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1. 发明授权

US06794890B1 Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested 失效
标题翻译：测试插座，测试插座的制造方法，使用测试插座的测试方法和要测试的部件
公开(公告)号：US06794890B1
公开(公告)日：2004-09-21
申请号：US09625047
申请日：2000-07-24
申请人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
发明人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
IPC分类号： G01R1073
CPC分类号： G01R1/0466 , G01R1/06716 , G01R1/06738
摘要： Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.
摘要翻译：两个弹性部分连接到要与属于电子装置或半导体封装的测试插座的触点的外部连接端子接触的尖端。弹性部分彼此相对设置并弯曲成相对于尖端水平延伸。向下施加在尖端上的力均等地分布在多个弹性部分之间。弹性部分最终向下偏转而不涉及水平滑动作用。与弯曲部分的向下偏转相对应地施加在尖端上的力使得尖端与外部连接端子压接，而不会引起尖端相对于外部连接端子的水平滑动。

2. 发明授权

US07112976B2 Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested 失效
标题翻译：测试插座，测试插座的制造方法，使用测试插座的测试方法和要测试的部件
公开(公告)号：US07112976B2
公开(公告)日：2006-09-26
申请号：US10842554
申请日：2004-05-11
申请人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
发明人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
IPC分类号： G01R1/067
CPC分类号： G01R1/0466 , G01R1/06716 , G01R1/06738
摘要： Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.
摘要翻译：两个弹性部分连接到要与属于电子装置或半导体封装的测试插座的触点的外部连接端子接触的尖端。弹性部分彼此相对设置并弯曲成相对于尖端水平延伸。向下施加在尖端上的力均等地分布在多个弹性部分之间。弹性部分最终向下偏转而不涉及水平滑动作用。与弯曲部分的向下偏转相对应地施加在尖端上的力使得尖端与外部连接端子压接，而不会引起尖端相对于外部连接端子的水平滑动。

3. 发明授权

US06344753B1 Test socket having improved contact terminals, and method of forming contact terminals of the test socket 失效
标题翻译：具有改进的接触端子的测试插座和形成测试插座的接触端子的方法
公开(公告)号：US06344753B1
公开(公告)日：2002-02-05
申请号：US09480945
申请日：2000-01-11
申请人： Shigeru Takada , Yasushi Tokumo , Shigeki Maekawa , Keiko Kaneko
发明人： Shigeru Takada , Yasushi Tokumo , Shigeki Maekawa , Keiko Kaneko
IPC分类号： G01R3102
CPC分类号： H05K7/1023 , G01R1/0466 , G01R1/06727 , G01R1/06738
摘要： On each of the contact terminals of a test socket, one or more contact projections having a radius of curvature within a specified range, such as 0.03 to 0.3 mm, are formed in the portion of the contact terminals which contacts the corresponding external connection terminal of an electronic device. Further, a plurality of protuberances and recesses are formed on the surface of the contact projection, and each of the protuberances is formed to assume a substantially spherical surface having a radius of curvature of 2 to 15 microns. The test socket is for use in testing an electrical characteristics of an electronic device or a semiconductor package, and stable electrical contact is ensured between contact terminals of the test socket and external connection terminals of an electronic device or a semiconductor package.
摘要翻译：在测试插座的每个接触端子上，在接触端子的与相应的外部连接端子接触的部分中形成一个或多个具有在指定范围内的曲率半径例如0.03至0.3mm的接触突起，电子设备。此外，在接触突起的表面上形成多个突起和凹部，并且每个突起形成为具有2至15微米的曲率半径的基本上球形的表面。测试插座用于测试电子设备或半导体封装的电气特性，并且确保测试插座的接触端子与电子设备或半导体封装的外部连接端子之间的稳定的电接触。

4. 发明授权

US07662647B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07662647B2
公开(公告)日：2010-02-16
申请号：US12245542
申请日：2008-10-03
申请人： Eisaku Yamashita , Shigeru Takada
发明人： Eisaku Yamashita , Shigeru Takada
IPC分类号： H01L21/00
CPC分类号： G01R31/2863 , G01R31/2856
摘要： A burn-in input signal input to a burn-in circuit is delivered to an internal circuit through a selector. In response to a control signal from the burn-in circuit, the selector selects either the burn-in input signal or an input signal for operating the internal circuit. In the burn-in test process, a portion of an output signal is monitored to determine the degree of degradation of the internal circuit.
摘要翻译：输入到老化电路的老化输入信号通过选择器传送到内部电路。响应于来自老化电路的控制信号，选择器选择老化输入信号或用于操作内部电路的输入信号。在老化测试过程中，监视输出信号的一部分以确定内部电路的劣化程度。

