Cu，Zn和Sn中的至少一种元素） M2是选自Pd，Re，Pt，Rh，Ag和Ru中的至少一种元素，M3是选自P和B中的至少一种元素）。

20. 发明授权

EP2010229B1 A SUBSTRATE HAVING AN ELECTRON DONATING SURFACE WITH METAL PARTICLES COMPRISING PALLADIUM ON SAID SURFACE 有权转让
标题翻译：具有电子捐赠侧基板，以钯含金属微粒在所述表面
公开(公告)号：EP2010229B1
公开(公告)日：2016-02-24
申请号：EP07748387.3
申请日：2007-04-05
申请人： Bactiguard AB
发明人： OHRLANDER, Mattias , SÖDERVALL, Billy
IPC分类号： A61L27/50 , A61L27/30 , A61L2/238 , A61L29/10 , A61L31/08 , C23C18/18 , C23C18/44 , C23C26/00 , C23C30/00 , A01N59/16 , B32B5/16 , B32B27/00 , C23C18/42
CPC分类号： A61L31/088 , A01N25/08 , A01N59/16 , A61K9/00 , A61K33/24 , A61K33/38 , A61L2/238 , A61L26/0004 , A61L27/30 , A61L27/306 , A61L27/50 , A61L29/10 , A61L29/106 , A61L31/022 , A61L31/024 , A61L31/026 , A61L31/042 , A61L31/048 , A61L31/06 , A61L31/08 , A61L33/0076 , A61L2400/18 , A61L2420/02 , B05D3/0254 , B32B5/16 , B32B5/30 , B32B9/005 , B32B15/16 , B32B27/00 , B32B27/14 , B32B27/16 , B32B2255/10 , B32B2255/205 , B32B2264/105 , B32B2307/7145 , B32B2307/73 , B32B2535/00 , C23C18/1635 , C23C18/1646 , C23C18/1689 , C23C18/18 , C23C18/42 , C23C18/44 , C23C26/00 , C23C30/00 , Y10T428/12569 , Y10T428/12875 , Y10T428/12896 , Y10T428/256 , Y10T428/27 , Y10T428/273 , Y10T428/29 , Y10T428/2991 , Y10T428/31667 , Y10T428/31678 , A01N25/10 , A01N25/34 , A01N2300/00
摘要： The invention relates to a substrate with an electron donating surface, having metal particles on its surface, the metal particles including palladium and at least one metal selected from gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of the metal particles is from about 0.001 to about 8 μg/cm2. A method of manufacturing the substrate including the steps a) depositing metal particles from a suspension of metal particles onto the substrate, b) rising and c) drying.

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