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101. 发明公开

EP2682962A8 CAPACITOR DEVICE 审中-公开
标题翻译：电容装置
公开(公告)号：EP2682962A8
公开(公告)日：2014-02-26
申请号：EP11860091.5
申请日：2011-03-01
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： ATSUMI, Takashi
IPC分类号： H01G4/224 , H01G2/04
CPC分类号： H01G4/08 , H01G2/04 , H01G2/106 , H01G4/01 , H01G11/10 , H01G11/74 , H01G11/78 , Y02E60/13 , Y02T10/7022
摘要： The present invention is a capacitor device comprising: one or a plurality of capacitor elements (10); a pair of electrode plates (16a, 16b) disposed and connected substantially in parallel to the capacitor element(s) (10); an insulating layer (18) formed between the pair of electrode plates (16a, 16b); an insulating adhesive layer (28) formed between the capacitor element(s)(10) and the pair of electrode plates (16a, 16b); a case body (12) for housing the capacitor element(s)(10) and the pair of electrode plates (16a, 16b); and a resin molding (14) that is filled into the case body (12) so as to cover peripheries of the capacitor element(s)(10) and the pair of electrode plates (16a, 16b). A capacitor device that can be made smaller and can achieve greater reductions in loss is provided.

102. 发明公开

EP2682962A1 CAPACITOR DEVICE 审中-公开
标题翻译：电容器装置
公开(公告)号：EP2682962A1
公开(公告)日：2014-01-08
申请号：EP11860091.5
申请日：2011-03-01
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： ATSUMI, Takashi
IPC分类号： H01G4/224 , H01G2/04
CPC分类号： H01G4/08 , H01G2/04 , H01G2/106 , H01G4/01 , H01G11/10 , H01G11/74 , H01G11/78 , Y02E60/13 , Y02T10/7022
摘要： The present invention is a capacitor device comprising: one or a plurality of capacitor elements (10); a pair of electrode plates (16a, 16b) disposed and connected substantially in parallel to the capacitor element(s) (10); an insulating layer (18) formed between the pair of electrode plates (16a, 16b); an insulating adhesive layer (28) formed between the capacitor element(s)(10) and the pair of electrode plates (16a, 16b); a case body (12) for housing the capacitor element(s)(10) and the pair of electrode plates (16a, 16b); and a resin molding (14) that is filled into the case body (12) so as to cover peripheries of the capacitor element(s)(10) and the pair of electrode plates (16a, 16b). A capacitor device that can be made smaller and can achieve greater reductions in loss is provided.
摘要翻译：本发明是一种电容器装置，包括：一个或多个电容器元件（10）; 一对电极板（16a，16b），与电容器元件（10）大致平行地配置并连接。形成在所述一对电极板（16a，16b）之间的绝缘层（18）; 在电容器元件10与一对电极板16a，16b之间形成的绝缘性粘接层28; 一个用于容纳电容器元件10和一对电极板16a，16b的壳体12; 以及填充到壳体（12）中以覆盖电容器元件（10）和一对电极板（16a，16b）的周边的树脂模制件（14）。提供了可以制造得更小并且可以实现更大损耗减小的电容器器件。

103. 发明公开

EP2418662A2 Stacked film capacitor and method of producing the same 审中-公开
标题翻译： Gestapelter Schichtkondensator和Verfahren zu dessen Herstellung
公开(公告)号：EP2418662A2
公开(公告)日：2012-02-15
申请号：EP11176452.8
申请日：2011-08-03
申请人： Kojima Press Industry Co., Ltd.
发明人： Ito, Kaoru , Noguchi, Masumi
IPC分类号： H01G4/224 , H01G4/30
CPC分类号： H01G4/30 , H01G4/224
摘要： A stacked film capacitor (10) including a resin protective film (28a,28b) having excellent durability is provided which can stably secure desired properties. The stacked film capacitor includes a capacitor element (12) including a plurality of dielectric layers (14,18a) and a plurality of vapor-deposited metal film layers (16a). Each dielectric layer and each vapor-deposited metal film layer (16a) are stacked with each other so as to be arranged alternately. The stacked film capacitor further includes a pair of external electrodes (26a,26b) provided on opposing side surfaces of the capacitor element (12), and at least one resin protective film (28a,28b) formed on at least one side surfaces other than the side surfaces on which the external electrodes are formed, in which the at least one resin protective film (28a,28b) is provided by deposition polymerization.
摘要翻译：提供了包括具有优异的耐久性的树脂保护膜（28a，28b）的叠层薄膜电容器（10），其可以稳定地确保期望的性能。堆叠薄膜电容器包括包括多个电介质层（14,18a）和多个气相沉积金属薄膜层（16a）的电容器元件（12）。每个电介质层和每个气相沉积的金属膜层（16a）彼此堆叠以交替布置。层叠薄膜电容器还包括设置在电容器元件（12）的相对侧面上的一对外部电极（26a，26b），以及至少一个树脂保护膜（28a，28b），其形成在除了其上形成有外部电极的侧表面，其中通过沉积聚合提供至少一个树脂保护膜（28a，28b）。

