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1. 发明授权

US06803778B2 Probe for a wire inserting detection jig 失效
标题翻译：探针用于插线检测夹具
公开(公告)号：US06803778B2
公开(公告)日：2004-10-12
申请号：US10369806
申请日：2003-02-18
申请人： Yoshikazu Taniguchi , Satoru Taniguchi , Kenji Chiyoda , Hajime Kato
发明人： Yoshikazu Taniguchi , Satoru Taniguchi , Kenji Chiyoda , Hajime Kato
IPC分类号： G01R1073
CPC分类号： G01R31/045 , G01R1/073 , H01R43/20 , Y10T29/49004 , Y10T29/49126 , Y10T29/49174 , Y10T29/53052 , Y10T29/53213
摘要： In a natural state of a probe (41), a plunger (61) is distanced from a rod (62) by a spring (63), the rod (62) is held in contact with a contact element (75) by a spring (74), so that the rod (62) is connected to a common conductor of a base plate via a barrel (55). On the other hand, when an end of a wire comes into contact with an end of the plunger (61) to push it toward the rod (62), the rod (62) is distanced from the contact element (75). To be electrically disconnected from the common conductor of the base plate. Thus, all the barrels (55) and contact elements (75) of a plurality of probes (41) can be held at a specified potential only by a wiring for the signal common conductor.
摘要翻译：在探针（41）的自然状态下，通过弹簧（63）将柱塞（61）与杆（62）分开，杆（62）通过弹簧与接触元件（75）保持接触（74），使得杆（62）经由筒（55）连接到基板的公共导体。另一方面，当线的端部与柱塞（61）的端部接触以将其推向杆（62）时，杆（62）远离接触元件（75）。与基板的公共导体电断开。因此，多个探针（41）的所有的筒（55）和接触元件（75）可以仅通过信号公共导体的布线保持在指定的电位。

2. 发明授权

US06794890B1 Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested 失效
标题翻译：测试插座，测试插座的制造方法，使用测试插座的测试方法和要测试的部件
公开(公告)号：US06794890B1
公开(公告)日：2004-09-21
申请号：US09625047
申请日：2000-07-24
申请人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
发明人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
IPC分类号： G01R1073
CPC分类号： G01R1/0466 , G01R1/06716 , G01R1/06738
摘要： Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.
摘要翻译：两个弹性部分连接到要与属于电子装置或半导体封装的测试插座的触点的外部连接端子接触的尖端。弹性部分彼此相对设置并弯曲成相对于尖端水平延伸。向下施加在尖端上的力均等地分布在多个弹性部分之间。弹性部分最终向下偏转而不涉及水平滑动作用。与弯曲部分的向下偏转相对应地施加在尖端上的力使得尖端与外部连接端子压接，而不会引起尖端相对于外部连接端子的水平滑动。

3. 发明授权

US06756802B2 Test system for electronic modules having contactors with spring segment terminal portions 失效
标题翻译：具有与弹簧段端子部分接触器的电子模块的测试系统
公开(公告)号：US06756802B2
公开(公告)日：2004-06-29
申请号：US10304519
申请日：2002-11-26
申请人： Daniel P. Cram
发明人： Daniel P. Cram
IPC分类号： G01R1073
CPC分类号： G01R1/07378
摘要： A pass through test system for testing an electronic module includes an interface board, and metal fret test contactors configured to electrically engage terminal contacts on the module. The test contactors and interface board are mounted to an automated or manual pass through test handler configured to allow electrical engagement of the module with a zero insertion force. The interface board includes interface contacts configured to engage the test contactors at intermediate points along their lengths, and to shorten the electrical paths through the test contactors. The interface contacts are in electrical communication with high speed conductors on the interface board, and can be constructed of a conductive polymer material, or alternately as metal frets. During a test method the module is supported edge to edge and generally parallel to the interface board. In an alternate embodiment the test contactors are metal frets configured to simultaneously electrically engage the terminal contacts on the module and planar interface contacts on the interface board. The test method includes the steps of: providing the movable test contactors, electrically engaging the terminal contacts on the module and the interface contacts on the interface board using the test contactors, and then applying test signals through the test contactors and the terminal contacts to the modules.
摘要翻译：用于测试电子模块的通过测试系统包括接口板和配置为电接合模块上的端子触点的金属触头测试接触器。测试接触器和接口板安装到自动或手动通过测试处理器，其被配置为允许模块与零插入力的电接合。接口板包括被配置成沿其长度的中间点接合测试接触器并且缩短通过测试接触器的电路径的接口触点。接口触点与接口板上的高速导体电连通，并且可以由导电聚合物材料构成，或者以金属片形式构成。在测试方法期间，模块边缘到边缘并且大致平行于接口板。在替代实施例中，测试接触器是被配置为同时电连接模块上的端子触点和接口板上的平面接口触头的金属电感。该测试方法包括以下步骤：提供可动测试接触器，使用测试接触器将模块上的端子触点与接口板上的接口触点电接合，然后将测试信号通过测试接触器和端子触点施加到模块。

