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101. 发明公开

EP2214038A1 Light emitting diode backlight unit and liquid crystal display device having the same 有权转让
标题翻译： Leuchtdiodenrückbeleuchtungseungheit和Flüssigkristallanzeigevorrichtungdamit
公开(公告)号：EP2214038A1
公开(公告)日：2010-08-04
申请号：EP10151980.9
申请日：2010-01-28
申请人： Samsung LED Co., Ltd.
发明人： Onishi, Tomohisa
IPC分类号： G02B6/00 , G02F1/13357
CPC分类号： G02B6/0088 , G02B6/0078 , G02B6/009
摘要： There is provided a liquid crystal display device using a light guide plate dividing method that clearly establishes a structure for fixing divided light guide plates. An LED backlight unit according to an aspect of the invention may include: a lower cover having a mounting hole therein; a board provided on the lower cover and having a through hole facing the mounting hole of the lower cover; a plurality of LED packages mounted onto the board and supplying light; a light guide plate provided on the lower cover and guiding light supplied from the LED packages; and a fixation unit inserted into the mounting hole and the through hole so that the light guide plate is pressed against the lower cover.
摘要翻译：提供了一种使用导光板分割方法的液晶显示装置，其清楚地确定了用于固定分开的导光板的结构。根据本发明的一个方面的LED背光单元可以包括：下盖，其中具有安装孔; 设置在下盖上并具有面向下盖的安装孔的通孔的板; 安装在所述板上并提供光的多个LED封装; 导光板，设置在下盖上并引导从LED封装件供应的光; 以及插入到安装孔和通孔中的固定单元，使得导光板被压靠在下盖上。

102. 发明公开

EP2530374A2 LED lamp with omnidirectional light distribution 审中-公开
标题翻译： LED Lampe mit omnidirektionaler Lichtverteilung
公开(公告)号：EP2530374A2
公开(公告)日：2012-12-05
申请号：EP11191293.7
申请日：2011-11-30
申请人： Samsung LED Co., Ltd.
发明人： Ariyoshi, Tetsuo , Park, Cheon-ho , Yu, Byeong-hyeon
IPC分类号： F21V3/02 , F21V3/04 , F21V29/00 , F21K99/00 , F21Y101/02 , F21Y105/00
CPC分类号： F21V3/02 , F21K9/00 , F21K9/62 , F21V3/0615 , F21V3/0625 , F21V3/10 , F21V17/06 , F21V19/0035 , F21V29/71 , F21V29/717 , F21V29/77 , F21V29/773 , F21W2111/00 , F21Y2105/10 , F21Y2107/00 , F21Y2107/60 , F21Y2115/10
摘要： An omnidirectional semiconductor light emitting device lamp (100) has a light distribution characteristic having a large range similar to that of a general incandescent lamp. The light emitting device lamp includes light-emitting diodes or LEDs (103, 106) and a diffusion cover (108) that may be a glass cover with an provided with a white diffusion coating or a plastic cover with a diffusion agent mixed within the material. A high-reflectance white material may be used to improve the light efficiency.
摘要翻译：全向半导体发光装置灯（100）具有与普通白炽灯类似的大范围的光分布特性。发光装置灯包括发光二极管或LED（103,106）和扩散罩（108），扩散罩（108）可以是具有白色扩散涂层的玻璃盖或具有混合在材料内的扩散剂的塑料盖。可以使用高反射率白色材料来提高光效率。

103. 发明公开

EP2528113A1 Semiconductor Light Emitting Device Having Current Blocking Layer 有权转让
标题翻译： Lichtemittierende Halbleitervorrichtung mit Stromsperrschicht
公开(公告)号：EP2528113A1
公开(公告)日：2012-11-28
申请号：EP12169466.5
申请日：2012-05-25
申请人： Samsung LED Co., Ltd.
发明人： Lee, Wan Ho
IPC分类号： H01L33/14 , H01L33/38
CPC分类号： H01L33/387 , H01L33/14
摘要： There is provided a semiconductor light emitting device including: a semiconductor light emitting laminate including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed therebetween; a first electrode having at least one bonding pad formed on a portion of an upper surface of the first conductive semiconductor layer; a second electrode having an ohmic contact layer formed on the second conductive semiconductor layer; and a current blocking layer between the second conductive semiconductor layer and the ohmic contact layer having a plurality of patterns formed thereon, the plurality of patterns being arrayed such that intervals between patterns adjacent to a region overlapped with the bonding pad are smaller an interval between patterns of another regions.
摘要翻译：提供一种半导体发光器件，包括：包含第一导电半导体层，第二导电半导体层和插入其间的有源层的半导体发光层叠体; 第一电极，其具有形成在所述第一导电半导体层的上表面的一部分上的至少一个焊盘; 具有形成在所述第二导电半导体层上的欧姆接触层的第二电极; 以及在第二导电半导体层和欧姆接触层之间的电流阻挡层，其上形成有多个图案，所述多个图案被排列成使得与与焊盘重叠的区域相邻的图案之间的间隔小于图案之间的间隔的另一个地区。

104. 发明公开

EP1753038A3 Light emitting diode package having recess in heat conducting part 审中-公开
标题翻译：具有在热传导部件中的凹部的发光二极管封装
公开(公告)号：EP1753038A3
公开(公告)日：2012-11-21
申请号：EP06254175.0
申请日：2006-08-08
申请人： Samsung LED Co., Ltd.
发明人： Lee, Seon Goo , Han, Kyung Taeg , Song, Chang Ho
IPC分类号： H01L33/64 , H01L33/62 , H01L33/48 , H01L33/60
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.

