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1. 发明授权

US08074353B2 Methods of providing semiconductor components within sockets 有权
标题翻译：在插座内提供半导体元件的方法
公开(公告)号：US08074353B2
公开(公告)日：2011-12-13
申请号：US12208589
申请日：2008-09-11
申请人： Daniel P. Cram , A. Jay Stutzman
发明人： Daniel P. Cram , A. Jay Stutzman
IPC分类号： H01R43/00 , G01R31/20
CPC分类号： G01R31/2891 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/49208
摘要： The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.
摘要翻译：本发明包括利用可拆卸的机械预处理机构和/或基于光学的精确机构来使芯片在插座内对准的方法。插座可以被配置为使得插座的压缩打开夹紧机构。芯片可以放置在具有操纵器的插座内，并在插座压缩期间对齐。随后，可以释放插座的压缩，同时操纵器保持与芯片接触以将芯片保持就位，直到夹持机构将芯片保持在插座中。然后可以从操纵器释放芯片。本发明还包括用于利用可拆卸嵌套将通用插座设计中的各种芯片几何形状对准的系统。

2. 发明授权

US07570069B2 Resilient contact probes 失效
标题翻译：弹性接触探针
公开(公告)号：US07570069B2
公开(公告)日：2009-08-04
申请号：US11269085
申请日：2005-11-07
申请人： Daniel P. Cram , Scott L. Hoagland
发明人： Daniel P. Cram , Scott L. Hoagland
IPC分类号： G01R1/067
CPC分类号： G01R1/06722 , G01R1/07314 , Y10T29/49204
摘要： Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes is also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.
摘要翻译：公开了一种载体，其包括具有多个保持多个弹性接触探针的开口的载体主体。还公开了用于弹性接触探针的许多不同实施例。本发明的载体可以固定到接口板（即，印刷电路板（PCB））上，并与基板（例如，其上集成有电路的晶片，PCB等）组装。弹性接触探针与接触板的端子焊盘和衬底的电触点电接触以使得能够对衬底进行电气测试。弹性接触探针的结构与载体本体相结合，能够以可控的，可预测的电接触负载实现端子焊盘的优先，高机械负载。还公开了制造和使用的方法，以及弹性接触探针的多个实施例。

3. 发明授权

US07514945B2 Systems configured for utilizing semiconductor components 失效
标题翻译：配置为利用多个半导体部件的系统
公开(公告)号：US07514945B2
公开(公告)日：2009-04-07
申请号：US11951849
申请日：2007-12-06
申请人： Daniel P. Cram , A. Jay Stutzman
发明人： Daniel P. Cram , A. Jay Stutzman
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/49208
摘要： The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.
摘要翻译：本发明包括利用可拆卸的机械预处理机构和/或基于光学的精确机构来使芯片在插座内对准的方法。插座可以被配置为使得插座的压缩打开夹紧机构。芯片可以放置在具有操纵器的插座内，并在插座压缩期间对齐。随后，可以释放插座的压缩，同时操纵器保持与芯片接触以将芯片保持就位，直到夹持机构将芯片保持在插座中。然后可以从操纵器释放芯片。本发明还包括用于利用可拆卸嵌套将通用插座设计中的各种芯片几何形状对准的系统。

4. 发明申请

US20090009202A1 Methods of Retaining Semiconductor Component Configurations within Sockets 失效
标题翻译：保留套接字内半导体元件配置的方法
公开(公告)号：US20090009202A1
公开(公告)日：2009-01-08
申请号：US12208456
申请日：2008-09-11
申请人： Daniel P. Cram , A. Jay Stutzman
发明人： Daniel P. Cram , A. Jay Stutzman
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/49208
摘要： The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.
摘要翻译：本发明包括利用可拆卸的机械预处理机构和/或基于光学的精确机构来使芯片在插座内对准的方法。插座可以被配置为使得插座的压缩打开夹紧机构。芯片可以放置在具有操纵器的插座内，并在插座压缩期间对齐。随后，可以释放插座的压缩，同时操纵器保持与芯片接触以将芯片保持就位，直到夹持机构将芯片保持在插座中。然后可以从操纵器释放芯片。本发明还包括用于利用可拆卸嵌套将通用插座设计中的各种芯片几何形状对准的系统。

