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1. 发明专利

MY101265A APPARATUS FOR HOLDING ELECTRICAL OR ELECTRONIC COMPONENTS DURING THE APPLICATION OF SOLDER. 未知
公开(公告)号：MY101265A
公开(公告)日：1991-08-17
申请号：MYPI19870972
申请日：1987-07-09
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD
发明人： SIM AH TEE (A SINGAPORE CITIZEN)
IPC分类号： B23K3/00 , B23K3/08 , H01L21/00
摘要： A CARRIER FOR HOLDING SOIC PACKAGES DURING THE APPLICATION OF SOLDER TO THEIR LEADS COMPRISES A FRAME INCLUDING AN END PLATE (17) WITH MOUNTING LUGS (20). ONE EACH LUG IS MOUNTED AN UPPER "U" SHAPED MEMBER (1) AND LOWER "U" SHAPED ELONGGATE MEMBER (8), WITH THEIR LEGS (3) AND (10) RESPECTIVELY PROJECTING DOWNWARDS. THE LEGS (10) ARE WITHIN THE LEGS (3) BUT EXTEND FURTHER AND ARE TURNED OUTWARDS AT THE ENDS (11). BETWEEN EACH SUCH ASSEMBLY IS DEFINED A TRACK (T) FOR A LINE OF SOIC PACKAGES (24) WHOSE LEADS (26) REST ON END PORTIONS (11) AND WHICH ARE RESTRICTED AGAINST UPWARDS MOTION BY THE END (4) OF LEGS (3).(FIG. 4)

2. 发明授权

EP0252771B1 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：EP0252771B1
公开(公告)日：1992-12-02
申请号：EP87306187.3
申请日：1987-07-13
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： B23K3/06 , H01L21/00
CPC分类号： B23K3/0676

3. 发明公开

EP0252770A2 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：装置用于Lötmittelauflegens期间保持电气或电子元件。
公开(公告)号：EP0252770A2
公开(公告)日：1988-01-13
申请号：EP87306186.5
申请日：1987-07-13
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H01L21/00 , B23K3/00
CPC分类号： B23K3/087
摘要： A carrier for holding SOIC packages during the application of solder to their leads comprises a frame including an end plate (17) with mounting lugs (20). On each lug is mounted an upper "U"shaped member (1) and a lower "U" shaped eleongate member (8), with their legs (3) and (10) respectively projecting downwards. The legs (10) are within the legs (3) but extend further and are turned outwards at the ends (11). Between each such assembly is defined a track (T) for a line of SOIC packages (24) whose leads (26) rest on end portions (11) and which are restricted against upwards motion by the ends (4) of legs (3).
摘要翻译：一种用于焊料的应用，它们的引线期间保持SOIC封装载波包括框架，其包括安装到端板（17）与突出部（20）。上每个凸耳被安装上的“U”形的构件（1）和较低的“U”形的构件eleongate（8）随着他们的腿（3）和（10）分别向下伸出上。腿（10）是腿（3）内延伸，但进一步，并且在端部（11）向外转动。之间的每个求组件被用于SOIC封装的是谁的引线（26）的线（24）搁置在端部（11）和其中所定义的轨道（T）由腿的端部（4）对向上运动受限（3），

4. 发明公开

EP0211692A2 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：一种用于焊料的应用过程中保持电气或电子元件。
公开(公告)号：EP0211692A2
公开(公告)日：1987-02-25
申请号：EP86306464.8
申请日：1986-08-20
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H05K13/02 , H05K13/04
CPC分类号： H05K13/0465 , Y10S269/903
摘要： A carrier for components to be soldered includes an upper frame (1) pivotally connected to a lower frame (3). The upper frame includes longitudinal grid members (14) interlocked with transverse grid members (15) to define recessed zones (31) with stepped corners to locate the components. The lower frame (3) has slidably mounted strips (9) with projections (21) which engage the components when the lower frame is pivoted to a closed condition.

5. 发明公开

EP0171257A3 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：用于在焊接应用过程中保持电气或电子部件的装置
公开(公告)号：EP0171257A3
公开(公告)日：1986-09-03
申请号：EP85305437
申请日：1985-07-30
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H05K13/04
CPC分类号： H05K13/02
摘要： A carrier for dual-in-line packages (200) to be wave soldered, comprises a frame (11) with tracks (T) into which the packages (200) can be slid. The tracks (T) are defined by aligned upper and lower «U»-shaped channel members (1, 6) providing rails (2, 7). Each track is defined between adjacent pairs of upper and lower members (1, 6). Gates (23) at either end of the tracks (T) control movement of the packages into or out of the carrier. The carrier can be loaded and unloaded by means of apparatus including an inclined ramp (29) on which the carrier can be releasably located, the packages being fed into the top of the ramp (29) to fill the carrier, and sliding to the bottom of the ramp (29) to empty the carrier of soldered packages prior to re-filling. Movement of the packages down the ramp is controlled by gates (32, 33, 34, 42, 43).

