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131. 发明公开

EP2348551A2 LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER 审中-公开
标题翻译：白蛋白（LUCHTDIODENEINHEIT MITFLÜSSIGKRISTALLPOLYMER）
公开(公告)号：EP2348551A2
公开(公告)日：2011-07-27
申请号：EP09818024.3
申请日：2009-10-01
申请人： Samsung LED Co., Ltd.
发明人： KWAK, Chang-Hoon , PARK, Il-Woo , SOHN, John Rak , LEE, Hyo-Jin , PARK, Na-na , JOO, Seong-Ah
IPC分类号： H01L33/56
CPC分类号： H01L33/56 , H01L24/48 , H01L33/02 , H01L33/382 , H01L33/44 , H01L2224/48091 , H01L2224/48247 , H01L2224/85439 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01065 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01084 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A light emitting diode (LED) package using a liquid crystal polymer, includes: a package main body formed by using a liquid crystal polymer; a lead frame formed on the package main body; an LED chip mounted on the lead frame; and a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors. The LED package is highly reliable.
摘要翻译：使用液晶聚合物的发光二极管（LED）封装包括：通过使用液晶聚合物形成的封装主体; 形成在所述封装主体上的引线框架; 安装在引线框架上的LED芯片; 以及封装LED芯片的树脂封装单元，所述树脂封装单元包括磷光体。 LED封装非常可靠。

132. 发明公开

EP2262013A3 Nitride-based light emitting device and method of manufacturing the same 有权转让
标题翻译：一种半导体发光器件，包括氮化物化合物和它的制备方法
公开(公告)号：EP2262013A3
公开(公告)日：2011-06-15
申请号：EP10181626.2
申请日：2004-10-05
申请人： Samsung LED Co., Ltd. , Gwangju Institute of Science and Technology
发明人： Seong, Tae-yeon , Kim, Kyoung-kook , Song, June-o , Leem, Dong-seok
IPC分类号： H01L33/40 , H01L33/32
CPC分类号： H01L33/42 , H01L33/32 , H01L33/405 , H01L2933/0016
摘要： Provided are a nitride-based light emitting device and a method of manufacturing the same. The nitride-based light emitting device has a structure in which at least an n-cladding layer (130), an active layer (140), and a p-cladding layer (150) are sequentially formed on a substrate (110). The light emitting device further includes an ohmic contact layer (230) composed of a zinc (Zn)-containing oxide containing a p-type dopant formed on the p-cladding layer and a reflective layer (240) composed of at least one element from the group consisting of Ag, Al, Zn, Mg, Ru, Ti, Rh, Cr and Pt formed on the ohmic contact layer. The method of manufacturing the nitride-based light emitting device includes forming an ohmic contact layer composed of Zn-containing oxide containing a p-type dopant on the p-cladding layer, forming a reflective layer on the ohmic contact layer from at least one element from the group consisting of Ag, Al, Zn, Mg, Ru, Ti, Rh, Cr and Pt and annealing the resultant structure. The nitride-based light emitting device and manufacturing method provide excellent I-V characteristics by improving ohmic contact with a p-cladding layer while significantly enhancing light emission efficiency of the device due to high light reflectance of the reflective p-electrode.

133. 发明公开

EP2322963A1 Backlight Unit 有权转让
标题翻译：背光单元
公开(公告)号：EP2322963A1
公开(公告)日：2011-05-18
申请号：EP10172751.9
申请日：2010-08-13
申请人： Samsung LED Co., Ltd.
发明人： Kim, Geun Young , Park, Jong Jin , Lee, Jung Hun , Choi, Sun
IPC分类号： G02B6/00 , G02F1/13357
摘要： There is provided a backlight unit.
The backlight unit is configured to include: a plurality of light sources; a plurality of light guide plates being arranged alternately with the light sources so that light emitted from the light sources is incident; and a chassis receiving the light sources and the light guide plates, wherein the plurality of light guide plates are disposed to be spaced apart from each other, being symmetrical to each other in order to face the central region of the chassis, a pair of light guide plates opposed to each other on the central region being connected to each other so that the light therefrom is mixed.
摘要翻译：提供了背光单元。背光单元被配置为包括：多个光源; 多个导光板与光源交替布置，使得从光源发射的光入射; 以及底座，所述底座容纳所述光源和所述导光板，其中，所述多个导光板被布置为彼此间隔开，彼此对称以面对所述底架的中心区域，一对光在中央区域彼此相对的导向板彼此连接以使来自其的光混合。