4. 发明授权

US06700397B2 Triaxial probe assembly 有权
标题翻译：三轴探头组件
公开(公告)号：US06700397B2
公开(公告)日：2004-03-02
申请号：US09815952
申请日：2001-03-23
申请人： Kenneth Hollman , Robert Hancock , Daniel Smith
发明人： Kenneth Hollman , Robert Hancock , Daniel Smith
IPC分类号： G01R1073
CPC分类号： G01R31/2886 , G01R1/025 , G01R1/06711 , G01R1/18 , G01R31/2851 , G01R31/2889
摘要： The invention relates to a probe assembly for a wafer probe station having a probe holder and a replaceable probe tip. The probe holder is triaxially configured with a laterally extending center signal conductor, an intermediate guard conductor extending along the length of the center conductor and spaced radially therefrom by a tubular insulator member, and an outer shield member extending along a portion of the guard conductor and spaced radially therefrom by a second tubular insulator member. A coaxially configured probe tip has a center conductor extending to a probe point and a guard conductor radially spaced from the center conductor by an intermediate insulator. A releasable connection provides a rigid attachment between the probe tip and the probe holder and provides electrical interfaces between the center and guard conductors thereof. The probe assembly provides a replaceable probe tip solution having a rigid design and the ability to guard the center conductor along its length to a distance very near the probe point to provide enhanced performance in low current and low voltage measurement applications.
摘要翻译：本发明涉及一种用于晶圆探针台的探针组件，其具有探头支架和可更换的探针尖端。探针支架是三轴构造的，具有横向延伸的中心信号导体，中间保护导体沿着中心导体的长度延伸并且通过管状绝缘体构件径向向外间隔开，并且外屏蔽构件沿保护导体的一部分延伸，通过第二管状绝缘体构件与其径向间隔开。同轴配置的探针尖端具有延伸到探针点的中心导体和通过中间绝缘体与中心导体径向间隔开的保护导体。可释放的连接提供了探针尖端和探针支架之间的刚性附件，并且在其中心和保护导体之间提供电接口。探针组件提供具有刚性设计的可替换探针尖端溶液，并且具有将中心导体沿其长度保护到非常接近探针点的距离的能力，以在低电流和低电压测量应用中提供增强的性能。

5. 发明授权

US06690186B2 Methods and structures for electronic probing arrays 失效
标题翻译：电子探测阵列的方法和结构
公开(公告)号：US06690186B2
公开(公告)日：2004-02-10
申请号：US09999615
申请日：2001-10-24
申请人： Joseph Fjelstad
发明人： Joseph Fjelstad
IPC分类号： G01R1073
CPC分类号： G01R1/07342 , G01R1/0491 , G01R1/06727 , G01R3/00
摘要： A probe card for testing an electrical element such as a semiconductor wafer or a printed wiring board includes a substrate with circuitry thereon, an encapsulant layer overlying the substrate and a multiplicity of leads extending upwardly from the substrate through the encapsulant layer to terminals, the terminals projecting above the encapsulant layer. The probe card can be engaged with the electronic element so that the tips of the leads bear on the contact pads of the electronic element, and so that the leads and encapsulant layer deform to accommodate irregularities in the electronic element or probe card. The card can be made by providing the substrate, a sacrificial layer and leads extending between the sacrificial layer and substrate, moving the substrate and sacrificial layer away from one another to deform the leads and injecting a curable material around the leads to form the encapsulant layer.
摘要翻译：用于测试诸如半导体晶片或印刷线路板的电气元件的探针卡包括其上具有电路的衬底，覆盖衬底的密封剂层和从衬底通过密封剂层向上延伸到端子的多个引线，端子突出在密封剂层上方。探针卡可以与电子元件接合，使得引线的尖端承载在电子元件的接触垫上，并且使得引线和密封剂层变形以适应电子元件或探针卡中的不规则。可以通过提供衬底，牺牲层和在牺牲层和衬底之间延伸的引线来制造该卡，使衬底和牺牲层彼此远离地移动以使引线变形并且在引线周围注入可固化材料以形成密封层。

