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91. 发明公开

EP1298471A1 Apparatus for coupling optical elements in an optical module 审中-公开
标题翻译： Vorrichtung zur Kopplung optischer Elemente in einem optischen Modul
公开(公告)号：EP1298471A1
公开(公告)日：2003-04-02
申请号：EP01308208.6
申请日：2001-09-27
申请人： Agilent Technologies, Inc. (a Delaware corporation)
发明人： Meadowcroft, Simon
IPC分类号： G02B6/42
CPC分类号： G02B6/4248 , G02B6/4202 , G02B6/4236 , G02B6/4237 , G02B6/4251 , G02B6/4257 , G02B6/4269
摘要： In an optical module (1), an optical fibre (6) has an end (9) aligned with a semiconductor laser diode (10), such that light is coupled from a lasing portion of the diode (10) into the optical fibre (6). The laser diode (10) is mounted on a heatsink (8), which is itself mounted on a component portion (13) of a submount (11). The optical fibre (6) is mounted on a fibre attachment element (12), which is mounted on the component portion (13) of submount (11) in order to maintain the laser diode and the optical fibre in alignment. The submount (11) is mounted on an inner surface of the housing (2) by a fixing portion (14) leaving the component portion (13) of the submount (11) free of the housing (2), such that mechanical stresses in the housing (2) are not transmitted to the component portion (13) of the submount (11).
摘要翻译：在光学模块（1）中，光纤（6）具有与半导体激光二极管（10）对准的端部（9），使得光从二极管（10）的发光部分耦合到光纤（ 6）。激光二极管（10）安装在散热器（8）上，散热器本身安装在基座（11）的部件部分（13）上。光纤（6）安装在安装在基座（11）的部件（13）上的光纤安装元件（12）上，以便保持激光二极管和光纤对准。底座（11）通过固定部分（14）安装在壳体（2）的内表面上，离开基座（11）的组件部分（13）不受壳体（2）的限制，使得机械应力壳体（2）不被传递到基座（11）的部件部分（13）。

92. 发明公开

EP1284530A2 Optical module 审中-公开
标题翻译： Optisches Modul
公开(公告)号：EP1284530A2
公开(公告)日：2003-02-19
申请号：EP02014002.6
申请日：2002-06-26
申请人： The Furukawa Electric Co., Ltd.
发明人： Nasu, Hideyuki , Nomura, Takehiko
IPC分类号： H01S5/022
CPC分类号： G02B6/4277 , G02B6/4201 , G02B6/4251 , G02B6/4257 , G02B6/4271 , G02B6/4274 , G02B6/4286 , H01L2224/48091 , H01L2224/48137 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： An optical module includes a light-emitting devicel that outputs light, a sub-mount 2 made of a dielectric substance having thermal conductivity on which the light-emitting device is placed, a base made 3 of a metal on which the sub-mount is placed, a cooling device 4 on which the base is placed and which cools heat generated by the light-emitting device, and a power supply line 5 that is provided on the sub-mount and supplies the light-emitting device with a high-frequency modulating signal for driving the light-emitting device 1, where capacitances Cs and Cp of the sub-mount and the cooling device are connected in series to an equivalent circuit formed between the light-emitting device and the ground.
摘要翻译：光学模块包括输出光的发光装置，由具有导热性的介电材料制成的副安装座2，其上放置有发光装置的基座，金属制成的基座，其上安装有副安装座放置有冷却装置4，其上放置基座并冷却由发光装置产生的热量;以及电源线5，其设置在子座上并将发光装置供给高频用于驱动发光器件1的调制信号，其中副安装座和冷却装置的电容Cs和Cp串联连接到形成在发光器件和地之间的等效电路。