6. 发明授权

EP0211692B1 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：一种用于焊料的应用过程中保持电气或电子元件。
公开(公告)号：EP0211692B1
公开(公告)日：1994-07-06
申请号：EP86306464.8
申请日：1986-08-20
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H05K13/02 , H05K13/04
CPC分类号： H05K13/0465 , Y10S269/903

7. 发明授权

EP0252770B1 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：用于在焊接应用过程中保持电气或电子部件的装置
公开(公告)号：EP0252770B1
公开(公告)日：1990-06-27
申请号：EP87306186.5
申请日：1987-07-13
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H01L21/00 , B23K3/00
CPC分类号： B23K3/087

8. 发明公开

EP0211692A3 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：用于在焊接应用过程中保持电气或电子部件的装置
公开(公告)号：EP0211692A3
公开(公告)日：1988-11-30
申请号：EP86306464
申请日：1986-08-20
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H05K13/02 , H05K13/04
CPC分类号： H05K13/0465 , Y10S269/903
摘要： A carrier for components to be soldered includes an upper frame (1) pivotally connected to a lower frame (3). The upper frame includes longitudinal grid members (14) interlocked with transverse grid members (15) to define recessed zones (31) with stepped corners to locate the components. The lower frame (3) has slidably mounted strips (9) with projections (21) which engage the components when the lower frame is pivoted to a closed condition.

9. 发明公开

EP0252771A3 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：EP0252771A3
公开(公告)日：1988-09-28
申请号：EP87306187
申请日：1987-07-13
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： B23K03/06 , H01L21/00
CPC分类号： B23K3/0676
摘要： Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (l,2) for guiding the carrier across the solder bath, and means for urging the carrier along the tracks. The track has a first profiled region (l2,l9) for guiding a leading portion of the carrier down towards the surface of the solder, and a second profiled region (l6,20) longitudinally spaced from the first region, and laterially offset, for simultaneously guiding a trailing portion of the carrier down towards the surface of the solder, the profiles being substantially the same so that the carrier maintains its horizontal orientation whilst being moved vertically towards and away from the surface of the solder. The carrier moves on follower wheels which run along the tracks.
摘要翻译：用于将焊料施加到安装在水平取向的载体上的电气或电子部件的设备包括焊料槽，用于引导载体横过焊料槽的一对轨道（1,2）以及用于沿着轨道推动载体的装置。该轨道具有用于将载体的引导部分朝向焊料表面向下引导的第一成形区域（12,19）以及与第一区域纵向间隔开并且实质上偏移的第二成形区域（16,20）同时将载体的拖尾部分朝向焊料的表面向下引导，轮廓基本相同，使得载体保持其水平取向，同时垂直朝向和远离焊料表面移动。载体在沿轨道运行的从动轮上运动。

10. 发明公开

EP0252771A2 Soldering apparatus 失效
标题翻译： Lötgerät。
公开(公告)号：EP0252771A2
公开(公告)日：1988-01-13
申请号：EP87306187.3
申请日：1987-07-13
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： B23K3/06 , H01L21/00
CPC分类号： B23K3/0676
摘要： Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (l,2) for guiding the carrier across the solder bath, and means for urging the carrier along the tracks. The track has a first profiled region (l2,l9) for guiding a leading portion of the carrier down towards the surface of the solder, and a second profiled region (l6,20) longitudinally spaced from the first region, and laterially offset, for simultaneously guiding a trailing portion of the carrier down towards the surface of the solder, the profiles being substantially the same so that the carrier maintains its horizontal orientation whilst being moved vertically towards and away from the surface of the solder. The carrier moves on follower wheels which run along the tracks.
摘要翻译：用于将焊料施加到安装在水平取向的载体中的电气或电子部件的装置包括焊料槽，用于引导载体穿过焊料槽的一对轨道（1,2），以及用于沿轨道推动载体的装置。所述轨道具有用于将所述载体的引导部分朝向所述焊料的表面引导的第一成型区域（12,29）以及与所述第一区域纵向间隔开的第二成型区域（16,20），并且材料偏移，用于同时将载体的尾部向下引导朝向焊料的表面，所述轮廓基本上相同，使得载体保持其水平取向，同时垂直朝向和远离焊料的表面移动。载体在沿着轨道延伸的从动轮上移动。

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