5. 发明申请

US20090035881A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20090035881A1
公开(公告)日：2009-02-05
申请号：US12245542
申请日：2008-10-03
申请人： Eisaku YAMASHITA , Shigeru Takada
发明人： Eisaku YAMASHITA , Shigeru Takada
IPC分类号： H01L21/66
CPC分类号： G01R31/2863 , G01R31/2856
摘要： A burn-in input signal input to a burn-in circuit is delivered to an internal circuit through a selector. In response to a control signal from the burn-in circuit, the selector selects either the burn-in input signal or an input signal for operating the internal circuit. In the burn-in test process, a portion of an output signal is monitored to determine the degree of degradation of the internal circuit.
摘要翻译：输入到老化电路的老化输入信号通过选择器传送到内部电路。响应于来自老化电路的控制信号，选择器选择老化输入信号或用于操作内部电路的输入信号。在老化测试过程中，监视输出信号的一部分以确定内部电路的劣化程度。

6. 发明授权

US5185544A Ventilation structure in a vertically mounted motor 失效
标题翻译：垂直安装电机的通风结构
公开(公告)号：US5185544A
公开(公告)日：1993-02-09
申请号：US857450
申请日：1992-03-25
申请人： Shigeru Takada
发明人： Shigeru Takada
IPC分类号： H02K5/20 , H02K9/26 , H02K13/00
CPC分类号： H02K9/26
摘要： A ventilation structure in a vertically mounted motor is able to avoid clogging from accumulated brush abrasion dust. A ventilation path adapted to provide ventilation between the interior and the exterior of the motor casing is formed from a communication hole defined in a bottom portion of the motor casing, extending between the exterior of the motor casing and a circular hole defined in the bottom portion of the motor casing; a communication groove defined in an annular rib, extending upwardly from the bottom portion of the motor casing to form a bearing seat and encircling the circular hole to bypass the bearing in the bearing seat; and a gap C defined between the annular rib and a cap member covering the bearing and annular rib.
摘要翻译：垂直安装的电机中的通风结构能够避免积累的刷磨损灰尘的堵塞。适于在马达壳体的内部和外部之间提供通风的通风路径由限定在马达壳体的底部中的连通孔形成，该连通孔在马达壳体的外部和限定在马达壳体的底部中的圆形孔之间延伸的电机外壳; 限定在环形肋中的连通槽，其从所述马达壳体的底部向上延伸以形成轴承座并围绕所述圆形孔绕过所述轴承座中的所述轴承; 以及限定在环形肋和覆盖轴承和环形肋之间的盖构件之间的间隙C.

7. 发明申请

US20060220668A1 Method for manufacturing semiconductor device 失效
公开(公告)号：US20060220668A1
公开(公告)日：2006-10-05
申请号：US11362881
申请日：2006-02-28
申请人： Eisaku Yamashita , Shigeru Takada
发明人： Eisaku Yamashita , Shigeru Takada
IPC分类号： G01R31/26
CPC分类号： G01R31/2863 , G01R31/2856
摘要： A burn-in input signal input to a burn-in circuit is delivered to an internal circuit through a selector. In response to a control signal from the burn-in circuit, the selector selects either the burn-in input signal or an input signal for operating the internal circuit. In the burn-in test process, a portion of an output signal is monitored to determine the degree of degradation of the internal circuit.