5. 发明申请

US20090009199A1 SYSTEMS AND METHODS FOR TESTING PACKAGED MICROELECTRONIC DEVICES 失效
标题翻译：用于测试包装的微电子器件的系统和方法
公开(公告)号：US20090009199A1
公开(公告)日：2009-01-08
申请号：US12208183
申请日：2008-09-10
申请人： A. Jay Stutzman , Daniel P. Cram
发明人： A. Jay Stutzman , Daniel P. Cram
IPC分类号： G01R31/3181
CPC分类号： G01R1/0466 , G01R1/07364 , G01R31/2863
摘要： Systems and methods for testing packaged microelectronic devices are disclosed herein. One such system for testing a packaged microelectronic device includes a test socket configured to receive the device for testing and a tester interface including a plurality of test contacts aligned with external contacts of the device when the device is received within the test socket. The system further includes a mask proximate to the test socket and the test contacts. The mask includes a plurality of apertures arranged in a pattern corresponding to the plurality of test contacts and corresponding at least in part to the array of external contacts when the device is received within the test socket. The apertures include (a) first apertures sized to allow the corresponding test contacts to extend completely through the mask, and (b) one or more second apertures sized to allow the corresponding test contacts to extend only partially through the mask.
摘要翻译：本文公开了用于测试封装的微电子器件的系统和方法。用于测试封装的微电子器件的一个这样的系统包括被配置为接收用于测试的设备的测试插座和当该设备被接收在测试插座内时包括与设备的外部触点对准的多个测试触头的测试器接口。该系统还包括靠近测试插座和测试触点的掩模。掩模包括以对应于多个测试触点的图案布置的多个孔，并且当装置被接收在测试插座内时，至少部分地对应于外部触头的阵列。这些孔包括（a）尺寸适于允许相应的测试触点完全延伸穿过掩模的第一孔，以及（b）一个或多个第二孔，其尺寸允许相应的测试触头仅部分延伸通过掩模。

6. 发明授权

US07279915B2 Test method for electronic modules using movable test contactors 失效
标题翻译：使用可移动测试接触器的电子模块的测试方法
公开(公告)号：US07279915B2
公开(公告)日：2007-10-09
申请号：US11210563
申请日：2005-08-24
申请人： Daniel P. Cram
发明人： Daniel P. Cram
IPC分类号： G01R1/073 , G01R31/28
CPC分类号： G01R1/07385 , G01R1/0408 , G01R1/0416 , G01R31/2889
摘要： A pass through test system for testing an electronic module includes an interface board, and test contactors movably mounted to the interface board for electrically engaging terminal contacts on the module with a zero insertion force on the modules. The interface board is configured for mounting to an automated or manual pass through test handler in electrical communication with test circuitry. In a first embodiment the interface board includes test pads in electrical communication with the test circuitry, and rotatable test contactors having spring contacts configured to simultaneously engage the test pads and the terminal contacts on the module. In a second embodiment the interface board includes test pads in electrical communication with the test circuitry, and slidable test contactors having beam leads configured to simultaneously engage the test pads and the terminal contacts on the module. In a third embodiment the test contactors are slidably mounted to the interface board, and include coiled spring contacts in electrical communication with a flex circuit. A test method includes the steps of: providing the test contactors, electrically engaging the terminal contacts on the module with a zero insertion force using the test contactors, and then applying test signals through the test contactors and the terminal contacts to the module.
摘要翻译：用于测试电子模块的通过测试系统包括接口板和可移动地安装到接口板的测试接触器，用于以模块上的零插入力电连接模块上的端子触点。接口板被配置为安装到与测试电路电气通信的测试处理器的自动或手动通过。在第一实施例中，接口板包括与测试电路电连通的测试焊盘，以及具有弹簧触头的可旋转测试接触器，其被配置为同时接合测试焊盘和模块上的端子触点。在第二实施例中，接口板包括与测试电路电连通的测试焊盘，以及具有配置成同时接合测试焊盘和模块上的端子触头的光束引线的可滑动测试接触器。在第三实施例中，测试接触器可滑动地安装到接口板，并且包括与柔性电路电连通的螺旋弹簧触点。测试方法包括以下步骤：提供测试接触器，使用测试接触器以零插入力电连接模块上的端子触点，然后将测试信号通过测试接触器和端子触点施加到模块。