105. 发明公开

EP2519081A2 Method and system for controlling light by using image code 有权转让
标题翻译： Verfahren und System zur Steuerung von Licht durch Verwendung von Bildcodes
公开(公告)号：EP2519081A2
公开(公告)日：2012-10-31
申请号：EP12164940.4
申请日：2012-04-20
申请人： Samsung LED Co., Ltd.
发明人： Lee, Sang-gon , Jung, Te-o , Lee, Chang-sub , Lee, Sang-hun
IPC分类号： H05B37/02
CPC分类号： H05B37/029 , H05B37/0272
摘要： Provided are a method and system for controlling light by using an image code. The method includes displaying an image code on a display unit; acquiring information relating to light settings by recognizing the image code; determining apparatus information and lighting state information by using information relating to the light settings; and transmitting a light request message for requesting light settings according to the lighting state information to the lighting apparatus having apparatus information that is equal to the apparatus information of the image code.
摘要翻译：提供了一种通过使用图像代码来控制光的方法和系统。该方法包括在显示单元上显示图像代码; 通过识别图像代码来获取关于光设置的信息; 通过使用与所述光设置相关的信息来确定设备信息和照明状态信息; 以及根据所述点亮状态信息向具有与所述图像代码的装置信息相同的装置信息的照明装置发送用于请求光设置的光请求消息。

106. 发明公开

EP2508654A1 Vapor deposition system 审中-公开
标题翻译： Aufdampfungssystem
公开(公告)号：EP2508654A1
公开(公告)日：2012-10-10
申请号：EP12004939.0
申请日：2010-11-03
申请人： Samsung LED Co., Ltd.
发明人： Lee, Dong Ju , Shim, Hyun Wook , Lee, Heon Ho , Kim, Young Sun , Kim, Sung Tae
IPC分类号： C30B25/14 , C30B29/40 , C23C16/54 , C23C16/455
CPC分类号： C23C16/54 , C23C16/45563 , C30B23/02 , C30B25/14 , C30B29/40 , H01L21/0254 , H01L21/0262 , H01L33/007
摘要： There are provided a vapor deposition system, a method of manufacturing a light emitting device, and a light emitting device. A vapor deposition system according to an aspect of the invention may include: a first chamber having a first susceptor and at least one gas distributor discharging a gas in a direction parallel to a substrate disposed on the first susceptor; and a second chamber having a second susceptor and at least one second gas distributor arranged above the second susceptor to discharge a gas downwards.
When a vapor deposition system according to an aspect of the invention is used, a semiconductor layer being thereby grown has excellent crystalline quality, thereby improving the performance of a light emitting device. Furthermore, while the operational capability and productivity of the vapor deposition system are improved, deterioration in an apparatus can be prevented.
摘要翻译：提供了一种气相沉积系统，一种制造发光器件的方法和一种发光器件。根据本发明的一个方面的气相沉积系统可以包括：具有第一基座和至少一个气体分配器的第一腔室，其沿与平行于设置在第一基座上的衬底平行的方向排出气体; 以及第二室，具有第二基座和布置在第二基座上方的至少一个第二气体分配器，以向下排放气体。当使用根据本发明的一个方面的气相沉积系统时，由此生长的半导体层具有优异的结晶质量，从而提高了发光器件的性能。此外，虽然改善了气相沉积系统的操作能力和生产率，但是可以防止装置的劣化。

107. 发明授权

EP1523047B1 Nitride-based semiconductor light emitting device and method of manufacturing the same 有权转让
标题翻译：它们的氮化物基半导体发光器件及其制造方法
公开(公告)号：EP1523047B1
公开(公告)日：2012-09-26
申请号：EP04256154.8
申请日：2004-10-05
申请人： Samsung LED Co., Ltd. , Gwangju Institute of Science and Technology
发明人： Seong,Tae-yeon, Gwangju Institute of Sci. & Tech. , Song, June-o, Gwangju Institute of Sci. & Tech. , Kim, Kyoung-kook , Leem, Dong-seok, Gwangju Institute of Sci. & Tech.
IPC分类号： H01L33/42 , H01L33/32
CPC分类号： H01L33/42 , H01L33/32 , H01L33/405 , H01L2933/0016