93. 发明公开

EP1063549A1 TRANSMITTER/RECEIVER FOR OPTICAL PARALLEL TRANSMISSION AND BOARD FOR OPTICAL MODULE 审中-公开
标题翻译： SENDER /EMPFÄNGERFÜROPTISCHEPARALLELÜBERTRAGUNGUND PATTEFÜROPTISCHES MODUL
公开(公告)号：EP1063549A1
公开(公告)日：2000-12-27
申请号：EP99961433.2
申请日：1999-12-27
申请人： Sumitomo Electric Industries, Ltd.
发明人： KURASHIMA, Hiromi Yokohama Works , MIKAMURA, Yasuki Yokohama Works
IPC分类号： G02B6/42
CPC分类号： G02B6/3885 , G02B6/421 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/4261 , G02B6/4269 , G02B6/4286 , G02B6/4292
摘要： An optical parallel transmission receiver in which a plurality of light-receiving elements and a plurality of optical fibers are optically coupled via guide pins (1) includes a pair of guide pins (1), a fiber holding means (2) for holding the pair of guide pins in parallel and holding the plurality of optical fibers between the pair of guide pins (1) at a predetermined interval, and a light-receiving element holding means for holding the plurality of light-receiving elements between the pair of guide pins (1) and holding one end of each of the pair of guide pins (1) so as to make a plane including light-receiving surfaces of the light-receiving elements perpendicular to longitudinal axes of the guide pins (1). The fiber holding means (2) and light-receiving element holding means (3) are integrally held by resin molding.
摘要翻译：一种光学并行传输接收器，其中多个光接收元件和多个光纤经由引导销（1）光学耦合，包括一对引导销（1），用于保持该对的光纤保持装置（2）的引导销并且以预定间隔将所述多根光纤保持在所述一对引导销（1）之间;以及光接收元件保持装置，用于将所述多个光接收元件保持在所述一对引导销之间 1）并且保持一对引导销（1）中的每一个的一端，以便使包括光接收元件的光接收表面垂直于引导销（1）的纵向轴线的平面。光纤保持装置（2）和光接收元件保持装置（3）通过树脂模制一体地保持。

94. 发明公开

EP0800243A3 Semiconductor laser module 失效
标题翻译：半导体激光模块
公开(公告)号：EP0800243A3
公开(公告)日：1998-07-01
申请号：EP97105276
申请日：1997-03-27
申请人： NEC CORP
发明人： KOSUGI TOMONARI
IPC分类号： G02B6/42 , H01L23/38 , H01S3/00 , H01S3/04 , H01S5/00 , H01S5/022 , H01S5/024 , H01S5/068 , H01S3/025 , H01S3/043
CPC分类号： H01S5/02415 , G02B6/4204 , G02B6/4237 , G02B6/4244 , G02B6/4257 , G02B6/4271 , G02B6/4272 , G02B6/4273 , H01S5/02208 , H01S5/02252 , H01S5/02284 , H01S5/02288 , H01S5/02438
摘要： It is an object of the invention to provide a thinned semiconductor laser module (20). The semiconductor laser module is provided with a module package (21), an inverted L-shaped lens supporting member (27), composed of a horizontal upper part (27U) and a vertical under part (27D), where a corner thereof defines a boundary therebetween, a substrate (24) fixed to an under surface of the vertical under part (27D) of the lens supporting member (27), a temperature regulation element (23), the under surface of which is fixed on an interior bottom surface (21B) of the module package (21) and the upper surface of which is fixed to the under surface of a substrate (24), a semiconductor laser (25) for emitting a laser beam, being fixed to a portion near a side-end of a substrate (24), an optical fiber (22), an end of which is fixed on a point irradiated by the laser beam on a side wall (21F) of the module package (21), and a lens (26), which is fixed on the under surface of the horizontal upper part (27U) of the lens supporting member (27), for optically coupling the semiconductor laser (25) with the optical fiber (22), and the lowest end of the lens is set lower than the upper surface of the substrate.

