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1. 发明公开

EP2806429A4 CONDUCTIVE FILLER OF FLAKE FORM 有权
标题翻译：导电填料薄片形式
公开(公告)号：EP2806429A4
公开(公告)日：2016-02-10
申请号：EP13738932
申请日：2013-01-10
申请人： TOYO ALUMINIUM KK
发明人： KOIKE KAZUNORI , FUJII MIKI , MINAMIYAMA HIDEAKI , MINAMI KAZUYA
IPC分类号： H01B5/00 , B22F1/00 , B22F1/02 , H01B1/00 , H01B1/22 , H01B13/00
CPC分类号： H01B1/02 , B02C17/00 , B02C23/06 , B22F1/0055 , B22F1/025 , C23C18/42 , H01B1/026 , H01B1/22 , H01B13/0006 , H01B13/0026

2. 发明公开

EP3096330A4 COMPOSITE CONDUCTIVE PARTICLES, CONDUCTIVE RESIN COMPOSITION CONTAINING SAME AND CONDUCTIVE COATED ARTICLE 有权
标题翻译： ZUSAMMENGESETZTELEITFÄHIGEPARTIKEL，LEITFÄHIGEHARZZUSAMMENSETZUNG DAMIT UNDLEITFÄHIGERBESCHICHTETER ARTIKEL
公开(公告)号：EP3096330A4
公开(公告)日：2017-06-28
申请号：EP15737430
申请日：2015-01-09
申请人： TOYO ALUMINIUM KK
发明人： MINAMI KAZUYA , MINAMIYAMA HIDEAKI , KOIKE KAZUNORI
IPC分类号： H01B5/00 , C08K9/02 , C09D5/24 , C09D7/12 , C09D133/08 , C09D201/00 , H01B1/00 , H01B1/02 , H01B1/22 , H01B5/14
CPC分类号： C09D5/24 , C08K9/02 , C09D7/1225 , C09D7/62 , C09D133/08 , C09D201/00 , H01B1/02 , H01B1/22
摘要： A composite conductive particle according to the present invention includes a first conductive particle having a particle diameter of greater than or equal to 0.1 µm and less than or equal to 50 µm; and a second conductive particle adhering to the surface of the first conductive particle and having a particle diameter of greater than or equal to 50 nm and less than or equal to 1000 nm, and the first conductive particle is composed of a first particle and a first metal coating covering the surface of the first particle, the second conductive particle is composed of a second particle and a second metal coating covering the surface of the second particle, a particle diameter of the first conductive particle is larger than a particle diameter of the second conductive particle, and an adhering rate of the second conductive particle to the first conductive particle is greater than or equal to 2% and less than or equal to 40%. As a result, it is possible to provide a composite conductive particle having high conductivity and high filling property.
摘要翻译：根据本发明的复合导电颗粒包括：具有大于或等于0.1μm且小于或等于50μm的粒径的第一导电颗粒; 以及第二导电粒子，其附着于所述第一导电粒子的表面，且具有50nm以上且1000nm以下的粒径，所述第一导电粒子由第一粒子和第一粒子构成覆盖第一颗粒表面的金属涂层，第二导电颗粒由第二颗粒和覆盖第二颗粒表面的第二金属涂层构成，第一导电颗粒的粒径大于第二颗粒的颗粒直径所述第二导电粒子相对于所述第一导电粒子的附着率为2％以上且40％以下。结果，可以提供具有高导电性和高填充性的复合导电颗粒。

3. 发明公开

EP2979781A4 CONDUCTIVE PARTICLES, METHOD FOR PRODUCING SAME, CONDUCTIVE RESIN COMPOSITION CONTAINING SAME, AND CONDUCTIVE COATED MATERIAL 有权
标题翻译：导电粒子，方法及其生产，导电性树脂组合和真导电材料覆盖
公开(公告)号：EP2979781A4
公开(公告)日：2016-12-07
申请号：EP14773168
申请日：2014-03-20
申请人： TOYO ALUMINIUM KK
发明人： NAKATANI TOSHIO , MINAMIYAMA HIDEAKI , KOIKE KAZUNORI
IPC分类号： B22F1/02 , B22F1/00 , B22F9/00 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/44 , H01B1/00 , H01B1/22 , H01B5/00 , H01B5/14 , H01B13/00
CPC分类号： H01B1/22 , B22F1/025 , C09D1/00 , C23C18/1635 , C23C18/1658 , C23C18/166 , C23C18/44 , C23C30/005 , C23F1/14
摘要： The present invention relates to conductive particles. The conductive particles contain core particles containing aluminum and a metal film covering the core particles, the metal film is higher in conductivity than the core particles, and a surface coverage of the core particles with the metal film is not lower than 80%.

4. 发明公开

EP2405449A4 ELECTRICALLY CONDUCTIVE PASTE COMPOSITION AND ELECTRICALLY CONDUCTIVE FILM FORMED BY USING THE SAME 失效
标题翻译：导电性糊剂组合物及电制品形导电膜
公开(公告)号：EP2405449A4
公开(公告)日：2013-10-30
申请号：EP10748492
申请日：2010-03-02
申请人： TOYO ALUMINIUM KK
发明人： LAI GAOCHAO , HASHIZUME YOSHIKI , KAWASHIMA KATSURA , KOIKE KAZUNORI
IPC分类号： H01B1/22 , H01B5/14 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L23/52 , H01L23/532 , H05K1/09
CPC分类号： H05K1/092 , H01B1/22 , H01L23/5328 , H01L2924/0002 , H01L2924/09701 , H05K2201/0245 , Y10T428/24355 , H01L2924/00

5. 发明公开

EP3076771A4 METHOD FOR PRODUCING CIRCUIT BOARD, AND CIRCUIT BOARD 失效
公开(公告)号：EP3076771A4
公开(公告)日：2017-10-25
申请号：EP14865961
申请日：2014-11-28
申请人： TOYO ALUMINIUM KK
发明人： TSUJI KOSUKE , KOIKE KAZUNORI , KAWASHIMA KATSURA , TSUCHIYA KENJU , IMAI SHINJI
IPC分类号： H05K3/06 , C23F1/20 , H05K1/03 , H05K1/09 , H05K3/38
CPC分类号： H05K3/067 , C23F1/20 , H05K1/0306 , H05K1/032 , H05K1/092 , H05K3/061 , H05K3/381 , H05K2201/017 , H05K2203/0384 , H05K2203/0502
摘要： The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste (4) containing aluminum particles onto the substrate, forming a conductor layer (5) on the substrate by firing the substrate to which the paste (4) has been applied, forming a resist film (6) having a specific pattern on the conductor layer (5), and removing with an etchant, the conductor layer (5) in a portion where the resist film (6) has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.

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