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1. 发明公开

EP0266843A3 Process for depositing small amounts of droplet-shaped solder on surfaces to be welted, and process for carrying out the process 失效
标题翻译：用于在待焊接的表面上沉积溅射焊料的小块的过程，以及执行过程的过程
公开(公告)号：EP0266843A3
公开(公告)日：1988-09-21
申请号：EP87202121
申请日：1987-11-03
申请人： Philips Patentverwaltung GmbH , N.V. Philips' Gloeilampenfabrieken
发明人： Hieber, Hartmann, DR.-Ing.
IPC分类号： B23K03/06
CPC分类号： B23K3/0623

2. 发明公开

EP0212911A3 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：EP0212911A3
公开(公告)日：1988-09-21
申请号：EP86306060
申请日：1986-08-06
申请人： Dolphin Machinery Limited
发明人： Ciniglio, Alexander James
IPC分类号： B23K01/08 , B23K03/06
CPC分类号： B23K3/0653
摘要： The present invention provides soldering apparatus wherein a rotatable shaft (3) which penetrates the surface of molten solder is surrounded by a substantially stationary tube (1) which also penetrates the solder suface, in which a substantially airtight seal (4a) is provided between the tube (1) and the shaft (3) above the solder surface. The formation of toxic dust is thus substantially reduced or almost eliminated. In accordance with a particular embodiment of the present invention, it is applied to a pump for solder, comprising a screw bladed impellor (2) mounted on the shaft (3), the blade (2) extending more than 360° around the drive shaft (3). It is preferred to pump solder through a nozzle, by pumping the solder up into the tube to form a constant head device, and feeding solder from the tube, through a conduit to the nozzle.
摘要翻译：本发明提供了焊接设备，其中穿过熔融焊料的表面的可旋转轴（3）被同样穿透焊接表面的基本上静止的管（1）包围，其中基本上气密的密封件（4a）设置在管（1）和轴（3）在焊料表面上方。因此有毒粉尘的形成大大减少或几乎消除。根据本发明的特定实施例，其应用于用于焊料的泵，该泵包括安装在轴（3）上的螺旋叶片式叶轮（2），叶片（2）围绕驱动轴延伸超过360° （3）。优选将焊料泵送通过喷嘴，通过将焊料泵入管中以形成恒定的头部装置，并且将焊料从管中通过导管馈送到喷嘴。

3. 发明公开

EP0219059A3 Apparatus for the hot tinning of circuit boards and process for soldering terminals of components to the conductive paths and soldering panels of a circuit board 失效
标题翻译：电路板热电装置的装置及电路板导电板和焊接板组件端子的焊接工艺
公开(公告)号：EP0219059A3
公开(公告)日：1988-09-28
申请号：EP86113977
申请日：1986-10-08
申请人： Eidenberg, Kaspar
发明人： Eidenberg, Kaspar
IPC分类号： H05K03/34 , B23K03/06
CPC分类号： B23K1/085 , B23K3/0653 , B23K2201/42

4. 发明公开

EP0093594A3 Solder dispenser and soldering apparatus comprising the same 失效
标题翻译：焊接分配器和包括其的焊接设备
公开(公告)号：EP0093594A3
公开(公告)日：1984-11-28
申请号：EP83302434
申请日：1983-04-29
申请人： MULTICORE SOLDERS LIMITED
发明人： Daniel, Graham Thomas
IPC分类号： B23K03/06
CPC分类号： B23K3/0615
摘要： A solder dispenser which avoids the problem of melting and resolidification of solder therein and thereadjacent comprises drive means (10) which convey forward the forward end of an elongate solder body and is able to retract the solder body from a position of application. Control means (4) operates on the drive means (10) to retract solder from this position to a stand-by position after each solder application.
摘要翻译：一种焊料分配器，其避免了其中的焊料的熔化和再凝固的问题，并且其中包括驱动装置（10），其向前传送细长焊料体的前端并且能够从施加位置缩回焊料体。控制装置（4）在驱动装置（10）上操作，以在每次焊接应用之后将焊料从该位置缩回到待机位置。

