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1. 发明授权

EP0212911B1 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：EP0212911B1
公开(公告)日：1991-07-31
申请号：EP86306060.4
申请日：1986-08-06
申请人： Dolphin Machinery Limited
发明人： Ciniglio, Alexander James
IPC分类号： B23K1/08 , B23K3/06
CPC分类号： B23K3/0653

2. 发明公开

EP0212911A2 Soldering apparatus 失效
标题翻译： Lötapparat。
公开(公告)号：EP0212911A2
公开(公告)日：1987-03-04
申请号：EP86306060.4
申请日：1986-08-06
申请人： Dolphin Machinery Limited
发明人： Ciniglio, Alexander James
IPC分类号： B23K1/08 , B23K3/06
CPC分类号： B23K3/0653
摘要： The present invention provides soldering apparatus wherein a rotatable shaft (3) which penetrates the surface of molten solder is surrounded by a substantially stationary tube (1) which also penetrates the solder suface, in which a substantially airtight seal (4a) is provided between the tube (1) and the shaft (3) above the solder surface. The formation of toxic dust is thus substantially reduced or almost eliminated. In accordance with a particular embodiment of the present invention, it is applied to a pump for solder, comprising a screw bladed impellor (2) mounted on the shaft (3), the blade (2) extending more than 360° around the drive shaft (3). It is preferred to pump solder through a nozzle, by pumping the solder up into the tube to form a constant head device, and feeding solder from the tube, through a conduit to the nozzle.
摘要翻译：本发明提供了一种焊接装置，其中贯穿熔融焊料表面的可旋转轴（3）被也穿过焊料表面的基本上固定的管（1）包围，其中基本上气密的密封（4a）管（1）和轴（3）。因此，有害灰尘的形成大大减少或几乎消除。根据本发明的特定实施例，它被应用于焊料泵，包括安装在轴（3）上的螺旋叶片式叶轮（2），叶片（2）围绕驱动轴延伸超过360度（3）。优选通过喷嘴将焊料泵送，通过将焊料向上泵送到管中以形成恒定的头部装置，并且将来自管的焊料通过导管供给到喷嘴。

3. 发明公开

EP0212911A3 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：EP0212911A3
公开(公告)日：1988-09-21
申请号：EP86306060
申请日：1986-08-06
申请人： Dolphin Machinery Limited
发明人： Ciniglio, Alexander James
IPC分类号： B23K01/08 , B23K03/06
CPC分类号： B23K3/0653
摘要： The present invention provides soldering apparatus wherein a rotatable shaft (3) which penetrates the surface of molten solder is surrounded by a substantially stationary tube (1) which also penetrates the solder suface, in which a substantially airtight seal (4a) is provided between the tube (1) and the shaft (3) above the solder surface. The formation of toxic dust is thus substantially reduced or almost eliminated. In accordance with a particular embodiment of the present invention, it is applied to a pump for solder, comprising a screw bladed impellor (2) mounted on the shaft (3), the blade (2) extending more than 360° around the drive shaft (3). It is preferred to pump solder through a nozzle, by pumping the solder up into the tube to form a constant head device, and feeding solder from the tube, through a conduit to the nozzle.
摘要翻译：本发明提供了焊接设备，其中穿过熔融焊料的表面的可旋转轴（3）被同样穿透焊接表面的基本上静止的管（1）包围，其中基本上气密的密封件（4a）设置在管（1）和轴（3）在焊料表面上方。因此有毒粉尘的形成大大减少或几乎消除。根据本发明的特定实施例，其应用于用于焊料的泵，该泵包括安装在轴（3）上的螺旋叶片式叶轮（2），叶片（2）围绕驱动轴延伸超过360° （3）。优选将焊料泵送通过喷嘴，通过将焊料泵入管中以形成恒定的头部装置，并且将焊料从管中通过导管馈送到喷嘴。

4. 发明公开

EP0139455A1 Soldering apparatus 失效
标题翻译： Lötapparat。
公开(公告)号：EP0139455A1
公开(公告)日：1985-05-02
申请号：EP84306171.4
申请日：1984-09-10
申请人： Dolphin Machinery Limited
发明人： Ciniglio, Alexander James , Tombs, Michael
IPC分类号： B23K1/08
CPC分类号： B23K3/0653
摘要： Soldering apparatus comprises a bath 1 of solder 2, a pump 11 for pumping solder through an applicator 3 and means for moving the applicator 3 to apply solder to an item to be soldered. In the embodiment described, the applicator 3 and impeller pump 11 are mounted on an arm 16 which is movable vertically. Solder is pumped from chamber 8 through conduits 9,10 into a lower chamber 6 and flows over lip 4 of upper chamber 5. Lower chamber 6 is larger than upper chamber 5 to distribute the solder flow evenly through upper chamber 5. The applicator 3 and arm 12 are pivotally mounted at 13, 15 to allow horizontal movement of the applicator. Preferably, the flow of solder is continuous and is pulsed to clear contaminants from the solder surface of chamber 5 after a soldering operation. The apparatus is particularly useful where a small cross-section upper chamber (Figure 3) is used to access confined areas, such as tags on relays, the flow of solder maintaining a constant soldering temperature.
摘要翻译：焊接装置包括焊料2的槽1，用于通过涂布器3泵送焊料的泵11和用于移动涂敷器3以将焊料施加到待焊接物品的装置。在所描述的实施例中，涂抹器3和叶轮泵11安装在可垂直移动的臂16上。焊料从腔室8通过导管9,10泵送到下部腔室6中并流过上部腔室5的唇部4.下部腔室6大于上部腔室5，以将焊料流动均匀地分布在上部腔室5中。涂敷器3和臂12可枢转地安装在13,15处以允许施加器的水平移动。优选地，焊料的流动是连续的并且在焊接操作之后被脉冲以清除来自腔室5的焊接表面的污染物。该装置在小截面上腔室用于进入限制区域（例如继电器上的标签）时特别有用，焊料流保持恒定的焊接温度。

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