8. 发明申请

US20060209920A1 Probe for electronic clinical thermometer 有权
标题翻译：电子体温计探头
公开(公告)号：US20060209920A1
公开(公告)日：2006-09-21
申请号：US11376461
申请日：2006-03-15
申请人： Jun Kamiyama , Shigeru Takada
发明人： Jun Kamiyama , Shigeru Takada
IPC分类号： G01K17/00
CPC分类号： G01K7/42 , G01K13/002
摘要： Providing a probe for an electronic clinical thermometer, which can measure a surface temperature and a deep body temperature of a human body securely in short time, the probe includes a cylindrical housing, a bottomed metal pipe fitted into a top end of the cylindrical housing, and a substrate having two thin-film heat-sensitive elements arranged perpendicularly on an inner wall of the bottomed metal pipe so as to fix one side edge of the substrate tightly on the inner wall. By measuring heat flux between the two thin-film heat-sensitive elements, the surface and the deep body temperatures of the human body can be predicted by applying the measured values into a heat conduction equation without waiting the sensor to reach in heat balance.
摘要翻译：提供一种可以在短时间内稳定地测量人体的表面温度和深度体温的电子体温计的探头，该探针包括圆柱形壳体，嵌入圆柱形壳体顶端的有底金属管，以及具有两个垂直于有底金属管的内壁布置的薄膜热敏元件的衬底，以将衬底的一个侧边缘牢固地固定在内壁上。通过测量两个薄膜热敏元件之间的热通量，可以通过将测量值应用到热传导方程中来预测人体的表面和深体温，而不必等待传感器达到热平衡。

9. 发明授权

US06384470B2 Contact terminal element, contact terminal device 失效
标题翻译：接触端子元件，接触端子装置
公开(公告)号：US06384470B2
公开(公告)日：2002-05-07
申请号：US09759357
申请日：2001-01-16
申请人： Kunio Kobayashi , Shigeru Takada , Isao Asaka
发明人： Kunio Kobayashi , Shigeru Takada , Isao Asaka
IPC分类号： H01L2940
CPC分类号： G01R3/00 , G01R1/0466 , H01L2924/0002 , H01L2924/00
摘要： There are described contact terminals which enable stable measurement of electrical characteristics of semiconductor devices. A heat-resistant insulating film having a plurality of apertures formed therein is sandwiched between an upper metal mold and a lower metal mold. The upper and lower metal molds are positioned, and conductive resin is poured into the cavity defined between the upper and lower metal molds, thereby producing a plurality of contact terminals. After removal of the upper and lower metal molds, there is produced a heat-resistant film having a plurality of contact terminals formed thereon.
摘要翻译：描述了能够稳定地测量半导体器件的电特性的接触端子。其中形成有多个孔的耐热绝缘膜夹在上金属模和下金属模之间。上金属模具和下金属模具定位，并且将导电树脂注入限定在上金属模具和下金属模具之间的空腔中，从而产生多个接触端子。在去除上下金属模之后，产生了在其上形成有多个接触端子的耐热膜。

10. 发明授权

US06621286B2 System and method for inspecting a semiconductor device with contact sections that slide over the terminals of the semiconductor device 失效
标题翻译：用于检查具有在半导体器件的端子上滑动的接触部分的半导体器件的系统和方法
公开(公告)号：US06621286B2
公开(公告)日：2003-09-16
申请号：US09754203
申请日：2001-01-05
申请人： Shigeru Takada , Isao Asaka , Masahiro Tanaka
发明人： Shigeru Takada , Isao Asaka , Masahiro Tanaka
IPC分类号： G01R173
CPC分类号： G01R1/0408
摘要： A system and method suitable for inspecting a semiconductor device whose terminals are formed from solder balls and protrude from a package is provided, thus enabling high-speed inspection of a semiconductor device having a plurality of pins. Metal protuberances corresponding to respective terminals projecting from the bottom of a package of a semiconductor device are provided on an interface substrate. Contact sections corresponding to the respective metal protuberances are provided within each of a plurality of slide sections. The semiconductor device is set on the slide section such that the terminals are disposed opposite the respective metal protuberances. The slide sections are slid over the interface substrate, thereby bringing the side surfaces of the terminals of the semiconductor device into contact with the contact sections. Each of the contact sections is formed from a conductive contact plate, an elastic film, and a slide guide having rigidity.
摘要翻译：提供了适用于检查端子由焊料球形成并从封装突出的半导体器件的系统和方法，从而能够高速检查具有多个引脚的半导体器件。对应于从半导体器件的封装的底部突出的各个端子的金属突起设置在界面基板上。对应于各个金属突起的接触部分设置在多个滑动部分的每一个内。半导体器件设置在滑动部分上，使得端子与相应的金属突起相对设置。滑动部分在界面基板上滑动，从而使半导体器件的端子的侧表面与接触部分接触。每个接触部分由导电接触板，弹性膜和具有刚性的滑动导向件形成。

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