5. 发明公开

EP0252771A3 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：EP0252771A3
公开(公告)日：1988-09-28
申请号：EP87306187
申请日：1987-07-13
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： B23K03/06 , H01L21/00
CPC分类号： B23K3/0676
摘要： Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (l,2) for guiding the carrier across the solder bath, and means for urging the carrier along the tracks. The track has a first profiled region (l2,l9) for guiding a leading portion of the carrier down towards the surface of the solder, and a second profiled region (l6,20) longitudinally spaced from the first region, and laterially offset, for simultaneously guiding a trailing portion of the carrier down towards the surface of the solder, the profiles being substantially the same so that the carrier maintains its horizontal orientation whilst being moved vertically towards and away from the surface of the solder. The carrier moves on follower wheels which run along the tracks.
摘要翻译：用于将焊料施加到安装在水平取向的载体上的电气或电子部件的设备包括焊料槽，用于引导载体横过焊料槽的一对轨道（1,2）以及用于沿着轨道推动载体的装置。该轨道具有用于将载体的引导部分朝向焊料表面向下引导的第一成形区域（12,19）以及与第一区域纵向间隔开并且实质上偏移的第二成形区域（16,20）同时将载体的拖尾部分朝向焊料的表面向下引导，轮廓基本相同，使得载体保持其水平取向，同时垂直朝向和远离焊料表面移动。载体在沿轨道运行的从动轮上运动。

6. 发明公开

EP0278166A3 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：EP0278166A3
公开(公告)日：1988-09-21
申请号：EP87310891
申请日：1987-12-10
申请人： NIHON DEN-NETSU KEIKI CO., LTD.
发明人： Kondo, Kenshi
IPC分类号： B23K03/06 , H05K03/34
CPC分类号： B23K3/0653 , B23K2201/42
摘要： An apparatus for soldering printed circuit boards moving along a predetermined path of travel, comprises an upwardly extending nozzle member having an opening at its top end from which molten solder is caused to overflow to form an overflowing molten solder with which the underside surface of the printed circuit board is contacted, and an adjustable outlet member rotatably disposed in the opening to define an outlet extending in the direction transverse to the path of travel, so that by adjusting the angular position of the outlet member the orientation of the outlet may be varied for adjustment of the direction and height of the overflowing solder.
摘要翻译：一种用于焊接印刷电路板沿预定行进路径移动的设备包括向上延伸的喷嘴构件，该喷嘴构件在其顶端具有开口，熔融焊料从所述开口溢出以形成溢出熔融焊料，利用该熔化焊料印刷的下表面电路板接触，并且可调整的出口构件可旋转地设置在开口中以限定在横向于行进路径的方向上延伸的出口，使得通过调整出口构件的角度位置，出口的取向可以变化调整溢出焊料的方向和高度。

7. 发明公开

EP0037632A3 Dispenser for filamentary material, especially welding wire 失效
标题翻译：绝缘材料分配器，特殊焊丝
公开(公告)号：EP0037632A3
公开(公告)日：1982-01-13
申请号：EP81300822
申请日：1981-02-27
申请人： NATIONAL-STANDARD COMPANY
发明人： Colbert, Robert E.
IPC分类号： B65H57/18 , B65H49/06 , B23K03/06
CPC分类号： B65H49/02
摘要： A dispenser for filamentary material, particularly welding wire, from a coil (10) of the material which is supported upon a conventional wood pallet (12), comprises a vertically disposed column (20) having an upper screw-threaded end (22), a cover (34) extending over the coil and a nut (44) threaded on the screw-threaded end (22) for tightly forcing the cover against the coil. A wire guide (50) is rotatably mounted upon the upper end (22) of the column for rotating about the coil and dispensing material therefrom. The lower end (26) of the column (20) includes a hook bracket (28) extending under pallet structure whereby tightening of the nut (44) pulls the bracket (28) into a tight relationship with the pallet (12), fixing the dispenser with respect to the coil (10) and the pallet (12), and simultaneously firmly maintaining the coil upon the pallet.