134. 发明公开

EP2312658A2 A WAVELENGTH-CONVERTING LIGHT EMITTING DIODE (LED) CHIP AND LED DEVICE EQUIPPED WITH CHIP 有权转让
标题翻译：波长转换发光二极管（LED）芯片和晶片用装有LED布置
公开(公告)号：EP2312658A2
公开(公告)日：2011-04-20
申请号：EP09773757.1
申请日：2009-07-03
申请人： Samsung LED Co., Ltd.
发明人： KIM, Yong-Tae , LEE, Dong-Yeoul
IPC分类号： H01L33/50
CPC分类号： H01L33/504 , H01L33/502 , H01L33/505 , H01L33/508 , H01L33/54 , H01L33/56 , H01L33/58 , H01L2224/45139 , H01L2224/48091 , H01L2224/8592 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要： A wavelength-converted light emitting diode (LED) chip is provided. The wavelength-converted LED chip includes an LED chip and a wavelength-converted layer. The LED chip emits light in a predetermined wavelength region. The wavelength-converted layer is formed of a resin containing phosphor bodies of at least one kind which convert a portion of the light emitted from the LED chip into light in a different wavelength region. The wavelength-converted layer is formed on an upper surface of the LED chip, and has a convex meniscus-shaped upper surface.

135. 发明公开

EP2290033A1 Composite phosphor powder, light emitting device using the same and method for manufacturing composite phosphor powder 有权转让
标题翻译：复合磷光体粉末，使用其的发光器件和制造复合磷光体粉末的方法
公开(公告)号：EP2290033A1
公开(公告)日：2011-03-02
申请号：EP10075567.7
申请日：2006-08-22
申请人： Samsung LED Co., Ltd.
发明人： Yoon, Chulsoo , Yoon, Joon Ho , Kwak, Chang Hoon , Chung, Yun Seup
IPC分类号： C09K11/02 , C09K11/54 , H01L29/22
CPC分类号： C09K11/7721 , C09K11/584 , C09K11/7729 , H01L33/504 , H01L2224/48091 , Y02B20/181 , Y10T82/143 , H01L2924/00014
摘要： The invention provides a high quality composite phosphor powder which ensures diversity in emission spectrum, color reproduction index, color temperature and color, a light emitting device using the same and a method for manufacturing the composite phosphor powder. The composite phosphor powder comprises composite particles. Each of the composite particles includes at least two types of phosphor particles and a light transmitting binder. The phosphor particles have different emission spectrums. In addition, the light transmitting binder is formed between the phosphor particles and binds them together.
摘要翻译：本发明提供一种确保发射光谱，色彩再现指数，色温和颜色多样性的高质量复合荧光体粉末，使用其的发光装置以及制造该复合荧光体粉末的方法。该复合荧光粉包含复合颗粒。每个复合颗粒包括至少两种荧光体颗粒和透光粘合剂。磷光体颗粒具有不同的发射光谱。另外，透光粘合剂形成在荧光体颗粒之间并将它们结合在一起。

136. 发明公开

EP2479810A3 Light-emitting device package and method of manufacturing the same 有权
标题翻译：它们的一种发光器件封装及其制造方法
公开(公告)号：EP2479810A3
公开(公告)日：2012-11-07
申请号：EP12151738.7
申请日：2012-01-19
申请人： Samsung LED Co., Ltd.
发明人： Yoo, Cheol-jun , Song, Young-hee
IPC分类号： H01L33/48 , H01L33/54 , H01L33/62 , H01L33/64
CPC分类号： H01L33/486 , B29C45/14344 , B29C45/14655 , B29C45/14836 , H01L33/54 , H01L33/647 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/4826 , H01L2224/73215 , H01L2924/15311 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package (100) includes, for example, a wiring substrate (101) having an opening (102); a light-emitting device (104) that is disposed on the wiring substrate and covers the opening; a bonding wire (106) electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member (107) that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist (109) and a solder bump (110) formed on the bottom surface of the wiring substrate.