7. 发明授权

US07274197B2 Contact system for interfacing a semiconductor wafer to an electrical tester 失效
标题翻译：用于将半导体晶片连接到电气测试仪的接触系统
公开(公告)号：US07274197B2
公开(公告)日：2007-09-25
申请号：US11609663
申请日：2006-12-12
申请人： Daniel P. Cram
发明人： Daniel P. Cram
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/07314
摘要： Disclosed herein are exemplary embodiments of a contact system (referred to as a “Z-block”) for interfacing a semiconductor wafer to an electrical tester, and methods for making the same. In a preferred embodiment, the Z-block comprises three stacked pieces or layers: an upper and lower piece which are similar in structure, and a unique middle piece. The pieces each contain corresponding locking holes and probe pin holes. The locking holes are strategically arranged on each of the pieces to allow the stacked piece structure to be locked together at various points during its manufacture. After alignment of the probe pin holes in the various pieces, probe pins are injected into these holes. The probe pins are then aligned and locked into place by moving the middle piece relative to the upper and lower pieces. Such locking of the probe pins is accomplished through interaction of the middle piece with the shape of the probe pins, which prevents the probe pins from slipping out of the probe pin holes.
摘要翻译：这里公开了用于将半导体晶片与电气测试仪接口的接触系统（称为“Z块”）的示例性实施例及其制造方法。在优选实施例中，Z形块包括三个堆叠的片或层：上部和下部结构相似的上部件和一个独特的中间件。这些部件各自包含相应的锁定孔和探针针孔。锁定孔有策略地布置在每个部件上，以允许堆叠的片状结构在其制造期间在各个点被锁定在一起。将各针中的探头针孔对准后，将探针插入这些孔。然后通过相对于上部和下部部件移动中间件来将探针对准并锁定到位。探针的这种锁定通过中间件与探针的形状的相互作用来实现，这防止了探针从探针针孔中滑出。

8. 发明授权

US06756802B2 Test system for electronic modules having contactors with spring segment terminal portions 失效
标题翻译：具有与弹簧段端子部分接触器的电子模块的测试系统
公开(公告)号：US06756802B2
公开(公告)日：2004-06-29
申请号：US10304519
申请日：2002-11-26
申请人： Daniel P. Cram
发明人： Daniel P. Cram
IPC分类号： G01R1073
CPC分类号： G01R1/07378
摘要： A pass through test system for testing an electronic module includes an interface board, and metal fret test contactors configured to electrically engage terminal contacts on the module. The test contactors and interface board are mounted to an automated or manual pass through test handler configured to allow electrical engagement of the module with a zero insertion force. The interface board includes interface contacts configured to engage the test contactors at intermediate points along their lengths, and to shorten the electrical paths through the test contactors. The interface contacts are in electrical communication with high speed conductors on the interface board, and can be constructed of a conductive polymer material, or alternately as metal frets. During a test method the module is supported edge to edge and generally parallel to the interface board. In an alternate embodiment the test contactors are metal frets configured to simultaneously electrically engage the terminal contacts on the module and planar interface contacts on the interface board. The test method includes the steps of: providing the movable test contactors, electrically engaging the terminal contacts on the module and the interface contacts on the interface board using the test contactors, and then applying test signals through the test contactors and the terminal contacts to the modules.
摘要翻译：用于测试电子模块的通过测试系统包括接口板和配置为电接合模块上的端子触点的金属触头测试接触器。测试接触器和接口板安装到自动或手动通过测试处理器，其被配置为允许模块与零插入力的电接合。接口板包括被配置成沿其长度的中间点接合测试接触器并且缩短通过测试接触器的电路径的接口触点。接口触点与接口板上的高速导体电连通，并且可以由导电聚合物材料构成，或者以金属片形式构成。在测试方法期间，模块边缘到边缘并且大致平行于接口板。在替代实施例中，测试接触器是被配置为同时电连接模块上的端子触点和接口板上的平面接口触头的金属电感。该测试方法包括以下步骤：提供可动测试接触器，使用测试接触器将模块上的端子触点与接口板上的接口触点电接合，然后将测试信号通过测试接触器和端子触点施加到模块。