104. 发明公开

EP1895552A4 HIGHLY HEAT-RESISTANT STATIC DEVICE FOR ELECTRIC POWER 审中-公开
标题翻译：高耐热性静电装置用于电力
公开(公告)号：EP1895552A4
公开(公告)日：2011-06-22
申请号：EP06712074
申请日：2006-01-20
申请人： KANSAI ELECTRIC POWER CO
发明人： SUGAWARA YOSHITAKA
IPC分类号： H01G4/224 , C08G77/12 , C08G77/20 , C08L83/04 , H01F27/32 , H01F30/00 , H01G2/10 , H01G4/18 , H01G4/20
CPC分类号： H01G2/10 , C08G77/12 , C08G77/20 , C08L83/04 , C08L2205/03 , H01B7/292 , H01F27/327 , Y10T428/31544 , Y10T428/31721 , C08L83/00

105. 发明公开

EP1317759A1 LAMINATE PACKAGE FOR AN ENERGY STORAGE DEVICE 审中-公开
标题翻译：层压封装的能量储存元
公开(公告)号：EP1317759A1
公开(公告)日：2003-06-11
申请号：EP01951209.4
申请日：2001-07-10
申请人： Energy Storage Systems Pty, Ltd
发明人： PYNENBURG, Rory, Albert, James
IPC分类号： H01G9/10 , H01G4/224
CPC分类号： H01G9/08 , H01M2/0207 , H01M2/0275 , H01M2/0287 , Y02E60/13 , Y10T428/13 , Y10T428/1338
摘要： A laminate package (1) for an energy storage device in the form of a supercapacitor (2) that has two terminals (3, 4). Package (1) includes an inner barrier layer (5) of polyethylene (PE) for defining a cavity (6) to contain device (2). Layer (5) has two opposed edges (9) that are sealingly engaged with each other and from between which terminals (3, 4) extend from the cavity. A sealant layer (11) of NucrelTM resin is disposed intermediate layer and terminals (3). An outer barrier layer (12) is bonded to layer (5) and has a metal layer (13) which is aluminium.

106. 发明公开

EP4425514A1 MULTILAYER ELECTRONIC COMPONENT 审中-公开
公开(公告)号：EP4425514A1
公开(公告)日：2024-09-04
申请号：EP24152865.2
申请日：2024-01-19
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Yoo, Jin Yeop , Song, Young Hoon , Kim, Dong Ju
IPC分类号： H01G4/12 , H01G4/224 , H01G4/30 , H01G4/232
CPC分类号： H01G4/30 , H01G4/1227 , H01G4/1209 , H01G4/232 , H01G4/224
摘要： A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, in which the body includes a capacitance formation portion and margin portions disposed on both surfaces of the capacitance formation portion in a width direction, the margin portions include a first region adjacent to the capacitance formation portion, a third region adjacent to an external surface of the margin portion, and a second region disposed between the first and third regions, and G2>G1 and G2>G3 when an average grain size of a dielectric grain included in the first region is referred to as G1, an average grain size of a dielectric grain included in the second region is referred to as G2, and an average grain size of a dielectric grain included in the third region is referred to as G3.