8. 发明申请

WO1991012921A1 A DEVICE FOR APPLYING A SOLDER PASTE, A GLUE OR THE LIKE IN PATCHES ON A SUBSTRATE 审中-公开
标题翻译：用于在基材上施用焊膏，玻璃或类似贴片的装置
公开(公告)号：WO1991012921A1
公开(公告)日：1991-09-05
申请号：PCT/SE1991000155
申请日：1991-02-27
申请人： QENICO AB , NILSSON, Kenth, Åke, Sune
发明人： QENICO AB
IPC分类号： B23K03/06
CPC分类号： B05C11/1034 , B23K3/0607 , H05K3/3484
摘要： A device for applying a solder paste, a glue or another similar material in patches on a substrate (24) comprises a supply (10) of said material, an outlet (16), connected to said supply by means of a conveying conduit (14), and means (18) for intermittently forcedly discharging the material in successive small quantities through the outlet (16). In order to counteract any sedimentation within the conveying conduit (14), said conduit is formed as a closed loop which contains means (13) for feeding the material in a continuous circulating flow therethrough and past the outlet (16) which comprises a discharge opening (17), provided in the wall of the conveying conduit (14) and through which the material may be thrown out in small quantities by the aid of means (18) for intermittently transiently increasing the pressure in the conveying conduit (14) within a zone located adjacent to the discharge opeing (17).
摘要翻译：用于在衬底（24）上施加焊膏，胶或其他类似材料的贴片的装置包括所述材料的供应源（10），通过输送导管（14）连接到所述电源的出口（16））和用于通过出口（16）间歇地强制地排出材料的装置（18），其连续少量地排出。为了抵消输送管道（14）内的任何沉淀，所述导管形成为闭合回路，该闭合回路包含用于将材料供给到穿过其中的连续循环流体并通过出口（16）的装置（13），该出口（16）包括排出口（17），设置在输送管道（14）的壁中，借助于装置（18）可以少量地抛出材料，用于间歇地瞬时增加输送管道（14）内的压力区域位于放电开口（17）附近。

9. 发明申请

WO1989001379A1 PROCESS FOR DOSING THE QUANTITY OF SOLDER IN A SOLDERING DEVICE 审中-公开
标题翻译：在焊接设备中排放焊锡机数量的过程
公开(公告)号：WO1989001379A1
公开(公告)日：1989-02-23
申请号：PCT/DE1988000450
申请日：1988-07-20
申请人： ROBERT BOSCH GMBH , OHLE, Eckhard , RESCHNAR, Wilfried
发明人： ROBERT BOSCH GMBH
IPC分类号： B23K03/06
CPC分类号： B23K3/063 , B23K3/0615
摘要： The invention concerns a process for adjusting the feed rate of a cord solder (7) with automatic advance of a definite quantity of cord solder to be melted in a soldering device. The soldering device comprises a carriage (14) with a cord solder feed device (16, 17) connected to a motor (21) which advances a specific quantity of cord solder to be welded to the soldering site (4, 5) and, on completion of soldering, stops the cord solder (7). To prevent buckling of the end (11) of the cord solder and to correct any heating anomalies at the soldering site (4, 5), the magnitude of the feed force exerted by the motor on the cord solder (7) is adjusted to be proportional to the magnitude of the thrust of the end (11) of the cord solder on the soldering site (4, 5).
摘要翻译：本发明涉及一种用于通过自动提前一定量的待焊接装置中熔化的软焊料来调节电缆焊料（7）的进料速率的方法。焊接装置包括具有连接到电动机（21）的电缆焊接供给装置（16,17）的滑架（14），该电动机将特定量的待焊接的焊锡焊料前进到焊接部位（4,5），并且在完成焊接，停止焊锡（7）。为了防止软焊料的端部（11）的弯曲并且纠正焊接部位（4,5）处的任何加热异常，由电动机施加在电线焊料（7）上的供给力的大小被调整为与焊接位置（4,5）上的电线焊料的端部（11）的推力的大小成比例。

10. 发明申请

WO1987005547A2 SOLDER DELIVERY SYSTEMS 审中-公开
标题翻译：焊接传送系统
公开(公告)号：WO1987005547A2
公开(公告)日：1987-09-24
申请号：PCT/US1987000530
申请日：1987-03-11
申请人： RAYCHEM CORPORATION
发明人： RAYCHEM CORPORATION , NOEL, Raymond , ROBINSON, William, M. , CHERLAN, Gabe , CLIFFORD, Thomas, H. , CARLOMAGNO, William, D. , DEASY, William, M. , GRASSAUER, Willie, K. , HAYGOOD, David, K. , SHERLOCK, H., Paul , WHITE, Harry, E.
IPC分类号： B23K03/06
CPC分类号： H05K3/3478 , B23K3/06 , H05K3/3473 , H05K3/3484 , H05K2201/0125 , H05K2201/10424 , H05K2201/10727 , H05K2201/10946 , H05K2203/0113 , H05K2203/0235 , H05K2203/0338 , H05K2203/041 , H05K2203/0415 , H05K2203/0726
摘要： Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.

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