6. 发明授权

US06628133B2 Methods of testing integrated circuitry 失效
公开(公告)号：US06628133B2
公开(公告)日：2003-09-30
申请号：US10305676
申请日：2002-11-26
申请人： Salman Akram
发明人： Salman Akram
IPC分类号： G01R1073
CPC分类号： G01R31/2886 , G01R1/0483 , H05K3/325 , Y10T29/49083 , Y10T29/49099 , Y10T29/49165
摘要： A method of testing integrated circuitry includes providing a substrate comprising integrated circuitry to be tested. The circuitry substrate has a plurality of exposed conductive bumps in electrical connection with the integrated circuitry. At least one of the conductive bumps is engaged with an opening of a conductive receptacle at least partially formed in a surface of a test substrate. Thereafter, at least a portion of the receptacle is heated to a temperature greater than 125° C. and within at least 50% in degrees centigrade of and below the melting temperature of the exposed conductive bump effective to deform the engaged bump to be received more fully within the receptacle than initially so received by the engaging. The bumped circuit is tested through the engaged bump deformed within the receptacle. Thereafter, the bump is removed from the receptacle.

7. 发明授权

US06573702B2 Method and apparatus for cleaning electronic test contacts 失效
标题翻译：用于清洁电子测试触点的方法和设备
公开(公告)号：US06573702B2
公开(公告)日：2003-06-03
申请号：US08928806
申请日：1997-09-12
申请人： Arno G. Marcuse , Robert A. Most , Edward S. North
发明人： Arno G. Marcuse , Robert A. Most , Edward S. North
IPC分类号： G01R1073
CPC分类号： B08B7/0035 , B08B7/0042 , G01R3/00
摘要： A method and device for cleaning an electrical contact. Semiconductor testing device. Process of manufacturing integrated circuits. The electrical contact is used for contacting an integrated circuit and accumulates debris during use. The method comprises directing electromagnetic radiation at the contact. The electromagnetic energy reacts with at least one of the contact and the debris so as to cause at least a portion of the debris on the contact to be removed. The electromagnetic radiation may comprise coherent radiation, such as electromagnetic radiation generated using a laser. The portion of the debris may comprise organic debris, aluminum oxide, polyimide, or other debris. According to one aspect of the invention, the contact comprises a conductive material and the electromagnetic radiation causes removal of the portion of the debris substantially without removal of the conductive material. According to another aspect of the invention, the electromagnetic radiation at least partially melts the conductive material. In one preferred system, the contact comprises a probe tip. In such a system the probe tip may comprise the tip of a probe needle mounted to a probe card used for testing integrated circuits.
摘要翻译：一种用于清洁电气接触的方法和装置。半导体测试装置。集成电路制造工艺。电气触点用于接触集成电路并在使用过程中积聚碎屑。该方法包括在接触处引导电磁辐射。电磁能与接触物和碎屑中的至少一个反应，以使至少一部分接触物上的碎屑被去除。电磁辐射可以包括相干辐射，例如使用激光产生的电磁辐射。碎屑的部分可以包括有机碎片，氧化铝，聚酰亚胺或其它碎屑。根据本发明的一个方面，接触包括导电材料，并且电磁辐射基本上不去除导电材料，导致碎片部分的去除。根据本发明的另一方面，电磁辐射至少部分地熔化导电材料。在一个优选的系统中，触点包括探针尖端。在这种系统中，探针尖端可以包括安装到用于测试集成电路的探针卡的探针的尖端。

8. 发明授权

US06483329B1 Test system, test contactor, and test method for electronic modules 失效
标题翻译：电子模块的测试系统，测试接触器和测试方法
公开(公告)号：US06483329B1
公开(公告)日：2002-11-19
申请号：US09650161
申请日：2000-08-28
申请人： Daniel P. Cram
发明人： Daniel P. Cram
IPC分类号： G01R1073
CPC分类号： G01R1/07385 , G01R1/0408 , G01R1/0416 , G01R31/2889
摘要： A pass through test system for testing an electronic module includes an interface board, and test contactors movably mounted to the interface board for electrically engaging terminal contacts on the module with a zero insertion force on the modules. The interface board is configured for mounting to an automated or manual pass through test handler in electrical communication with test circuitry. In a first embodiment the interface board includes test pads in electrical communication with the test circuitry, and rotatable test contactors having spring contacts configured to simultaneously engage the test pads and the terminal contacts on the module. In a second embodiment the interface board includes test pads in electrical communication with the test circuitry, and slidable test contactors having beam leads configured to simultaneously engage the test pads and the terminal contacts on the module. In a third embodiment the test contactors are slidably mounted to the interface board, and include coiled spring contacts in electrical communication with a flex circuit. A test method includes the steps of: providing the test contactors, electrically engaging the terminal contacts on the module with a zero insertion force using the test contactors, and then applying test signals through the test contactors and the terminal contacts to the module.
摘要翻译：用于测试电子模块的通过测试系统包括接口板和可移动地安装到接口板的测试接触器，用于以模块上的零插入力电连接模块上的端子触点。接口板被配置为安装到与测试电路电气通信的测试处理器的自动或手动通过。在第一实施例中，接口板包括与测试电路电连通的测试焊盘，以及具有弹簧触头的可旋转测试接触器，其被配置为同时接合测试焊盘和模块上的端子触点。在第二实施例中，接口板包括与测试电路电连通的测试焊盘，以及具有配置成同时接合测试焊盘和模块上的端子触头的光束引线的可滑动测试接触器。在第三实施例中，测试接触器可滑动地安装到接口板，并且包括与柔性电路电连通的螺旋弹簧触点。测试方法包括以下步骤：提供测试接触器，使用测试接触器以零插入力电连接模块上的端子触点，然后将测试信号通过测试接触器和端子触点施加到模块。