137. 发明公开

EP2515333A2 Light Emitting Device Module and Method of Manufacturing the Same 审中-公开
标题翻译： Lichtemittierendes Vorrichtungsmodul und Verfahren zu seiner Herstellung
公开(公告)号：EP2515333A2
公开(公告)日：2012-10-24
申请号：EP12162585.9
申请日：2012-03-30
申请人： Samsung LED Co., Ltd.
发明人： Kim, Hak Hwan , Moon, Kyung Mi , Paek, Ho Sun , Song, Young Hee
IPC分类号： H01L25/075 , H01L33/50 , H01L33/54
CPC分类号： H01L33/502 , H01L25/0753 , H01L27/15 , H01L33/50 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.
摘要翻译：提供了可应用于各种应用的发光器件（LED）模块及其制造方法。通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量可以提高价格竞争力。在制造LED模块的方法中，可以通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作来最小化和简化操作。可以通过使用金属材料作为基底和凸块来增强散热特性。

138. 发明公开

EP2506686A2 Illumination lighting apparatus and method of controlling illumination 审中-公开
标题翻译： Beleuchtungsvorrichtung und Verfahren zur Steuerung der Beleuchtung
公开(公告)号：EP2506686A2
公开(公告)日：2012-10-03
申请号：EP12162152.8
申请日：2012-03-29
申请人： Samsung LED Co., Ltd.
发明人： Jeon, Jong Hoon , Cha, Min Ho , Jin, Joong Hun
IPC分类号： H05B37/02
CPC分类号： H05B37/0227 , Y02B20/44
摘要： Provided are an illumination lighting apparatus (100) that provides various and intuitional light in response to a motion of a user, and an illumination controlling method. The illumination lighting apparatus (100) may include a lamp unit (110) including at least one light emitting part that is selectively turned on and off, a motion sensing unit (120) including at least one motion sensor (121, 122, 123), transmitting a sensed signal when the at least one motion sensor (121, 122, 123) senses a motion of a user, and enabling the lamp unit (110) to provide a light corresponding to the sensed signal, and a control unit to receive the sensed signal from the motion sensing unit (120) to adjust a light emitting type of the lamp unit (110) in a plurality of modes, and the motion sensing unit (120) may transmit, based on a mode of the control unit, different sensed signals to the control unit to change the light emitting type of the lamp unit (110).
摘要翻译：提供了一种照亮照明装置（100），其提供响应于用户的运动的各种和直观的光以及照明控制方法。照明照明装置（100）可以包括灯单元（110），其包括被选择性地导通和关闭的至少一个发光部分，运动感测单元（120）包括至少一个运动传感器（121,122,123）当所述至少一个运动传感器（121,122,123）感测到用户的运动并使所述灯单元（110）能够提供与所感测的信号相对应的光时，传送感测到的信号，以及控制单元，用于接收来自运动感测单元（120）的感测信号以多种模式调节灯单元（110）的发光类型，运动感测单元（120）可以基于控制单元的模式，将不同的感测信号传送到控制单元以改变灯单元（110）的发光类型。

139. 发明公开

EP2503609A2 Light emitting device package 审中-公开
标题翻译： VorrichtungGehäusemit lichtemittierender
公开(公告)号：EP2503609A2
公开(公告)日：2012-09-26
申请号：EP12160814.5
申请日：2012-03-22
申请人： Samsung LED Co., Ltd.
发明人： You, Jae Sung
IPC分类号： H01L33/60 , H01L33/48
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2933/0058 , H01L2924/00014
摘要： There is provided a light emitting device package (1), including at least one light emitting device (11); a lead frame (12) electrically connected to the light emitting device (11); a body part (10) supporting the light emitting device (11) and the lead frame (12) and including a cavity (13) opened so as to expose the light emitting device (11) and the lead frame (12); a reflecting part (20) fitted and fixed into the cavity (13) so as to surround the light emitting device (11); and a sealing part (30) filled in the reflecting part (20) and sealing the light emitting device (11).
摘要翻译：提供了包括至少一个发光器件（11）的发光器件封装（1）; 电连接到发光器件（11）的引线框架（12）; 支撑所述发光装置（11）和所述引线框架（12）的主体部分（10），并且包括敞开以暴露所述发光装置（11）和所述引线框架（12）的空腔（13）。安装并固定到所述空腔（13）中以围绕所述发光装置（11）的反射部分（20）; 以及填充在所述反射部（20）中并密封所述发光装置（11）的密封部（30）。

140. 发明授权

EP2262013B1 Method of manufacturing a gallium nitride-based light emitting diode 有权转让
标题翻译：一种用于生产基于氮化镓的发光二极管的过程
公开(公告)号：EP2262013B1
公开(公告)日：2012-09-19
申请号：EP10181626.2
申请日：2004-10-05
申请人： Samsung LED Co., Ltd. , Gwangju Institute of Science and Technology
发明人： Seong, Tae-yeon , Kim, Kyoung-kook , Song, June-o , Leem, Dong-seok
IPC分类号： H01L33/40 , H01L33/32
CPC分类号： H01L33/42 , H01L33/32 , H01L33/405 , H01L2933/0016

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