基本信息:
- 专利标题： PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD
- 专利标题（中）：镀金化学镀金组合物
- 申请号：EP15186095.4 申请日：2015-09-21
- 公开(公告)号：EP3144413B1 公开(公告)日：2018-04-25
- 发明人： Spreemann, Robert , Noethlich, Christian , Grunow, Sabrina , Voloshyn, Dmytro , Janssen, Boris Alexander , Lautan, Donny
- 申请人： Atotech Deutschland GmbH
- 申请人地址： Erasmusstraße 20 10553 Berlin DE
- 专利权人： Atotech Deutschland GmbH
- 当前专利权人： Atotech Deutschland GmbH
- 当前专利权人地址： Erasmusstraße 20 10553 Berlin DE
- 主分类号： C23C18/44
- IPC分类号： C23C18/44 ; C23C18/18
摘要：
An electroless aqueous gold plating bath, comprising at least one source of gold ions and at least one reducing agent for gold ions, characterized in that it comprises at least one ethylenediamine derivative according to formula (I) wherein the residues R 1 and R 2 comprise 2 to 12 carbon atoms and are selected from the group consisting of branched alkyl, unbranched alkyl, cycloalkyl or combinations thereof wherein the individual residues R 1 and R 2 are the same or different as plating enhancer compound. The electroless aqueous gold plating bath is suitable to provide soft gold layers useful for wire bonding and soldering applications which are required for electronic components.
公开/授权文献:
- EP3144413A1 PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD 公开/授权日：2017-03-22