9. 发明授权

US06483329B1 Test system, test contactor, and test method for electronic modules 失效
标题翻译：电子模块的测试系统，测试接触器和测试方法
公开(公告)号：US06483329B1
公开(公告)日：2002-11-19
申请号：US09650161
申请日：2000-08-28
申请人： Daniel P. Cram
发明人： Daniel P. Cram
IPC分类号： G01R1073
CPC分类号： G01R1/07385 , G01R1/0408 , G01R1/0416 , G01R31/2889
摘要： A pass through test system for testing an electronic module includes an interface board, and test contactors movably mounted to the interface board for electrically engaging terminal contacts on the module with a zero insertion force on the modules. The interface board is configured for mounting to an automated or manual pass through test handler in electrical communication with test circuitry. In a first embodiment the interface board includes test pads in electrical communication with the test circuitry, and rotatable test contactors having spring contacts configured to simultaneously engage the test pads and the terminal contacts on the module. In a second embodiment the interface board includes test pads in electrical communication with the test circuitry, and slidable test contactors having beam leads configured to simultaneously engage the test pads and the terminal contacts on the module. In a third embodiment the test contactors are slidably mounted to the interface board, and include coiled spring contacts in electrical communication with a flex circuit. A test method includes the steps of: providing the test contactors, electrically engaging the terminal contacts on the module with a zero insertion force using the test contactors, and then applying test signals through the test contactors and the terminal contacts to the module.
摘要翻译：用于测试电子模块的通过测试系统包括接口板和可移动地安装到接口板的测试接触器，用于以模块上的零插入力电连接模块上的端子触点。接口板被配置为安装到与测试电路电气通信的测试处理器的自动或手动通过。在第一实施例中，接口板包括与测试电路电连通的测试焊盘，以及具有弹簧触头的可旋转测试接触器，其被配置为同时接合测试焊盘和模块上的端子触点。在第二实施例中，接口板包括与测试电路电连通的测试焊盘，以及具有配置成同时接合测试焊盘和模块上的端子触头的光束引线的可滑动测试接触器。在第三实施例中，测试接触器可滑动地安装到接口板，并且包括与柔性电路电连通的螺旋弹簧触点。测试方法包括以下步骤：提供测试接触器，使用测试接触器以零插入力电连接模块上的端子触点，然后将测试信号通过测试接触器和端子触点施加到模块。

10. 发明申请

US20120001680A1 ISOLATION CIRCUIT 有权
标题翻译：隔离电路
公开(公告)号：US20120001680A1
公开(公告)日：2012-01-05
申请号：US13211022
申请日：2011-08-16
申请人： Hani S. Attalla , Daniel P. Cram
发明人： Hani S. Attalla , Daniel P. Cram
IPC分类号： H03K3/01
CPC分类号： G01R31/2884 , G01R31/31721 , G01R31/31723 , H01L22/14 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure includes various method, device, and system embodiments for isolation circuits. One such isolation circuit embodiment includes: a first transistor configured for connection to a supply voltage via a first terminal; a register connected to the first transistor; a second transistor in parallel with a resistor, wherein the second transistor is configured for connection to the first terminal, with a gate of the second transistor configured for connection to an output of the register; and wherein the second transistor is configured for connection to a second terminal, the second transistor having a state that depends on a status of the register.
摘要翻译：本公开包括用于隔离电路的各种方法，装置和系统实施例。一个这样的隔离电路实施例包括：第一晶体管，被配置为经由第一端子连接到电源电压; 连接到第一晶体管的寄存器; 与电阻器并联的第二晶体管，其中所述第二晶体管被配置为连接到所述第一端子，所述第二晶体管的栅极被配置为连接到所述寄存器的输出; 并且其中所述第二晶体管被配置为连接到第二端子，所述第二晶体管具有取决于所述寄存器的状态的状态。

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