9. 发明授权

US06342789B1 Universal wafer carrier for wafer level die burn-in 失效
标题翻译：用于晶圆级模具老化的通用晶圆载体
公开(公告)号：US06342789B1
公开(公告)日：2002-01-29
申请号：US09211089
申请日：1998-12-14
申请人： Alan G. Wood , Tim J. Corbett
发明人： Alan G. Wood , Tim J. Corbett
IPC分类号： G01R1073
CPC分类号： H01L24/80 , G01R1/0466 , G01R1/0483 , G01R1/0491 , G01R1/0735 , G01R3/00 , G01R31/2831 , G01R31/2855 , G01R31/2863 , G01R31/2867 , G01R31/2886 , G01R31/2889 , G01R31/2893 , H01L22/20 , H01L22/22 , H01L23/13 , H01L2224/16145 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H05K3/0058 , H05K3/0067 , H05K3/4007 , H05K3/423 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723
摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After burn-in stress and electrical test, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
摘要翻译：用于测试半导体晶片上的无引脚骰子的可重复使用的老化/测试夹具由两半组成。测试夹具的前半部分是用于接收晶片的晶片腔板，第二半部分在晶片和电气测试设备之间建立电气连通。刚性基板在其上具有与晶片电接触的导体。在老化和电气测试完成之前，测试夹具不需要打开。在老化应力和电气测试之后，可以将单个裸片或单独的封装裸片与封装裸片之间建立互为独立部件，阵列或簇的互连，或者作为单个部件或阵列。

10. 发明授权

US06798224B1 Method for testing semiconductor wafers 失效
标题翻译：半导体晶圆测试方法
公开(公告)号：US06798224B1
公开(公告)日：2004-09-28
申请号：US10072734
申请日：2002-02-05
申请人： David R. Hembree , Warren M. Farnworth , Salman Akram , Alan G. Wood , C. Patrick Doherty , Andrew J. Krivy
发明人： David R. Hembree , Warren M. Farnworth , Salman Akram , Alan G. Wood , C. Patrick Doherty , Andrew J. Krivy
IPC分类号： G01R1073
CPC分类号： G01R31/2886
摘要： A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing apparatus, such as a wafer probe handler, in electrical communication with test circuitry. The probe card includes an interconnect substrate having contact members for establishing electrical communication with contact locations on the wafer. The probe card also includes a membrane for physically and electrically connecting the interconnect substrate to the testing apparatus, and a compressible member for cushioning the pressure exerted on the interconnect substrate by the testing apparatus. The interconnect substrate can be formed of silicon with raised contact members having penetrating projections. Alternately the contact members can be formed as indentations for testing bumped wafers. The membrane can be similar to multi layered TAB tape including metal foil conductors attached to a flexible, electrically-insulating, elastomeric tape. The probe card can be configured to contact all of the dice on the wafer at the same time, so that test signals can be electronically applied to selected dice as required.
摘要翻译：提供了用于测试半导体晶片的探针卡，以及使用探针卡测试晶片的方法和系统。探针卡被配置用于与测试电路电连通的常规测试装置，例如晶片探测器处理器。探针卡包括具有用于与晶片上的接触位置建立电连通的接触构件的互连基板。探针卡还包括用于将互连基板物理和电连接到测试装置的膜，以及用于缓冲由测试装置施加在互连基板上的压力的可压缩构件。互连衬底可以由具有穿透突起的凸起接触构件的硅形成。或者，接触构件可以形成为用于测试凸起的晶片的凹陷。膜可以类似于多层TAB带，其包括附接到柔性，电绝缘的弹性体带的金属箔导体。探针卡可以配置为同时接触晶片上的所有骰子，以便测试信号可以根据需要以电子方式应用于选定的骰子。

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