95. 发明公开

EP0704731A2 Optical semiconductor module & method for manufacturing the same 失效
标题翻译：其制备的光学半导体模块和方法
公开(公告)号：EP0704731A2
公开(公告)日：1996-04-03
申请号：EP95306729.5
申请日：1995-09-25
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Furuyama, Hideto, c/o Intellectual Property Div.
IPC分类号： G02B6/42
CPC分类号： G02B6/421 , G02B6/4201 , G02B6/4202 , G02B6/423 , G02B6/4238 , G02B6/4248 , G02B6/4253 , G02B6/4255 , G02B6/4257 , G02B6/4267 , G02B6/4268 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , Y10S438/978 , H01L2924/00014
摘要： An optical semiconductor module comprises an optical semiconductor element (6), an optical fiber (5), a monocrystalline substrate (1), an airtight sealing member (11, 12, 13, 14, 15 and 16) and a reinforcing body (8). Light is transmitted through the optical semiconductor element (6) and the optical fiber (5). The optical semiconductor element (6) and the optical fiber (5) are mounted on the monocrystalline substrate (1). The optical semiconductor element (6) is sealed airtight by the airtight sealing member (11, 12, 13, 14, 15 and 16). An optical axis aligning mechanism for aligning the optical axis of the optical semiconductor element (6) with the optical axis of the optical fiber (5) is arranged on the monocrystalline substrate (1). The reinforcing body (8) is welded with metal on the rear surface of the monocrystalline substrate (1).
摘要翻译：一种光学半导体模块包括光学半导体元件（6），光纤（5），在单晶衬底（1），在气密密封部件（11，12，13，14，15和16）和一个加强体（8 ）。光通过光半导体元件（6）和所述光纤反mitted（5）。光半导体元件（6）和所述光纤（5）被安装在所述单晶衬底（1）。光半导体元件（6）由气密密封部件（11，12，13，14，15和16）气密地密封。用于对准与光纤（5）的光轴上的光半导体元件（6）的光轴的光轴取向机构被布置在所述单晶衬底（1）。所述加固本体（8）被焊接与金属单晶基板（1）的后表面上。

96. 发明公开

EP0646816A3 Optical module, method of manufacturing the same, and sleeve 失效
标题翻译： Optisches Modul，Verfahren zu seiner Herstellung undHülse。
公开(公告)号：EP0646816A3
公开(公告)日：1996-02-07
申请号：EP94115441.1
申请日：1994-09-30
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Kurashima, Hiromi, c/o Yokohama Works of
IPC分类号： G02B6/42
CPC分类号： G02B6/4246 , G02B6/3874 , G02B6/4204 , G02B6/4245 , G02B6/4257 , G02B6/4292
摘要： An optical module comprises a plastic package (10) constituted by a package main body (12) and a cover (14), sleeves (30,31) formed integrally with the package main body (12), a circuit board (20) held in the package main body (12), light-activated elements fixed at predetermined positions of the circuit board (20), three projections (50) to (52) formed integrally with an inner surface of the package main body (12) and brought into contact with a periphery of the circuit board (20) to position the circuit board (20) and springs (54 to 56) formed integrally with an inner surface of the package (10) to press the periphery of the circuit board (20) against the projections. Since the sleeves (30,31) and the package main body (12) are integrally formed by plastic molding, the number of components is reduced, thereby simplifying the assembling steps.
摘要翻译：光学模块包括由封装主体12和盖14构成的塑料封装10，与封装主体12一体形成的套筒30,31，保持在封装主体12中的电路板20，固定在电路板20的预定位置处，与封装主体12的内表面一体形成的三个突起50至52与电路板20的周边接触，以使电路板20和弹簧54至56形成与封装10的内表面一体地挤压电路板20的周边以抵靠突起。由于套筒30,31和包装主体12通过塑性成型一体形成，因此部件数量减少，从而简化组装步骤。