108. 发明公开

EP2500944A2 Semiconductor light emitting diode chip, method of manufacturing thereof and method for quality control thereof 审中-公开
标题翻译： Halbleiter-LED-Chip，Herstellungsverfahren undQualitätskontrollverfahrendafür
公开(公告)号：EP2500944A2
公开(公告)日：2012-09-19
申请号：EP12159552.4
申请日：2012-03-15
申请人： Samsung LED Co., Ltd.
发明人： SONG, Young Hee , HONG, Seong Jae , HWANG, Seong Deok
IPC分类号： H01L27/15
CPC分类号： H01L27/15 , F21K9/23 , F21Y2115/10 , H01L25/167 , H01L27/153 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： There are provided a semiconductor light emitting diode chip, a method of manufacturing thereof, and a method for quality control using the same. The semiconductor light emitting diode chip includes a substrate; a light emitting diode in one area of the substrate and at least one fuse signature circuit formed in the other area of substrate so as to be electrically insulated from the light emitting diode. The fuse signature circuit includes a circuit unit having unique electrical characteristic value corresponding to wafer based process information and a plurality of electrode pads connected to the circuit unit. The semiconductor light emitting diode chip may include chip information marking representing information.
摘要翻译：提供了一种半导体发光二极管芯片，其制造方法和使用其的质量控制方法。半导体发光二极管芯片包括基板; 衬底的一个区域中的发光二极管和形成在衬底的另一区域中的至少一个熔丝签名电路，以便与发光二极管电绝缘。熔丝签名电路包括具有对应于基于晶片的工艺信息的独特电特性值的电路单元和连接到电路单元的多个电极焊盘。半导体发光二极管芯片可以包括表示信息的芯片信息标记。

109. 发明公开

EP1732145A3 Method for manufacturing nitride-based semiconductor device 审中-公开
标题翻译：一种用于制造基于氮化物的半导体器件的方法
公开(公告)号：EP1732145A3
公开(公告)日：2012-09-05
申请号：EP06252984.7
申请日：2006-06-09
申请人： Samsung LED Co., Ltd.
发明人： Park, Hee Seok
IPC分类号： H01L21/20 , H01L33/00 , H01L21/205 , H01L33/12
CPC分类号： H01L33/007 , H01L21/0237 , H01L21/02381 , H01L21/02458 , H01L21/02502 , H01L21/02513 , H01L21/0254 , H01L21/0262 , H01L33/12
摘要： In a method for manufacturing a high-quality GaN-based semiconductor layer (107) on a substrate (101) of different material, an AlN nucleation layer (103) is grown on a substrate, a GaN buffer layer (105) is grown on the AlN nucleation layer, and the substrate annealed. The AlN nucleation layer is formed to have a thickness greater than a critical radius of a nucleus of AlN crystal and less than a critical resilient thickness of AlN, and the GaN buffer layer is formed to have a thickness greater than a critical radius of a nucleus of GaN crystal and less than a critical resilient thickness of GaN. Annealing time is greater than L 2 /D Ga where L indicates a diffusion distance of Ga, and D Ga indicates a diffusion coefficient of Ga in the AlN nucleation layer.

110. 发明公开

EP2492982A2 Light emitting device package 审中-公开
标题翻译： Verpackungfürlichtemittierende Vorrichtung
公开(公告)号：EP2492982A2
公开(公告)日：2012-08-29
申请号：EP12156525.3
申请日：2012-02-22
申请人： Samsung LED Co., Ltd.
发明人： Lee, Won Joon , Han, Seong Yeon , Kim, Yong Seok , Kwon, Jae Wook , Choi, Sung A , Choi, Myoung Soo
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L33/486 , H01L24/48 , H01L24/49 , H01L25/0753 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/49175 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： There is provided a light emitting device package, including: a package body; a first lead frame coupled to the package body and including a first recess having an exposed side, the first recess having a chip mounting area formed to be downwardly recessed therein, wherein at least a part of a bottom surface of the chip mounting area is exposed to a bottom surface of the package body; a second lead frame coupled to the package body so as to have a predetermined distance from the first lead frame and including a second recess having an exposed side opposed to the exposed side of the first recess; and at least one light emitting device mounted on the chip mounting area of the first lead frame and electrically connected with the first and second lead frames.
摘要翻译：提供了一种发光器件封装，包括：封装体; 第一引线框架，其耦合到所述封装主体并且包括具有暴露侧的第一凹部，所述第一凹部具有形成为向下凹入其中的芯片安装区域，其中所述芯片安装区域的底表面的至少一部分被暴露到所述包装体的底表面; 第二引线框架，其耦合到所述封装体，以便与所述第一引线框架具有预定距离，并且包括具有与所述第一凹部的暴露侧相对的暴露侧的第二凹部; 以及安装在第一引线框架的芯片安装区域上并与第一引线框架和第二引线框架电连接的至少一个发光器件。

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