107. 发明公开

EP4394827A3 ASYMMETRICAL MULTILAYER EXTERNAL ELECTRODES FOR A MULTILAYERED CERAMIC CAPACITOR 审中-实审
公开(公告)号：EP4394827A3
公开(公告)日：2024-08-21
申请号：EP23217578.6
申请日：2023-12-18
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Han, Jihye , Choi, Hong Je , Kang, Byungwoo , Park, Hyejin , Yun, Suyun , Lee, Sangwook , Kim, Jungmin
IPC分类号： H01G4/12 , H01G4/232 , H01G4/30 , H01G4/012 , H01G4/224 , H01G4/252 , H01G4/248
CPC分类号： H01G4/30 , H01G4/2325 , H01G4/232 , H01G4/12 , H01G4/248 , H01G4/252 , H01G4/224 , H01G4/012
摘要： Disclosed is a multilayered capacitor (100) that includes a capacitor body (110) including a dielectric layer (111) and an internal electrode (121,122), and an external electrode (131, 132) outside the capacitor body (110), wherein the external electrode (131, 132) includes a first layer (1311, 1321) connected to the internal electrode (121, 122), a second layer 81312, 1322) covering a portion of the first layer (1311, 1321) and exposing another portion, a third layer (1313, 1323) covering the second layer (1312, 1322) and including a first resin and a first conductive metal, and a fourth layer (1314, 1324) covering the first (1311, 1321) and third (1313, 1323) layers, and an area ratio of the second resin and second conductive metal, included in the second layer (1312, 1322) is greater than an area ratio of the resin included in the third layer (1313, 1323).

108. 发明公开

EP4394822A3 MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-实审
公开(公告)号：EP4394822A3
公开(公告)日：2024-08-21
申请号：EP23190551.4
申请日：2023-08-09
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Lee, Jong Ho , Cha, Kyoung Jin , Cha, Berm Ha , Choi, Hyung Jong , Chun, Jin Woo
IPC分类号： H01G4/00 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/224 , H01G4/30 , H01G4/008
CPC分类号： H01G4/30 , H01G4/012 , H01G4/0085 , H01G4/1227 , H01G4/1209 , H01G4/224 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/2325
摘要： A multilayer electronic component includes a body including a capacitance formation portion in which a plurality of dielectric layers and a plurality of internal electrodes are alternately disposed in a first direction, a first cover portion disposed on one surface of the capacitance formation portion in the first direction and including a dielectric layer, and a second cover portion disposed on the other surface of the capacitance formation portion in the first direction and including a dielectric layer; and an external electrode disposed on the body, wherein a molar ratio of Sn/(Ni+Sn) measured in a central portion of an internal electrode disposed closest to the first cover portion or the second cover portion is 0.00160 or more and 0.0230 or less, and a molar ratio of Sn/(Ni+Sn) measured in a central portion of at least one internal electrode, among the plurality of internal electrodes, is 0.00066 or less.

109. 发明公开

EP4390994A3 MULTILAYER ELECTRONIC COMPONENT 审中-实审
公开(公告)号：EP4390994A3
公开(公告)日：2024-07-10
申请号：EP23209572.9
申请日：2023-11-14
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Kang, Sung Yong
IPC分类号： H01G4/30 , H01G4/12 , H01G4/224 , H01G4/232 , H01G4/012
CPC分类号： H01G4/30 , H01G4/1227 , H01G4/012 , H01G4/224 , H01G4/1209 , H01G4/232 , C04B35/46
摘要： A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes, and first to sixth surfaces; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a Ba/Ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a Ba/Ti molar ratio of the capacitance forming portion, wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, and wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles.

110. 发明授权

EP4148754B1 VORRICHTUNG ZUR ÜBERWACHUNG EINES LEISTUNGSKONDENSATORS UND ADAPTER FÜR EINE SOLCHE VORRICHTUNG 有权
公开(公告)号：EP4148754B1
公开(公告)日：2024-07-10
申请号：EP22190572.2
申请日：2022-08-16
IPC分类号： H01G4/224 , H01G9/08 , H01G9/26 , H01G9/28 , H01G11/18 , H01G11/78 , H01G2/14 , H01G4/38 , H01G4/40 , H01G11/14 , H01G9/00 , H01G9/12 , H01G2/10
CPC分类号： H01G2/14 , H01G2/103 , H01G2/10 , H01G4/40 , H01G4/38 , H01G9/12 , H01G11/14 , H01G4/224 , H01G9/0003 , H01G9/08 , H01G9/28 , H01G9/26 , H01G11/18 , H01G11/78

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