97. 发明公开

EP0511931A3 An apparatus and a method for an optical fiber interface 失效
标题翻译：一种用于光纤接口的装置和方法
公开(公告)号：EP0511931A3
公开(公告)日：1993-03-31
申请号：EP92480053.5
申请日：1992-03-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Ecker, Mario Enrique , Jacobowitz, Lawrence
IPC分类号： G02B6/42
CPC分类号： G02B6/4248 , G02B6/4202 , G02B6/424 , G02B6/4257 , G02B6/4271 , G02B6/4274
摘要： The present invention relates to an optical fiber interface and a method for making the same. A Thermal Conduction Module or TCM (10), comprises a lower frame (12), an upper frame (16), sandwiching a seal frame (14), are held together by bolts (18). Usually a cold plate (17), having a number of coolant channels (21), is secured to the upper surface of the upper frame (16), A substrate (40), having stepped edge (42), and having semiconductor chips (50), thereon, is secured between the ledge (41), of the lower frame (12), and the extension of seal frame (14), with a gasket (46), therebetween. Heat exchange elements (52) transfer the heat generated by the chips (50), to the upper frame (16). A retainer (51), holds the heat exchange elements (52), in place, and is also used to provide the guide grooves and securing means for an optical fiber (23). Cooling devices where there is no retainer, can be modified to provide means for guiding and securing the optical fiber (23), from the exterior of the TCM (10) , to an optoelectronic device on the substrate (40). A fluid tight seal for the chips (50), that are on the substrate 40, is achieved by means of gaskets (46, 48). An optical fiber mounting assembly (20), provides the interface between the multi-fiber optical cable (25), and the TCM (10). Face plate (22), keeper (32), wave washer (31), retainer (30), and shoulder (28), are various components of the optical fiber mounting assembly (20), that normally protrude out of the TCM (10). The optical fiber mounting assembly (20), may be located between any adjacent pair of bolts (18), along the sides of the TCM (10). Therefore, any side of the TCM (10), may then accommodate (N-1) optical fiber mounting assemblies (20), where N = number of bolts along the given side of the TCM (10). Each optical fiber mounting assembly (20), can have a multi-fiber optical cable (25), having one or more optical fibers (23) having a core of a first refractive index material with a cladding of a second refractive index material and a protective jacket which is typically of a polymeric material.

98. 发明公开

EP0511931A2 An apparatus and a method for an optical fiber interface 失效
标题翻译： Vorrichtung und Verfahrenfürein faseroptisches界面。
公开(公告)号：EP0511931A2
公开(公告)日：1992-11-04
申请号：EP92480053.5
申请日：1992-03-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Ecker, Mario Enrique , Jacobowitz, Lawrence
IPC分类号： G02B6/42
CPC分类号： G02B6/4248 , G02B6/4202 , G02B6/424 , G02B6/4257 , G02B6/4271 , G02B6/4274
摘要： The present invention relates to an optical fiber interface and a method for making the same. A Thermal Conduction Module or TCM (10), comprises a lower frame (12), an upper frame (16), sandwiching a seal frame (14), are held together by bolts (18). Usually a cold plate (17), having a number of coolant channels (21), is secured to the upper surface of the upper frame (16), A substrate (40), having stepped edge (42), and having semiconductor chips (50), thereon, is secured between the ledge (41), of the lower frame (12), and the extension of seal frame (14), with a gasket (46), therebetween. Heat exchange elements (52) transfer the heat generated by the chips (50), to the upper frame (16). A retainer (51), holds the heat exchange elements (52), in place, and is also used to provide the guide grooves and securing means for an optical fiber (23). Cooling devices where there is no retainer, can be modified to provide means for guiding and securing the optical fiber (23), from the exterior of the TCM (10) , to an optoelectronic device on the substrate (40). A fluid tight seal for the chips (50), that are on the substrate 40, is achieved by means of gaskets (46, 48). An optical fiber mounting assembly (20), provides the interface between the multi-fiber optical cable (25), and the TCM (10). Face plate (22), keeper (32), wave washer (31), retainer (30), and shoulder (28), are various components of the optical fiber mounting assembly (20), that normally protrude out of the TCM (10).
The optical fiber mounting assembly (20), may be located between any adjacent pair of bolts (18), along the sides of the TCM (10). Therefore, any side of the TCM (10), may then accommodate (N-1) optical fiber mounting assemblies (20), where N = number of bolts along the given side of the TCM (10). Each optical fiber mounting assembly (20), can have a multi-fiber optical cable (25), having one or more optical fibers (23) having a core of a first refractive index material with a cladding of a second refractive index material and a protective jacket which is typically of a polymeric material.
摘要翻译：光纤接口及其制造方法技术领域本发明涉及光纤接口及其制造方法。热传导模块或TCM（10）包括下框架（12），夹紧密封框架（14）的上框架（16）通过螺栓（18）保持在一起。通常，具有多个冷却剂通道（21）的冷板（17）固定到上部框架（16）的上表面，具有台阶边缘（42）并具有半导体芯片（42）的基板（40） 50）固定在下框架（12）的凸缘（41）和密封框架（14）的延伸部之间，其间具有垫圈（46）。热交换元件（52）将由芯片（50）产生的热量传递到上框架（16）。保持器（51）将热交换元件（52）保持就位，并且还用于提供用于光纤（23）的引导槽和固定装置。可以修改没有保持器的冷却装置，以提供用于将光纤（23）从TCM（10）的外部引导和固定到衬底（40）上的光电子器件的装置。通过垫片（46,48）实现用于芯片（50）的位于衬底40上的流体密封。光纤安装组件（20）提供多光纤光缆（25）和TCM（10）之间的接口。面板（22），保持器（32），波形垫圈（31），保持器（30）和肩部（28）是光纤安装组件（20）的各种部件，其通常从TCM（10 ）。光纤安装组件（20）可以沿着TCM（10）的侧面位于任何相邻的一对螺栓（18）之间。因此，TCM（10）的任何一侧可以随后容纳（N-1）个光纤安装组件（20），其中N =沿着TCM（10）给定侧的螺栓数。每个光纤安装组件（20）可以具有多纤维光缆（25），其具有一个或多个具有第一折射率材料的芯的光纤（23），其具有第二折射率材料的包层和通常为聚合材料的保护套。

99. 发明公开

EP0272027A2 Printed circuit board 失效
标题翻译： Gedruckte Schaltung。
公开(公告)号：EP0272027A2
公开(公告)日：1988-06-22
申请号：EP87310724.7
申请日：1987-12-07
申请人： AT&T Corp.
发明人： Gabbard, Larry Joe
IPC分类号： H05K1/00 , G02B5/00 , H05K1/02 , G02B6/42
CPC分类号： G02B6/4204 , G02B6/2817 , G02B6/42 , G02B6/424 , G02B6/4245 , G02B6/4257 , G02B6/428 , G02B6/4285 , H05K1/0274
摘要： This printed circuit board (200) with optical signal distribution layer (101, 102) uses a layer of transparent material or an optical fiber mat build into the laminated printed circuit board structure to interconnect various opto-electrical devices (110,111) which are attached to the surface of the printed circuit board.
The optical devices are connected to the buried optical fiber layer by drilling vias in the printed circuit board to intercept the fiber or the particular optical signal distribution layer at a desired location. The via is then filled with an optical material (210) whose optical properties provide for the coupling of light energy from the intercepted optical signal distribution layer through the via material to the surface of the printed circuit board. Opto-electrical devices are connected over the top of these vias and perform the optical light energy to electrical signal conversion function.
摘要翻译：具有光信号分配层（101,102）的印刷电路板（200）使用透明材料层或构成叠层印刷电路板结构的光纤垫，以将各种光电器件（110,111）连接到印刷电路板的表面。光学器件通过钻孔印刷电路板中的通孔连接到掩埋光纤层，以在期望的位置截取光纤或特定的光信号分布层。然后，通孔的光学材料（210）被填充，光学材料（210）的光学性质提供了将光束从被截取的光信号分布层穿过通孔材料耦合到印刷电路板的表面。光电器件通过这些通孔的顶部连接，并执行光学能量到电信号转换功能。

100. 发明公开

EP3345029A1 FIBER COUPLING DEVICE FOR COUPLING OF AT LAST ONE OPTICAL FIBER 审中-公开
公开(公告)号：EP3345029A1
公开(公告)日：2018-07-11
申请号：EP15763787.7
申请日：2015-09-04
申请人： CCS Technology, Inc.
发明人： FIEBIG, Christian , LOHSE, Chenueh Abongwa Florian
IPC分类号： G02B6/42
CPC分类号： G02B6/4228 , G02B6/262 , G02B6/32 , G02B6/4203 , G02B6/4206 , G02B6/4214 , G02B6/423 , G02B6/425 , G02B6/4257
摘要： A fiber coupling device for coupling of at least one optical fiber is disclosed. The fiber coupling device comprises at least one opto-electronic and/or photonic chip comprising at least one opto-electronic and/or photonic integrated element capable of emitting and/or detecting electromagnetic radiation. The fiber coupling device is configured for coupling the at least one opto-electronic and/or photonic integrated element to at least one fiber end-piece of an optical fiber having a reflection surface and a convex exit and/or entrance surface. The fiber coupling device further comprises a fiber end-piece alignment substrate configured for locally contacting and thereby supporting at least one convex exit and/or entrance surface of at least one fiber end-piece in an aligned position relative to the at least one opto-electronic and/or photonic integrated element.

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